QFP-128 FOOTPRINT Search Results

FPQ-128-0

Contextual Info: PA1048C-128 Data Sheet 128 pin QFP socket/28 pin DIP 0.6" plug Supported Device/Footprints Adapter Wiring Using this adapter several 128 pin Lattice devices in QFP packages can be programmed on 28 pin DIP programmers. The following chart shows the connections from the QFP device

Contextual Info: Part No. 96-128M80 - QFP to PGA Adapter for EIAJ 128 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-128M80 - QFP to PGA Adapter for EIAJ 128 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. •Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-128M80 - QFP to PGA Adapter for EIAJ 128 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-128M80 - QFP to PGA Adapter for EIAJ 128 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-128M80 - QFP to PGA Adapter for EIAJ 128 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

MIL-T-10727

Contextual Info: Part No. 96-128M80 - QFP to PGA Adapter for EIAJ 128 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Pomona Model 5772 & 5772-2 128 Pin EIAJ QFP Test Clip 0.80 mm Lead Pitch These new test clips provide the user with an easy means to connect instrumentation to the fine pitch Plastic QFP chip leads. • Interfaces with high density EIAJ QFP surface mount chip leads.

GP62

Abstract: GP15 126-150 GP61 GP22 GP65 gp6*5 GP10 SA10 SA12
Contextual Info: APPLICATION NOTE 6.15 FDC37C68x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C68x and the FDC37C93x. The FDC37C68x is a 128 pin QFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C68x and FDC37C93x data

GP11

Contextual Info: APPLICATION NOTE 6.15 FDC37C68x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C68x and the FDC37C93x. The FDC37C68x is a 128 pin QFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C68x and FDC37C93x data

QFP 128 pin Socket

Abstract: QFP-128 HS2000EPI61HE qfp128 QFP-128 20 x 14 pad
Contextual Info: H8S/2655 Group QFP-128 User System Interface Cable HS2655ECH61H User’s Manual Renesas Microcomputer Development Environment System Rev.4.00 2004.1.29 Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products

HCU04

Abstract: HS2000EPI61HE HS2633ECH61H QFP-128 NQPACK128RD HS2633EPI61HE
Contextual Info: H8S/2633 Group QFP-128 User System Interface Cable HS2633ECH61H User’s Manual Renesas Microcomputer Development Environment System Rev.5.00 2004.1.29 Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products

128-PIN

Abstract: 1410Y
Contextual Info: 128 PIN QFP PACKAGE OUTLINE - 3.2 MM FOOTPRINT A Min Nominal Max Remarks - - 3.4 Overall Package Height A1 0.05 - 0.5 Standoff A2 2.55 - 3.05 Body Thickness D 23.00 23.20 23.40 X Span D1 19.90 20.00 20.10 X Body Size E 17.00 17.20 17.40 Y Span E1 13.90 14.00

lead frame

Contextual Info: 128 PIN QFP PACKAGE OUTLINE - 3.9 MM FOOTPRINT A Min Nominal Max Remarks - - 3.4 Overall Package Height A1 0.05 - 0.5 Standoff A2 2.55 - 3.05 Body Thickness D 23.70 - 24.10 X Span D1 19.90 - 20.10 X Body Size E 17.70 - 18.10 Y Span E1 13.90 - 14.10 Y Body Size

rtl8139b

Abstract: RTL8129 RTL8139BL Realtek RTL8029 AS realtek rtl8129 realtek uwb mA759 RTL8029 realtek rtl8029 realtek rtl8139 programming
Contextual Info: RTL8139B L Preliminary REALTEK SINGLE CHIP FAST ETHERNET CONTROLLER WITH POWER MANAGEMENT RTL8139B(L) 1. Features: l 128 pins QFP/LQFP environment only. Both need 5-volt l Integrated Fast Ethernet MAC, Physical chip working voltage as power source. l and transceiver in one chip

Contextual Info: 128 PIN QFP/QN PACKAGE OUTLINE 3.9 MM FOOTPRINT D D1 3 e b 2 E1 3-D VIEW E 3 5 D1/4 E1/4 R1 TOP VIEW R2 SEE DETAIL "A" 0.25 GAUGE PLANE A2 0°-7° C A SEATING PLANE c L 4 L1 ccc C SIDE VIEW DETAIL "A" (SCALE: 3/1) A1 Min Nominal Max Remarks A ~ ~ 3.40 Overall Package Height

bd556

Abstract: 68hc705k1 MC68HC05SC21 68hc705j2 68hc05 test board 68HC705E6 M68HC05P9EM pinout of motorola 68hc05 programmer mc68hc705b16 68HCL05
Contextual Info: Single–Chip Microcontrollers CSIC In Brief . . . Page M68HC05 CSIC Family . . . . . . . . . . . . . . . . . . . . . . . . . 2.5–2 M68HC08 Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5–13 Development Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5–14

SERIRQ

Abstract: cross PD6
Contextual Info: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and FDC37C93x data sheets for more information.

BR931

Abstract: motorola mca MCA3200ETL MCA6200ETL MCA750ETL H4C018 Motorola Master Selection Guide H4C161 wirebond die flag lead frame an1512
Contextual Info: Semicustom Application Specific Integrated Circuits In Brief . . . Motorola supports strategic programs and co–development partnerships to accelerate the availability of advanced processes CMOS, BiCMOS, Bipolar , packaging and CAD technology. Extensive research,

ax 2008 lqfp 48

Abstract: GAd 1501 UPD70* JTAG RENESAS flash memory package suffix SENSOR IC CHIP 0443 16 PIN suffix number RENESAS microcontroller usb booster PG-FP5 TK-78K0 QB-V850MINI
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

MEC1609

Abstract: SCH5147 os81092 OS81050 mec1308 OS81110 HYC5000 OS81060 SIO1028 SCH5627
Contextual Info: CORPORATE PRODUCT OVERVIEW 2010 Providing Mixed-Signal IC solutions that enable connectivity and networking in consumer electronics, automotive infotainment, PC and industrial applications PC SYSTEM + MOST I/O CONTROLLERS USB ETHERNET Digital Cameras, HDTVs, Set-top Boxes,

sd3-75

Abstract: FDC37C67X FDC37C93X cross PD6 GP20 GP25 SA10 SMSC Corporation cross reference
Contextual Info: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and

LQFP-48 footprint

Abstract: Antilock and Braking Systems using CAN protocol 9S12P64 LQFP-48 9S12P128 9S12P96 S12P DEMO9S12PFAME LFSMPBS12PFM LQFP PACKAGE footprint
Contextual Info: 16-bit Microcontrollers S12P Family Pushing the boundaries of 16-bit CAN microcontrollers Overview The S12P family of CAN microcontrollers S12P Family Block Diagram MCUs offers the enhanced features of 16-bit performance but at the value of SCI Up to 6 KB RAM

FP-X4KPG223-01

Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
Contextual Info: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators