QFP 64 LAND PATTERN Search Results

CA-QFE64SD-L-N-T-01

Abstract: MOD-518
Contextual Info: 2.350" 5 1.975" 1 0.100" Top View 2 0.285" assembled Surface-mountable leadless -L foot. Side View 0.443" 1 Target Board 64 Position QFP Land Pattern 2 (QFE64SD Foot Print Spec) 5 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad.

qfp 64 land pattern

Abstract: pal 007 PAL 007 a SF-QFE64SD-L-01
Contextual Info: 0.8mm typ. 0.095" typ. Top View SA 0.720" 0.530" typ. typ. 0.018" typ. 0.780" 0.780" 1 Side View 0.300" SK-MGA8/64A-01 2 0.130"Assembled SF-QFE64SD-L-01 0.440" Target Board 64 Position QFP Land Pattern QFE64SD Foot Print Spec 1 Material: 0.0625" ± 0.007" Fr4/G10

qfp 64 0.5 mm pitch land pattern

Abstract: CA-QFE64SD-L-Z-T-01 qfp 64 land pattern
Contextual Info: 2.350" 5 1.975" 1 0.100" Top View 2 1.078" assembled 0.285" assembled Surface-mountable leadless -L foot. Side View 0.443" 1 Target Board 64 Position QFP Land Pattern 2 (QFE64SD Foot Print Spec) 5 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad.

R50-E2Y2-24

Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
Contextual Info: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.

FP-X4KPG223-01

Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
Contextual Info: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators

land pattern for TSOP 2 86 PIN

Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS

2101dm

Abstract: qfp 64 land pattern
Contextual Info: Emulates QFP package: 14.0mm body 16.4mm/16.0mm tip to tip Top View 0.80mm pitch 15.37mm [0.605"] 13.84mm [0.545"] 15.37mm [0.605"] 0.47mm [0.018"] 1.27mm [0.050"] Side View 2 6.35mm [0.250"] 1.59mm [0.063"] 1 A 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

1.27mm pitch zif socket 3M 21X21

Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
Contextual Info: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •

CA-QFE64SD-L-Z-01

Abstract: qfp 64 0.5 mm pitch land pattern
Contextual Info: PROPRIETARY INFORMATION: Information contained in this drawing is confidential. Copying, distributing or use in any matter, other than that specified by IRONWOOD ELECTRONICS, INC., is strictly prohibited and may be unlawful. If you have received this drawing in error, please return to IRONWOOD ELECTRONICS, INC. at the address listed below.

SF-PLCC84-J-01

Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
Contextual Info: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.

SF-QFE64RB-L-01

Contextual Info: see Detail A 0.635" 0.535" 0.770" 0.870" 0.050" typ. 0.018"±0.001" dia. 2 0.250" 1 1.0mm pitch Detail A 0.050" 0.020" 1 2 0.0156" dia. Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel (min.).

QFN-64 footprint

Contextual Info: Transition Socket Specification 2008 Microchip Technology Inc. DS51194Q Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •

FR4 substrate

Abstract: CA-QFE64SB-L-S-01 SF-QFE64SB-L-01
Contextual Info: 0.8mm typ. 0.095" typ. 0.018" typ. 0.720" Adaptor Accommodates and emulates the following package: 0.530" 14.0mm 0.8mm 17.2mm 0.530" Top View not to scale with drawing 0.720" 0.780" 0.107" 0.295" 1 0.232" 2 0.550" 0.390 (plugged) 3 1 0.250" 0.8mm pitch Side View

DS51140

Abstract: PIC32 PICC-18 XLT28QFN4 DS51298
Contextual Info: Transition Socket Specification  2009 Microchip Technology Inc. DS51194R Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •

0510 land pattern

Contextual Info: 0.510" 0.428" Bottom View 0.018" 0.050" 2 0.250" Side View 1 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 2 Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel min. . Description: QFP surface mount emulator foot (leadless)

PA-PGA181-02W

Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
Contextual Info: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for

2029M

Contextual Info: 25.4mm [1.000"] SMT PAD DETAIL 0.020" 0.100" 1.00mm pitch QFP pin 1 20.29mm [0.799"] 30.48mm [1.200"] 25.37mm [0.999"] c 1992 I.E. 15.21mm [0.599"] -01W version 3 level, 0.64mm [0.025"] Sqr. WW pin 20.29mm [0.799"] 1 3.11mm 6.34mm [0.123"] [0.250"] 2 12.88mm

SF-QFE64RD-L-01

Abstract: qfp land pattern
Contextual Info: 0.930" 0.695" 1.0 mm Top View 0.018" 0.050" 2 0.250" 1 Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . compatible

Contextual Info: 0.930" 0.695" Top View 1.0 mm 0.018" 0.050" 2 0.250" 1 Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . compatible

DM 0565

Abstract: SF-QFE64RC-L-01
Contextual Info: see Detail A 0.665" 0.565" 0.800" 0.900" 0.050" typ. 0.018"±0.001" dia. 2 0.250" 1 1.0mm pitch Detail A 0.050" 0.020" 1 2 0.0156" dia. Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel (min.).

tqfp 64 pcb land pattern

Abstract: TQFP64 land package qfp 64 land pattern qfp land pattern
Contextual Info: 35.56mm [1.400"] 13.00mm [0.512"] 8.94mm [0.352"] C5 QFP pin 1 SSI B1-PLCC 27.94mm [1.100"] 1 7.80mm [0.307"] 2 0.50mm typ. [0.020"] 1 C1 2 1 C2 2 1 2 1 C3 2 C4 Top View NOTE: Device specific pin mapping. See PC-TQFP/PL68-P-01 Map document for details 1 1.59mm

FR4 substrate

Abstract: CA-QFE64SB-M-S-01
Contextual Info: 0.780" 0.018" typ. 0.720" 0.8mm typ. Top View 0.095" typ. 1 3 0.300" 2 Side View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Substrate: 0.125"±0.007" FR4/G10 or equivalent high temp material. Non-clad

CA-QFE64S-M-S-01

Contextual Info: 0.780" 0.018" typ. 0.720" 0.530" 0.8mm typ. 0.095" typ. Top View 0.720" 0.780" 1 0.300" 3 0.237" Side View 2 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Substrate: 0.125"±0.007" FR4/G10 or equivalent high

PHD64

Abstract: land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14
Contextual Info: PowerPAD - A Method To Create Thermally Enhanced Plastic Package Solutions for Semiconductors Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and Buford Carter Texas Instruments, Incorporated Dallas, Texas f = switching frequency in Hz N = number of gates switched/clock cycle