RE20 Search Results

CUI STACK

Abstract: RE20S RE20V 390K
Contextual Info: RE20S  C U I Stack, Inc., 1997 RE20V Panel Cutout/PCB Layout 4 L 7 Ø6.0 Panel Cutout/PCB Layout 9.5 Panel Cutout Ø6.0 Ø9.2 11 13 Ø9.2 M9 8-Ø1 8 4 3 2 M9 1 L 12 L ELECTRICAL 1. Input Power: 5.0 VDC ±5% @ 7mA 2. Output Voltage: H = Vcc- 0.4V L ≤ 0.4V

Contextual Info: Prototyping Board RE200-LF - EPOXY fibre-glass FR4 1.5 mm single-sided 35 µm CU - hot air leveling HAL-leadfree - 38 x 61 single-hole conductor 2.2 mm Ø - hole spacing 2.54 x 2.54 mm - hole dia 1.0 mm - size 100 x 160 mm

RE201-LFDS

Contextual Info: HF-Platine RE201-LFDS - fibre de verre époxyde FR4 1,5 mm, double face 35 µm CU NPTH - étamé à chaud (HAL-leadfree) - 34 x 54 pastilles 2,0 mm Ø - pas 2,54 x 2,54 mm - perforation 1,0 mm - connecteur 32/ 64/ 96-pôles - DIN 41612 type C - le côé à équiper est totalement plaqueé de CU

RE200-HPDS

Contextual Info: Prototyping Board RE200-HPDS - SRBP-paper FR2 1.5 mm double-sided 35 µm CU npth - organic soldering protection (OSP) - 38 x 61 single-hole conductor 2.2 mm Ø - hole spacing 2.54 x 2.54 mm - hole dia 1.0 mm - size 100 x 160 mm

hart

Contextual Info: HF-Platine RE201-HPDS - Phenolharz-Hartpapier FR2 1,5 mm, zweiseitig 35 µm CU nicht durchkontaktiert - organischer Oberflächenschutz (OSP) - 34 x 54 Lötinseln 2,0 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm - Steckverbinder 32/ 64/ 96-polig DIN 41612 Bauform C

RE201-LFDS

Contextual Info: HF-Platine RE201-LFDS - Epoxyd FR4 1,5 mm, zweiseitig 35 µm CU nicht durchkontaktiert - heißverzinnt (HAL-leadfree) - 34 x 54 Lötinseln 2,0 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm - Steckverbinder 32/ 64/ 96-polig DIN 41612 Bauform C

RE200

Contextual Info: 2002-05-13 PRODUKTINFORMATION Vi reserverar oss mot fel samt förbehåller oss rätten till ändringar utan föregående meddelande ELFA artikelnr 48-320-02 Labbkort RE200 HP 48-320-10 Labbkort RE200 EP

Contextual Info: HF-Platine RE201-HPDS - résine phénolplaste FR2 1,5 mm, double face 35 µm CU - Protection organique de la surface OSP - 34 x 54 pastilles 2,0 mm Ø - pas 2,54 x 2,54 mm - perforation 1,0 mm - connecteur 32/ 64/ 96-pôles - DIN 41612 type C - le côé à équiper est totalement plaqueé de CU

RE201-LFDS

Contextual Info: HF-board RE201-LFDS - EPOXY fibre-glass FR4 1.5 mm double-sided 35 µm CU npth - hot air leveling (HAL-leadfree) - 34 x 54 single-hole conductor 2.0 mm² - hole spacing 2.54 x 2.54 mm - hole dia 1,0 mm - connector 32/ 64/ 96-channel - DIN 41612 type C - the component side is totally laminated by copper

Contextual Info: Laborkarte RE200-LFDS - Epoxyd FR4 1,5 mm, zweiseitig 35 µm CU nicht durchkontaktiert - heißverzinnt (HAL-leadfree) - 38 x 61 Lötinseln 2,2 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm

modo

Contextual Info: Placa de circuito impreso HF RE201-HPDS - papel endurecido con resina fenolada FR2 1,5 mm, por dos lados 35 µm CU npth - protección orgánica de la superficie (OSP) - 34 x 54 nodos de soldadura Ø 2,0 mm - trama de agujeros 2,54 x 2,54 mm - diámetro de los agujeros 1,0 mm

