QFP 0.3MM PITCH Search Results

Oscilloscope

Abstract: QFP 0.3mm pitch
Contextual Info: MicroGripperTM Oscilloscope Kit Oscilloscope Probe Adapter 0.8mm to 0.3mm Fine-Pitched Probing With Any Standard Oscilloscope w w w w w Connect to devices with lead pitches from 0.8mm to 0.3mm Use on a variety of QFP and SOIC packages Reduces chance of shorting with smallest wire tip diameter 0.08mm

0.3mm qfp

Contextual Info: MicroGripper 0.5-0.3mm MicroGripper Industry's smallest gripper simplifies testing of High-Performance Integrated Circuits w w w w w w w Used on a variety of QFP & SOIC chip packages Connects to devices with lead pitches as small as 0.3mm Reduces chance of shorting with smallest wire tip diameter 0.08mm

QFP 0.3mm pitch

Abstract: IPC-4101 345C BOX21151 IPC4553 SF-QFE80SC-L-01F
Contextual Info: RoHS COMPLIANT Emulates QFP package: 12.0mm body 14.0mm Tip to Tip 0.5mm pitch 13.2mm [0.520"] PAD DETAIL 0.5mm Top View 19 0.5mm =9.5mm 0.3mm 12.2mm [0.480"] 13.2mm [0.520"] 0.46mm±0.03mm dia. 0.1mm rad. 1.27mm typ. 2 6.4mm 0.250" 1 Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

Contextual Info: 1C 5 1 /5 3 SERIES S0P/QFP/QFN ICC /QF1(PLCC)/TCP FEATURES • • S ockets tor SOP, QFP and other surface-m ount 1C packages. Custom designs also available for m ulti-lead, fine-pitch and other special packages. SPECIFICATIONS PERFORMANCE Contact our Sales Department for detail. Specifications differ by the contact

Contextual Info: RN ICPAK Nuaent QFP Sockets REMARKS 3 Check the IC’s pin pitch before insertion. If the IC’s pin pitch is uneven, it might not fit into the socket or the 1C may become damaged. 4) Check that the contacts are clean before mount­ ing. Poor contact may result if the socket contacts

QFP lead pitch 0.3mm

Abstract: BGA and QFP Package mounting QFP 0.3mm pitch particle 0.3mm pitch BGA bga socket material for chip resistors 8 soic pcb footprint qfp 100 SOCKET BGA and QFP Package
Contextual Info: Socket Technologies High Performance IC Sockets And Test Adapters IP, Sep2009 Overview Company Overview – – – – – Over 5,000 products High Performance Adapters and Sockets Many Custom Designs Engineering – Electrical and Mechanical ISO9001:2000 Registration

SF-QFJ256SA-L-01

Contextual Info: Detail A 41.28mm 1.625 38.99mm 1.535 0.0200" pitch Index pin Pin 256 Pin 1 38.99mm 1.535 41.28mm 1.625 Top View 0.46mm±0.03mm dia. 1.27mm typ. 0.050 2 6.35mm 0.250 1 0.0200" pitch B Side View 1 DETAIL A Substrate: 1.59mm±0.18mm FR4/G10 or equivalent high temp material.

SF-QFJ256SC-L-01

Abstract: qfp 0.3mm pitch
Contextual Info: Detail A 41.28mm 1.625 38.99mm 1.535 0.0200" pitch Index pin Pin 256 Pin 1 38.99mm 1.535 41.28mm 1.625 Top View 0.46mm±0.03mm dia. 1.27mm typ. 0.050 2 6.35mm 0.250 1 0.0200" pitch B Side View 1 DETAIL A Substrate: 1.59mm±0.18mm FR4/G10 or equivalent high temp material.

QFP 0.3mm pitch

Abstract: SF-QFE256SB-L-01
Contextual Info: Detail A 39.37mm 1.550 37.08mm 1.460 0.5mm Top View 37.08mm 1.460 39.37mm 1.550 0.46mm±0.03mm dia. 1.27mm typ. 0.050 2 1 6.35mm 0.250 Side View 0.5mm. pitch B A DETAIL A 1 2 Substrate: 1.59mm±0.18mm FR4/G10 or equivalent high temp material. Pins: shell material- Brass; finish- 10µ" gold over

Contextual Info: REVISIONS NO. DESCRIPTION Was -B Typo 1 0.30 ±0.05 DATE BY 11/5/96 SDC 2.0 • See Note 6 Ø1.5 +0.1/-0.0 • See Note 1 1.75 A 4.0 R.5 (2) 7.5 • Note 6 1.6 (2) Bo 5.0 16.0 ±0.3 K1 6.4 (2) Ko A Ao 12.0 SECTION A-A R1.0 Typical Ø1.5 MIN Notes: 1. 10 sprocket hole pitch cumulative tolerance

QFP-128

Abstract: 0.3mm qfp CA-QFE128RB-M-S-01
Contextual Info: 17.3mm [0.681"] 13.49mm [0.531"] 0.5mm typ. 25.96mm [1.022"] 23.3mm [0.917"] 19.49mm [0.767"] 0.3mm [0.012"] Top View 19.56mm [0.770"] 1 Side View 8.61mm [0.339"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2

