QFP 20X20 Search Results

Contextual Info: Quad Flat Package QFP DIP or PGA Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP or PGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek QFP Adapter Modules converts surface

AK32D300-QFP5X5

Abstract: AK32D600-QFP5X5 AK32D300-QFP7X7 AK32D600-QFP7X7 AK32D600-QFP7X7-A1-1 AK44D600-QFP .65mm AK44D600-QFP .8mm 10x10 AK44D900-QFP 1.0mm AK48D600-QFP .5mm 7x7 AK48D900-QFP .8mm 12x12
Contextual Info: ACCUTEK Quad Flat Package QFP DIP or PGA Adapters MICROCIRCUIT CORPORATION DIP or PGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek QFP Adapter Modules converts surface

SOP48

Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Contextual Info: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7

Contextual Info: QFP, PQFP, & TQFP IC51/IC53 Series FEATURES • Any kind of SMT type or IC package type QFP Available. • High reliability, durability and temperature range. • Custom made also available for high pin count and fine-pitch packages. CHARACTERISTICS I n s u la tio n R e s is ta n c e

ICP-080-3

Abstract: ICP-080-4 ICP-080-5 ICP-080-6 ICP-080-7 qfp 20x20 Package
Contextual Info: IC149 Series SMT QFP/TQFP - 80 Pins (20x20) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles: Solvent Durability: Allowable Torque (max.):

TQFP IC-Socket

Abstract: ICP-080-5 qfp 20x20 Package ICP-080-3 ICP-080-4 ICP-080-6 ICP-080-7 TQFP 80 socket
Contextual Info: IC149 Series SMT QFP/TQFP - 80 Pins (20x20) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles: Solvent Durability: Allowable Torque (max.):

IC149-80-117-B5

Abstract: ICP-080-6 ICP-080-4 21-B5 80151
Contextual Info: Click here to go back to socket part number overview IC149 Series SMT QFP/TQFP - 80 Pins (20x20) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.:

ICP-080-6

Abstract: ICP-080-7 qfp 20x20
Contextual Info: CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW IC149 Series SMT QFP/TQFP - 80 Pins (20x20) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles:

qfp 20x20 Package

Abstract: 128 QFP 20x20 SF-QFE128SF-L-01
Contextual Info: Emulates QFP package 20x20 mm body size 22x22 mm tip to tip PAD DETAIL 20.98mm [0.826"] sqr. 0.508mm 0.020" Ø 0.25mm [Ø 0.010"] 0.305mm 0.012" 19.20mm [0.756"] sqr. 0.50mm typ. [0.020"] Top View A 15.50mm [0.610"] 0.46mm [0.018"] compatible target board

Contextual Info: Q.F.P. SMT YAM AICHIIC149 Series SPECIFICATIONS • Better for Emulation probe purposes • Footprint designed for socket, can accept QFP packages without board design change CHARACTERISTICS Insulation Resistance Breakdown Voltage Contact Resistance Operating Temp. Range

PA-PGA181-02W

Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
Contextual Info: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for

ICP-100-4

Contextual Info: YAMAICHI ELECTRONICS INC bflE D m clcm S 5 3 b D0DDS7t 765 • Q.F.P. sm d _ YAMAICHI IC149 Series SPECIFICATIONS • Better for Emulation probe purposes • Footprint designed for socket, can accept QFP packages without board design change CHARACTERISTICS

MO-069

Contextual Info: YAMAICHI Q.F.P., P.QJ1R & L.C.C Test & Burn-In • SPECIFICATIONS • Any kind ofSMT type or IC package type SOP & QFP available. • High reliability, durability and temperature range. • Custom made also available for high pin count and fine-pilch IC packages.

1.27mm pitch zif socket 3M 21X21

Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
Contextual Info: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •

05Mm

Contextual Info: QFP Open Top IC200, IC201, IC218 Series CHARACTERISTICS Insulation Resistance Withstanding Voltage 1,000MQ minimum at 500VDC 500VAC RMS fo r one minute: IC200-2084-009, IC200-2084-010, IC201-1004-008 700VAC RMS fo r one minute: IC200-1284-001, IC 201-0804-005,

14X20

Contextual Info: QFP SMT Prototype Socket/Emulation Probes IC149 Series Pin Count CHARACTERISTICS Refer to Chart Below Refer to Chart Below 30mQ Max. 500mA Per Contact -25°C ~ +85°C 20 Cycles Insulation R esistance B reakdow n V oltage C ontact R esistance R ated C urrent

FPQ 208 0.5 10

Abstract: FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 FPQ-44-0
Contextual Info: QFP QUAD FLAT PACKAGE ORDERING PROCEDURE FPQ □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch

D431000

Abstract: INTEL 87C196 USER MANUAL D75304GF AIC6360Q d431000agw aic-6360 INTEL PLCC 68 dimensions AIC-6360Q d431000ag NEC uPD71054
Contextual Info: IC Test Clips Test Clip Selection Made Easy To select the Pomona IC Test Clip specifically designed for your chip, find the table for your chip type and follow the selection procedure outlined in this section. SSOP/QSOP JEDEC QFP Pomona IC Test Clips are uniquely designed to provide

94-PIN

Contextual Info: 94-PIN PLASTIC QFP 20x20 A B 71 72 F2 48 47 detail of lead end S C D Q 94 1 R 24 23 F1 G1 H I M G2 J P K S N S L M NOTE Each lead centerline is located within 0.15 mm of its true position (T.P.) at maximum material condition. ITEM A MILLIMETERS 23.2±0.4

qfp 20x20

Contextual Info: 120-PIN PLASTIC QFP FINE PITCH (20x20) A B 90 61 91 60 detail of lead end S C D R Q 120 31 1 30 F G J H I M K P S N S L M NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 22.0±0.2

20X20

Contextual Info: 144-PIN PLASTIC QFP FINE PITCH (20x20) A B 108 109 73 72 detail of lead end S C D R Q 144 1 37 36 F J G H I M K P S N S L M NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A

Contextual Info: 74-PIN PLASTIC QFP 20x20 A B F2 56 57 38 37 detail of lead end S C D Q 74 1 R 19 18 F1 G1 G2 J H I M K P S N S L M NOTE Each lead centerline is located within 0.20 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 23.2±0.4

Contextual Info: 144 PIN PLASTIC QFP FINE PITCH (20x20) A B 108 109 73 72 detail of lead end S C D Q 144 1 R 37 36 F G H I J M P K M N S L NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. S ITEM A MILLIMETERS

QFP JEDEC tray

Abstract: JEDEC TRAY QFP QFP 144 tray QFP 144 package tray
Contextual Info: HEAT PROOF 23.4 A' 17.55 25.2 QFP 20x20 2.7mm A PPE 7 100.8 135.9 UNIT : mm 23.4 25.4 17.8 279.4 315 322.6 SECTION A – A' 23.4 3.92 6.35 7.62 19.55 Applied Package Quantity pcs 144-pin Plastic QFP (Fine Pitch)(2.7mm thick) MAX. 60 Tray Material Heat Proof Temp.