QFP-256 PACKAGE Search Results

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC To Top / Package Lineup / Package Index FPT-256C-A07 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-256C-A07 256-pin ceramic QFP (FPT-256C-A07)

296-0025

Abstract: Aluminum nitride QFP
Contextual Info: QUAD L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-C02 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C02 256-pin ceramic QFP (FPT-256C-C02)

Contextual Info: QUAD L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-C01 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-256C-C01 256-pin ceramic QFP

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-A07 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-256C-A07 256-pin ceramic QFP (FPT-256C-A07) 10.50(.413)MAX 39.64±0.30 SQ (1.561±.012)

nitride

Contextual Info: QUAD FLAT L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-C03 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C03 256-pin ceramic QFP (FPT-256C-C03)

FPT-256P-M06

Contextual Info: QUAD FLAT L-LEADED PACKAGE 256 PIN PLASTIC FPT-256P-M06 256-pin plastic QFP Lead pitch 0.40mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold FPT-256P-M06 256-pin plastic QFP (FPT-256P-M06) 30.60±0.20 SQ (1.205±.008)

FPT-256P-M06

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M06 256-pin plastic QFP Lead pitch 0.40 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-256P-M06 256-pin plastic QFP (FPT-256P-M06)

C1995

Abstract: 256 pin ceramic Quad flat package 256-PIN
Contextual Info: QUAD FLAT L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-A07 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-256C-A07 256-pin ceramic QFP (FPT-256C-A07) 10.50(.413)MAX 39.64±0.30 SQ (1.561±.012) 2.10(.083) 36.00±0.30 SQ

Contextual Info: QUAD L-LEADED PACKAGE 256 PIN CERAMIC FPT-256C-C01 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-256C-C01 256-pin ceramic QFP (FPT-256C-C01) 3.80 (.150) MAX

FPT-256P-M09

Contextual Info: QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M09 EIAJ code : P-FQFP256-28 x 28-0.40 256-pin plastic QFP FPT-256P-M09 256-pin plastic QFP (FPT-256P-M09) Lead pitch 0.40 mm Package width × package length 28.0 × 28.0 mm Lead shape

yamaichi carrier

Contextual Info: IC198 Series SMT Quad Flat Package (QFP) - 256 pins 256 Pins QFP - (52 x 76 pins) 0.5 mm pitch Socket Dimensions Specifications Current Rating: Rated Voltage: Contact Resistance: 0.3 A 50V DC 30mΩ max. at 10mA and 20mV max. Insulation Resistance: 500MΩ min. at 500V DC

A2 diode

Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
Contextual Info: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5

QFP Package 128 lead .5mm

Abstract: QFP 128 lead .5mm BGA reflow guide SI-SX72-ACQ256SFG484 A54SX72A-CQ256 BGA 256 PACKAGE thermal resistance A54SX72A-FG484
Contextual Info: 3.16mm [0.124"] 3.54mm [0.139"] 1 39.3mm [1.547"] 41.9mm [1.650"] 32.23mm [1.269"] 41.9mm [1.650"] 27mm 15.67mm [0.617"] DETAIL A Lead coplanarity 0.005" max. Side View 0.5mm Description: BGA to QFP package converter 484 position BGA surface mount GHz BGA socket 1.00mm centers, 26X26 array, 27X27mm body to 256 QFP, 0.5mm

7404

Abstract: MQFP Tray 28 QFP JEDEC tray 32MM
Contextual Info: UNIT : mm HEAT PROOF 7 PPE A' 32.8 37.02 74.04 30.93 MQFP 28 x 28 3.2mm 135.9 A 32.8 37.02 27.93 259.14 315.0 322.6 SECTION A-A' 32.8 3.82 6.35 7.62 27.3 Applied Package 208-pin Plastic QFP (Fine Pitch) (3.2mm thick) 256-pin Plastic QFP (Fine Pitch) (3.2mm thick)

Contextual Info: QUAD L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC To Top / Package Lineup / Package Index FPT-256C-C01 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic

FPT-256C-C02

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-C02 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C02

FPT-256C-C03

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC FPT-256C-C03 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-256C-C03

256 pin ceramic Quad flat package

Abstract: Aluminum nitride QFP
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC To Top / Package Lineup / Package Index FPT-256C-C02 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic

256 pin ceramic Quad flat package

Abstract: FPT-256C-C03
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC To Top / Package Lineup / Package Index FPT-256C-C03 256-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic

FPT-256P-M09

Abstract: QFP PACKAGE thermal resistance
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M09 256-pin plastic QFP Lead pitch 0.40 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type

SOP48

Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Contextual Info: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7

FPT-256P-M04

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M04 256-pin plastic QFP Lead pitch 0.50 mm Package width x package length 40 × 40 mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 0.50 mm

Contextual Info: QUAD FLAT L-LEADED PACKAGE 256 PIN PLASTIC FPT-256P-M04 256-pin plastic QFP Lead pitch 0.50mm Package width x package length 40 × 40mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 0.50mm Target use For hybrid ICs FPT-256P-M04

C4228

Contextual Info: 7.15mm [0.281"] A1 7.15mm [0.281"] 26X26X5 + 8X8 ARRAY 25mm 39.3mm [0.984"] [1.547"] 41.9mm [1.650"] 1mm [0.039"] Top View 41.9mm [1.650"] DETAIL A Lead coplanarity 0.005" max. 2.78mm [0.109"] 0.5mm Side View Description: BGA to QFP package converter 484 position BGA surface mount pads to 256 QFP, 0.5mm gull-wing leads. Pin assignment as per Actel requirements.