IC201

Abstract: IC201-1604-006 IC217-2404-007 IC248-1284-007 QFP 128 pin Socket IC201-2084-029 IC201-1204-017 IC201-1444-026 IC201-1444-034 IC217-1444-003
Contextual Info: IC200 to IC248 - Open Top Quad Flat Package QFP Specifications Part Number (Details) IC200 - 120 4 - 017 * - * 1,000MΩ min. at 500V DC or 1,000MΩ min. at 100V DC* Dielectric Withstanding Voltage: 100V AC for 1 minute or 500V AC for 1 minute or 700V AC for 1 minute*

IC201-0644-003

Abstract: IC201-1004-008 IC201-0644-003 socket 1004 170 IC201-0804-014 IC201-1004-050 IC200 IC201-0644-019 IC201-0644-040 IC201-0804-020
Contextual Info: IC200 to IC248 - Open Top Quad Flat Package QFP Specifications Part Number (Details) IC200 - 064 4 - 019 * - * 1,000MΩ min. at 500V DC or 1,000MΩ min. at 100V DC* Dielectric Withstanding Voltage: 100V AC for 1 minute or 500V AC for 1 minute or 700V AC for 1 minute*

qfp 0.3mm pitch

Abstract: CA-QFE128RB-L-S-01 SF-QFE128RB-L-01
Contextual Info: 17.3mm [0.681"] 13.49mm [0.531"] 0.5mm typ. 25.96mm [1.022"] 23.3mm [0.917"] 19.49mm [0.767"] Top View 0.3mm [0.012"] 19.56mm [0.770"] 1 8.61mm [0.339"] 3 10.52mm [0.414" plugged] 2 Side View 6.35mm [0.250"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

IC Package Names and Code Designations

Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
Contextual Info: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages

05Mm

Contextual Info: QFP Open Top IC200, IC201, IC218 Series CHARACTERISTICS Insulation Resistance Withstanding Voltage 1,000MQ minimum at 500VDC 500VAC RMS fo r one minute: IC200-2084-009, IC200-2084-010, IC201-1004-008 700VAC RMS fo r one minute: IC200-1284-001, IC 201-0804-005,

atmel 404

Contextual Info: REVISIONS NO. 2.0 ± 0.15 • See Note 6 0.30 ± 0.05 DESCRIPTION DATE BY 1.5 +0.1/-0.0 DIA 4.0 • See Note 1 A 2.00 MIN 1.75 2.5 0.3 R MAX. 20.2 ± 0.15 • See Note 6 Bo 45 ° 40.4 16.0 44.0 ± 0.3 Ko 10.0 A K1 Ao 0.5 Radius Typical 24.0 SECTION A-A 0.75 R

0.3mm qfp

Abstract: SF-QFE176SA-L-01F
Contextual Info: A RoHS COMPLIANT compatible target board land dimensions A< 0.935" B> 1.055" 25.3mm sqr. [0.995"] 23.7mm sqr. [0.935"] B 0.3mm pad [0.012"] 1 0.8mm pad [0.030"] 0.5mm typ. 0.46mm [0.018"] 1.27mm typ. [0.050"] 2 6.4mm ± 0.25mm [0.250" ± 0.010"] 4.7mm [0.187"]

Contextual Info: REVISIONS NO. 0.30 ± 0.05 DESCRIPTION DATE 2.0 • See Note 6 1.5 +0.1/-0.0 DIA • See Note 1 1.75 A 4.0 R.5 2 7.5 • Note 6 1.6 (2) Bo 5.0 16.0 ± 0.3 K1 6.4 (2) Ko A Ao 12.0 SECTION A-A 1.0 Radius Typical 1.5 MIN - All Dimensions in Millimeters Notes:

Contextual Info: Ø1.5+0.1/-0.0. 4.0 ±0.1 • See Note 1 0.30 ±0.05 1.75 ±0.1 2.0 ±0.1 Note 6 A R0.MAX. 11.5 ±0.1 Note 6 13.2 2 Bo 24.0 ±0.3 2.0 (2) K1 A R1.0 REF 13.4 (2) Ø1.5 MIN R0.5 Typical Ko Ao 45 ° TYP SECTION A-A 20.0 ±0.1 Ao = 16.50 mm Bo = 16.50 mm Ko = 1.55 mm

Contextual Info: REVISIONS Ø1.5 +0.1/-0.0 NO. 2.0 • See Note 6 DESCRIPTION DATE BY 1 SDC 4.0 • See Note 1 0.30 ± 0.05 A 1.75 R0.5 Typical R0.3 MAX 14.2 • See Note 6 13.2 2 B1 2.0 (2) 28.4 Bo 32.0 ± 0.3 Ko 24.0 A K1 0.75 R 13.4 (2) SECTION A-A Ao A1 0.20 ± 0.05

Contextual Info: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble

Contextual Info: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble

pitch 0.4mm BGA

Abstract: BGA and QFP Package mounting 0.4mm pitch BGA AI2O3 QFP lead pitch 0.3mm QFP 0.2mm pitch QFP 0.3mm pitch Noble resistor hybrid ic sc ka
Contextual Info: KA, SC hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOA’s original thick film technology