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    RADIAN HEATSINKS Search Results

    RADIAN HEATSINKS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    U77E11D82001 Amphenol Communications Solutions 1X1 SPF CAGE W/ HEATSINK Visit Amphenol Communications Solutions
    U77E11E82001 Amphenol Communications Solutions 1X1 SPF CAGE W/ HEATSINK Visit Amphenol Communications Solutions
    U77E11F82001 Amphenol Communications Solutions 1X1 SPF CAGE W/ HEATSINK Visit Amphenol Communications Solutions
    UPA2708TP-E1-AZ Renesas Electronics Corporation Switching N-Channel Power MOSFET, HSOP, /Embossed Tape Visit Renesas Electronics Corporation
    UPA2701TP-E2-AZ Renesas Electronics Corporation Switching N-Channel Power MOSFET, HSOP, /Embossed Tape Visit Renesas Electronics Corporation

    RADIAN HEATSINKS Datasheets Context Search

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    Radian Heatsinks

    Abstract: Chomerics T710 heatsink CS2290 IXF1110 Intricast Company
    Text: 25mm Round Pin BGA Heatsink / 5-Pack home > shop > additional heatsinks > cs2290 Submit Query 25mm Round Pin BGA Heatsink / 5-Pack CS2290 Thermal Resistance °C/W Heatsink Size Weight (W x L x H) oz. 200 lfm 400 lfm 600 lfm 25.0 mm x 25.0 mm x 9.8 mm (0.2)


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    PDF cs2290 IXF1110 10-port CS2290: com/cs2290 html5/22/2005 Radian Heatsinks Chomerics T710 heatsink CS2290 Intricast Company

    LOCTITE 384

    Abstract: ECCOBOND 281 melcor 705TC Emerson Cuming tellurex abletherm E629 E710 mastersil
    Text: ATE-A2 Cooling High Density, High Power Pin Electronics TEST AND MEASUREMENT PRODUCTS Overview With IC’s ever-increasing speeds and pin counts, the power density inside Automated Test Equipment is also increasing. Keeping the high-speed pin drivers and other


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    Radian Heatsinks

    Abstract: Intricast Company Electrocube
    Text: Stacked-Ceramic Caps Brave High Temperatures By Scott Harris, Advanced Products Marketing Manager, AVX, Myrtle Beach, South Carolina A series of stacked-ceramic capacitors specially designed for SMPSs features the thermal performance of conventional ceramics without


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    TB-093

    Abstract: Heat Technology
    Text: Technical Brief High-Speed Board Design Advisor Thermal Management Introduction This document contains a step-by-step tutorial and checklist with a best-practice set of step-by-step guidelines to support users to design and review their thermal design with Stratix II GX FPGAs.


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    T5 LAMP SCHEMATIC

    Abstract: Thermagon thermaflo 21D0 design ideas BL-2000 C2511B acrylic Led light schematic silver band gap Aavid Thermalloy 6063
    Text: APPLICATION NOTE 02 Bright Lights. Bright Ideas. TM THERMAL MANAGEMENT OF LAMINA HIGH BRIGHTNESS LIGHT ENGINES Solid state lighting, in the form of light emitting diodes LEDs , has many advantages over traditional light sources, such as longer life, new form factors, and higher efficiencies. These advantages make LEDs attractive for


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    FC-BGA

    Abstract: T0812012 daewon tray
    Text: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.


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    PDF AN-659-1 FC-BGA T0812012 daewon tray

    KS-886H

    Abstract: Kostat tray
    Text: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive


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    PDF AN-657-1 KS-886H Kostat tray

    datasheet of Z40-12.7B heat sink

    Abstract: UB35-25B Chomerics of Z40-12.7B heat sink Z3512 EP2S15 JESD51-9 T412 laird gasket JESD51-X
    Text: Thermal Management for FPGAs December 2009 AN-358-2.0 Introduction As IC process geometries shrink and FPGA densities increase, managing power becomes increasingly difficult. The dilemma for design groups is how to fit in all the functions the market demands without exceeding power budgets. Although power


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    PDF AN-358-2 datasheet of Z40-12.7B heat sink UB35-25B Chomerics of Z40-12.7B heat sink Z3512 EP2S15 JESD51-9 T412 laird gasket JESD51-X

    IPC-SM-780

    Abstract: No abstract text available
    Text: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.