RE200-HPDS

Contextual Info: Laborkarte RE200-HPDS - Phenolharz-Hartpapier FR2 1,5 mm, zweiseitig 35 µm CU nicht durchkontaktiert - organischer Oberflächenschutz (OSP) - 38 x 61 Lötinseln 2,2 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm

Contextual Info: Prototyping Board RE200-HP - SRBP-paper FR2 1,5 mm single-sided 35 µm CU - organic soldering protection OSP - 38 x 61 single-hole conductor 2,2 mm Ø - hole spacing 2,54 x 2,54 mm - hole dia 1,0 mm - size 100 x 160 mm

RE200-HPDS

Contextual Info: Carte d´Expérimentation RE200-HPDS - résine phénolplaste FR2 1,5 mm, double face 35 µm CU - Protection organique de la surface OSP - 38 x 61 pastilles 2,2 mm Ø - pas 2,54 x 2,54 mm - perforation 1,0 mm - dimensions 100 x 160 mm

RE20S

Contextual Info: RE20S  C U I Stack, Inc., 1997 RE20V Panel Cutout/PCB Layout Ø6.0 8 PC Board 15 8 6 9.5 Panel Cutout Ø9.2 M9 15.0 11 13 Ø9.2 M9 8.2 Ø6.0 Ø6.0 24.5 2.5x3 RE20C Panel Cutout/PCB Layout 9.5 9 L 3 12 19.2 RE20F Ø3.2 1.5 8 18.0 11.5 12 8-Ø1 L 8-Ø1 8

RE200

Abstract: fr4 datasheet FR4 data sheet RE200-LF
Contextual Info: Tarjeta experimental RE200-LF - epóxido FR4 1,5 mm, por un lado 35 µm CU - estañado en caliente HAL-leadfree - 38 x 61 nodos de soldadura Ø 2,2 mm - trama de agujeros 2,54 x 2,54 mm - diámetro de los agujeros 1,0 mm - tamaño 100 x 160 mm

re200

Contextual Info: Laborkarte RE200-HP - Phenolharz-Hartpapier FR2 1,5 mm, einseitig 35 µm CU - organischer Oberflächenschutz OSP - 38 x 61 Lötinseln 2,2 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm

Contextual Info: Tarjeta experimental RE200-LFDS - epóxido FR4 1,5 mm, por dos lados 35 µm CU npth - estañado en caliente (HAL-leadfree) - 38 x 61 nodos de soldadura Ø 2,2 mm - trama de agujeros 2,54 x 2,54 mm - diámetro de los agujeros 1,0 mm - tamaño 100 x 160 mm

re200

Contextual Info: Laborkarte RE200-LF - Epoxyd FR4 1,5 mm, einseitig 35 µm CU - heißverzinnt HAL-leadfree - 38 x 61 Lötinseln 2,2 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm

Contextual Info: Prototyping Boards Dual Inline RE200-HT - High-temperature printed circuit board - On auf polyimide resin base glass fiber P97 1.50 mm, one-sided 35 m CU - Surface in chemical Au - Suitable for temperature ranges up to 260˚ centigrade - 38 x 61 soldering island 2.2 mm

Contextual Info: Prototyping Board RE200-LFDS - EPOXY fibre-glass FR4 1.5 mm double-sided 35 µm CU npth - hot air leveling (HAL-leadfree) - 38 x 61 single-hole conductor 2.2 mm Ø - hole spacing 2.54 x 2.54 mm - hole dia 1.0 mm - size 100 x 160 mm

Contextual Info: Laborkarte RE200-C3 - CEM3 1,5 mm einseitig 35 µm CU - heißverzinnt HAL-bleifrei - 38 x 61 Lötinseln 2,2 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm

RE200

Abstract: RE20
Contextual Info: Carte d´Expérimentation RE200-C3 - CEM3 1,5 mm, simple face 35 µm CU - étamé à chaud HAL-leadfree - 38 x 61 pastilles 2,2 mm Ø - pas 2,54 x 2,54 mm - perforation 1,0 mm - dimensions 100 x 160 mm

RE200B

Abstract: Sensor Pir RE200B RE-200B RE200B sensor RE200B datasheet PIR RE200B Fresnel lens IR RE200B amplifier circuit re200b FL65
Contextual Info: INFRARED PARTS MANUAL RE200B FL65 S211FL GLOLAB CORPORATION Thank you for buying our Pyroelectric Infrared components. The goal of Glolab is to produce top quality electronic kits, products and components. All of our kits are designed by Glolab engineers and tested in our laboratory.