ROBINSON NUGENT PGA SOCKET Search Results

Contextual Info: HIGH DENSITY PGA Socket Tooling PGA-ET Series • Allows device removal without damaging | or device body • Available for 10 x 10 through 21 x 21 grids • 18x18 through 21 x 21 extraction tools feature 4-sided pulling action DESCRIPTION PGA-ET-10x10 - Robinson Nugent, Inc. •

Contextual Info: HIGH DENSITY_ PGA Interstitial Sockets PGA-INT Series 9 .050" staggered design mates with n high density devices 9 Molded high temperature body mate - Suitable for infrared and vapor ph soldering applications 9 Screw machine reliability 9 Uses RN’s ultra-low force contact

McKenzie technology

Abstract: burndy zif YAMAICHI 132 PGA MAXCONN ms McKenzie technology pga
Contextual Info: Sockets Below are two lists of manufactures known to offer sockets for Xilinx package types. This list does not imply an endorsement by Xilinx. Each user must evaluate the particular socket type. a compatible PGA socket with wire-wrap pins. Note that the board-layout then differs from a PGA board layout.

Contextual Info: HIGH DENSITY Pin Grid Array Sockets . ^ ^ 7 . PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermittent solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press-fit

Contextual Info: HIGH DENSITY_ Pin Grid Array Sockets PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermitte solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press tails

Robinson Nugent

Abstract: Robinson Nugent pga 18x18 Nugent
Contextual Info: HIGH DENSITY_ PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints 9 Insures a reliable solder joint by provid­ ing an exact amount of solder * Eliminates the need for solder paste and

Robinson Nugent pga

Abstract: Robinson Nugent
Contextual Info: HIGH DENSITY Pin Grid Array Sockets PGA SERIES * High temp molded insulator body * Stand-offs available to eliminate intermittent solder connections * Precision screw machine sockets for high reliability * Available with solder, wire wrap and press-fit tails

Robinson Nugent

Abstract: Robinson Nugent SCREW MACHINE SOCKET Motorola 68040
Contextual Info: HIGH DENSITY Pin Grid Array Socket with Heat Sink Tabs PGHS Series CLIP HEAT SINK • High temp molded insulator body compatible with IR and vapor phase soldering MICROPROCESSOR • Precision screw machine sockets for high reliability PGA SOCKET • “Ultra Low Force” 6-finger contact

Contextual Info: Sockets -interstitial Pin Grid Array Sockets PGA-INT Series * .050" staggered design mates with new high density devices * Molded high temperature body material - Suitable for infrared and vapor phase soldering applications * Screw machine reliability * Uses RN’s ultra-low force contact

Contextual Info: HIGH DENSITY PGA Sockets PGA-ET Series 9 Allows device removal without damaging pins or device body 9 Available for 10 x 10 through 21 x 21 grids 9 18x18 through 21 x 21 extraction tools feature 4-sided pulling action DESCRIPTION PGA-ET-10X10 SOCKETS PGA-ET-11X11

Contextual Info: HIGH DENSITY Pin Grid Array Headers PGH Series * High temp molded insulator body * Variety of pin lengths to accommodate different board spacing requirements SOCKETS * Mates with PGA Series "A" SQUARE Grid Size Dimension A 8x8 .800“ 20 . 32 9x9 .900" (22 . 86)

Contextual Info: Sockets — N ugent-Interstitial Pin Grid Array Sockets PGA-INT Series • .050" staggered design mates with new high density devices * Molded high temperature body material - Suitable for infrared and vapor phase soldering applications • Screw machine reliability

Contextual Info: HIGH DENSITY PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints * Insures a reliable solder joint by prc ing an exact amount of solder 9 Eliminates the need for solder paste

Contextual Info: HIGH DENSITY_ PGA Interstitial Sockets 7.' t PGA-INT Series * .050" staggered design mates with new high density devices * Molded high temperature body material - Suitable for infrared and vapor phase soldering applications * Screw machine reliability

Contextual Info: Sockets HIGH DENSITY_ Pin Grid Array Sockets PGA SERIES * High temp molded insulator body * Stand-offs available to eliminate intermittent solder connections * Precision screw machine sockets for high reliability * Available with solder, wire wrap and press-fit

Contextual Info: Robinson Nugent- Screw Machine Terminal Strips I Solderless Backplane Socket r SBE-CP Series High reliability gas-tight connections Eliminates expensive manual soldering of backplanes Press-fit pin eliminates PCB damage Compatible with standard press-fit

Contextual Info: Sockets HIGH DENSITY Pin Grid Array Headers 5X&tJ. PGH Series * High temp molded insulator body * Variety of pin lengths to accommodate different board spacing requirements * Mates with PGA Series "A" SQUARE .1 2 0 Grid Size Dimension A 8x8 .800" 20 . 32

ROGERS MEKTRON

Abstract: Rogers 104JEV 104KEx
Contextual Info: Performance Characteristics Dissipation Factor Tem perature Characteristics 20 10 Ui -30 g 1 5 40 -50 -60 2 -ra o -80 -90 -100 -55 -3 5 -15 5 25 45 65 85 105 125 TEMPERATURE, °C Environmental Parameters Impedance Curves Per MIL-C-39014D, MIL-STD-202F - As Applicable

Robinson Nugent CATALOG

Abstract: MC68461 SAB80286 WE32104 Z80000 IMST414 FGE2000 MCA2800ALS 82786 intel TC110G
Contextual Info: T Circuit C o m p o n en ts Inc. r MicrofQ 3000 PGA Decoupling Capacitors Micro/Q 3000 ceramic capacitors are a family of very low inductance decoupling capacitors specifically designed to be through-hole mounted under pin grid arrays PGAs , PGA sockets, and

Contextual Info: Introduction 1. Distinctive Features The V29BMC is a memory controller designed specifically for use in Am29000 based systems. The specific nature of such systems preclude the V29BMC from being a general purpose device. However, within the constraints of the targeted applications, it imposes few architectural restrictions.

Robinson Nugent pga

Abstract: burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa
Contextual Info: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging April 1996 Order Number: 243103-001 7/1/96 9:08 AM 243103_1.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or

744040

Abstract: scx6206 74589 744020 Flip-Flop 7471 744017 744017 counter sn 74373 scx6218 74395
Contextual Info: July 1985 SCX m icroC M O S G ate A rray Fam ily A pplication G uide TABLE OF CONTENTS 1.0 General Description . 2 2.0 Product Features. 2 Enhanced Product Features. . 2

Matthey

Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
Contextual Info: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging June 1997 Order Number: 243103-004 6/12/97 10:21 AM 24310304.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or

tucker

Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
Contextual Info: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or