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    PDF Glossary-11 IPC-SM-780

    CERAMIC PIN GRID ARRAY wire lead frame

    Abstract: IPC-SM-780 nickel corrosion electroplating
    Text: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.


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    PDF Glossary-11 CERAMIC PIN GRID ARRAY wire lead frame IPC-SM-780 nickel corrosion electroplating

    UC3875 ZVS design

    Abstract: resonant full bridge schematic U-136A Unitrode uc3875 transformer tank design calculation power transformer tank calculation transformer less power supply 12 volt 3A DESIGN WITH UC3875 UC3875 dc/dc converter UC3875
    Text: U-136A APPLICATION NOTE PHASE SHIFTED, ZERO VOLTAGE TRANSITION DESIGN CONSIDERATIONS and the UC3875 PWM CONTROLLER BILL ANDREYCAK ABSTRACT This Application Note will highlight the design considerations incurred in a high frequency power supply using the Phase Shifted Resonant PWM control technique. An overview of this switching technique including


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    PDF U-136A UC3875 00V/Div 100mV/Div UC3875 ZVS design resonant full bridge schematic U-136A Unitrode uc3875 transformer tank design calculation power transformer tank calculation transformer less power supply 12 volt 3A DESIGN WITH UC3875 UC3875 dc/dc converter

    Loctite 3873

    Abstract: T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X
    Text: Thermal Management for FPGAs Thermal Management for FPGAs AN-358-3.0 Application Note This application note provides guidance on thermal management of Altera devices and helps you determine the thermal performance for your application. The factors you must consider in evaluating heat dissipation include evaluating the


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    PDF AN-358-3 Loctite 3873 T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X

    C6000

    Abstract: JESD51-2 JESD51-3 JESD51-7 TMS320C6000 grafoil heat spreading
    Text: Application Report SPRAAL9 – May 2007 Thermal Considerations for TMS320DM64xx, TMS320DM64x, and TMS320C6000 Devices Kimberly Wells .


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    PDF TMS320DM64xx, TMS320DM64x, TMS320C6000 TMS320C6000TM C6000 JESD51-2 JESD51-3 JESD51-7 grafoil heat spreading

    UC3875 ZVS design

    Abstract: resonant full bridge schematic U-136A Unitrode uc3875 DESIGN WITH UC3875 UC3875 dc/dc converter SEM-700 slope in uc3875 SLUA107 UC3875
    Text: U-136A APPLICATION NOTE PHASE SHIFTED, ZERO VOLTAGE TRANSITION DESIGN CONSIDERATIONS and the UC3875 PWM CONTROLLER BILL ANDREYCAK ABSTRACT This Application Note will highlight the design considerations incurred in a high frequency power supply using the Phase Shifted Resonant PWM control technique. An overview of this switching technique including


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    PDF U-136A UC3875 UC3875 ZVS design resonant full bridge schematic U-136A Unitrode uc3875 DESIGN WITH UC3875 UC3875 dc/dc converter SEM-700 slope in uc3875 SLUA107

    DM644x

    Abstract: JESD51-2 JESD51-3 JESD51-7
    Text: Application Report SPRAAE4A – April 2008 TMS320DM644x Thermal Considerations . Device Applications ABSTRACT As IC components become more integrated and more complex, the challenge of


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    PDF TMS320DM644x DM644x DM644x JESD51-2 JESD51-3 JESD51-7

    fairchild AG33

    Abstract: No abstract text available
    Text: Intel FM2224 24-Port 10G Ethernet L2 Switch Chip Data Sheet July, 2008 Revision 2.3 Intel® FM2224 24-Port 10G Ethernet L2 Switch Chip Data Sheet Legal INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL


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    PDF FM2224 24-Port M5450 fairchild AG33

    Westinghouse SCR handbook

    Abstract: n41 transformer core 171 100khz KF 13003 calculation of transformer differential relay RET 670 Allen-Bradley 1336 13001 TRANSISTOR thomas and betts wt117 KF 13003 F 230v to 5v circuit using 13003 transistor ALLEN-BRADLEY 1395 Burden RESISTOR
    Text: 1336 IMPACT Adjustable Frequency AC Drive 0.37 - 597 kW 0.5 - 800 HP Version 1.xx - 4.xx User Manual Important User Information Solid state equipment has operational characteristics differing from those of electromechanical equipment. “Safety Guidelines for the Application,


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    0xEDB88320

    Abstract: No abstract text available
    Text: Intel Ethernet Switch FM4000 24-Port 10G Ethernet L2/L3/L4 Switch/Router Datasheet May 2013 Revision 2.6 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


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    PDF FM4000 24-Port VTT08: VTT09: VTT10: VTT22: VTT23: VTT24: FM4105 0xEDB88320

    Untitled

    Abstract: No abstract text available
    Text: Intel Ethernet Switch FM4000 24-Port 10G Ethernet L2/L3/L4 Switch/Router Datasheet April 7, 2011 Revision: 2.4 Intel® Ethernet Switch FM4000 24-Port 10G Ethernet L2/L3/L4 Switch/Router Table of Contents 1. Introduction . 13


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    PDF FM4000 24-Port VTT21: VTT19: VTT22: VTT20: VTT23:

    hecs 450

    Abstract: hecs 50 transistor w5c Liquid Rotor Resistor Starter SGCT "symmetrical gate commutated thyristor" UPS wiring how to control firing angle in thyristor SCR firing inverter circuit LMT 393 N
    Text: PowerFlex 7000 Medium Voltage AC Drive Firmware Version 7.xxx Technical Data Important User Information Solid-state equipment has operational characteristics differing from those of electromechanical equipment. Safety Guidelines for the Application, Installation and


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    PDF 7000-TD002B-EN-P 7000-TD002A-EN-P hecs 450 hecs 50 transistor w5c Liquid Rotor Resistor Starter SGCT "symmetrical gate commutated thyristor" UPS wiring how to control firing angle in thyristor SCR firing inverter circuit LMT 393 N

    Unitrode uc3875

    Abstract: U-136A UC3875 ZVS design resonant full bridge schematic slope in uc3875 U136A phase shifted zero voltage UC 3875
    Text: U-136A UNITRODE APPLICATION NOTE PHASE SHIFTED, ZERO VOLTAGE TRANSITION DESIGN CONSIDERATIONS and the UC3875 PWM CONTROLLER BILL ANDREYCAK ABSTRACT This Application Note will highlight the design considerations incurred in a high frequency power supply us­


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    PDF U-136A UC3875 10OV/Div 100mV/Div Unitrode uc3875 U-136A UC3875 ZVS design resonant full bridge schematic slope in uc3875 U136A phase shifted zero voltage UC 3875

    full bridge inverter 500khz square wave

    Abstract: simple filter turns square waves into sine waves full bridge unipolar inverter pwm
    Text: PWM LO W P A S S FIL T E R IN G APPLICATION NOTE 32 P U L S E WIDTH M ODULATION AM PLIFIER I I C I O T E C H I O l l i V h ttp ://WWW.APEXMICROTECH.COM 800 546-APEX (800) 546-2739 1.0 INTRODUCTION Pulse width modulation (PWM) amplifiers require low pass filtering


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    PDF 546-APEX 150db full bridge inverter 500khz square wave simple filter turns square waves into sine waves full bridge unipolar inverter pwm

    MC14499P application note

    Abstract: wiring diagram audio amplifier ic 6283 era 555 MOTOROLA delta dvp plc communication cable wiring diagram siemens transistor manual 68000 MC68681 PROGRAMMING EXAMPLE DSP56200 SP5615 CORDED MOTOROLA CT2 Solid State Optoelectronics Data Book 1977
    Text: Selection Guides Data Sheets Evaluation Kits Application Notes and Product Literature Glossary Handling and Design Guidelines Quality and Reliability Mechanical Data DATA CLASSIFICATION Product Preview This heading on a data sheet indicates that the device is in the formative stages or under


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    induction cooker fault finding diagrams

    Abstract: TC227 compressor catalogue Vernitron TRANSDUCER b2 str 1265 smps power supply circuit of tv ADC0804-1CD TC225 tesla MAa 741 SPICE model NTC Inrush Current Limiters Thermistor XR558CP
    Text: BOOK IC11 LINEAR PRODUCTS page Selection guide Functional in dex. 5 Numerical in d e x .


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