S32GM Search Results

Contextual Info: 32 PIN PLASTIC SOP 525 mil 32 17 1 5°±5° detail of lead end 16 A J E K F G H I C D L B N M M S32GM-50-525A-2 NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES

LB066

Contextual Info: Mounting Pad Packing Magazine Name MM525-02A LB-066 32 pin SOP 525 mil 32 17 1 5°±5° detail of lead end 16 A J E K F G H I C D L B N M M S32GM-50-525A-2 NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

uPD7720

Abstract: uPD77C25 uPD77P25C uPD77P25 uPD77P25D 77P25 UPD77C25GW-XXX 77c25 PD7720 uPD77P25GW
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD77C25, 77P25 DIGITAL SIGNAL PROCESSOR The µPD77C25, 77P25 are 16-bit fixed point CMOS signal processors intended for real-time digital processing of speech signals. Each device consists of a parallel multiplier 16 x 16 bits → 31 bits , an ALU (16 bits), an instruction ROM (2,048

Contextual Info: 32-PIN PLASTIC SOP 13.34 mm (525 32 17 detail of lead end P 1 16 A H F I G J S N S C D M L B K M E ITEM A MILLIMETERS 20.61 MAX. NOTE B 0.78 MAX. Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. C

micro servo 9g

Abstract: uPa2003 micro servo 9g tower pro 2SK1060 uPD3599 201 Zener diode 2SK2396 upc1237 infrared sensor TSOP - 1836 2SK518
Contextual Info: The export of these products from Japan is regulated by the Japanese government. The export of some or all of these products may be prohibited without governmental license. To export or re-export some or all of these products from a country other than Japan may also be prohibited without a license from that country. Please call

21x21

Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Contextual Info: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。

lg crt monitor circuit diagram

Abstract: micro servo 9g samsung lcd tv power supply diagrams MP 1008 es uPa2003 8049 microcontroller APPLICATION LG lcd tv tuner pioneer car dvd service manual lg washing machine circuit diagram 8ch pnp DARLINGTON TRANSISTOR ARRAY
Contextual Info: SEMICONDUCTORS SELECTION GUIDE Microcomputer 1 IC Memory 2 Semi-Custom IC 3 Particular Purpose 4 General Purpose Linear IC 5 Transistor/Diode/Thyristor 6 GaAs Device/ Silicon Microwave Semiconductor 7 Optical Device 8 Packages 9 Index 10 October 1998 The export of these products from Japan is regulated by the Japanese government. The export of some or all of

C10943X

Abstract: mounting pad IS225 P20GM-65-300B-2 S42G
Contextual Info: a Mounting pad of SOP SOPs are named after the nominal center-to-center distance ( e1 ) between mounting pad arrays. Therefore, for example, the name “225 mils SOP” means that the center-to-center distance between the mounting pad arrays of this SOP is 225 mils (5.7 mm), as shown in Figure 1-6.

MD300-10A

Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Contextual Info: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP

S14GM-50-225B

Contextual Info: : Available, : Under development Plastic SOP Nominal Dimensions mil Lead Pitch (mm) Pin Counts 8 14 16 20 24 28 32 40 44 225 300 375 1.27 450 525 600 Plastic SSOP Nominal Dimensions (mil) Lead Pitch (mm) 225 0.65 Pin Counts 8 0.50 300 0.65 0.8 0.65 375 0.8

sharp lsi pc 2002

Abstract: AXS628319C P28GM-50-450A1-2 FRAME32
Contextual Info: AXS6 SOP SOCKETS AXS6 µSOCKET SERIES IC SOCKETS FOR SMALL OUTLINE PACKAGE 3. Space saving The socket occupies an area only 1.25 times the size of the IC. High density mounting is possible even if the socket is used. 4. Automated mounting compatible The socket has an open flat construction

tgn 600

Contextual Info: RN 1C PAK N uaent Specifications for SOP Sockets MATERIALS Body & Frame: Glass reinforced PPS UL 94V-0 Contact: Plating: TT = 2.03 pm (80 flinch) Tin/Lead overall. Phosphor Bronze 1.27 pm (50 pinch) Nickel underplate. SOCKETS ELECTRICAL Current Rating: 0.5 Ampere per contact

D650

Contextual Info: ¿¿PD77C25, 77P25 NEC 7. PACKAGE DRAWINGS 28 PIN PLASTIC DIP 600 mil 28 15 NOTES 1) Each lead c e n te rlin e is lo ca te d w ith in 0.2 5 mm (0.01 inch) of its true p o sitio n (T.P .) at m axim um m ate ria l cond itio n . MILLIMETERS INCHES A 3 8 .1 0 M A X .

Contextual Info: SOP — XX C XX — SMT — TT Plating Position:. 28, 32 C = .450" Row Spacing Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags T00S371 DD0D3tj7 PC Doara oattern 2 B 37T WWW 1. 271Q. 05 32 B A 2 1.85 24. B 16.51 19. 0 5

Robinson Nugent IC SOCKET

Contextual Info: SOCKETS SOP — XX B XX — SMT — TT Plating Position:. 20, 28 . Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags ‘nEOOOO TiESOOb B = .375" Row Spacing EEh s' PC board 1 = Body 2 = Frame 3 = SO Package IC oattern 1. 2 7 ± Q. Q5

P20GT-50-375B-2

Abstract: 945080
Contextual Info: SOCKETS SOP — 44 E XX — SMT — TT Plating Position:. 44 Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags E = .600" Row Spacing T005371 000D370 I I I I I I Ijl I I I I I I I =lb4 am1 34 1= Body 2 = Frame 3 = SO Package IC

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

Robinson Nugent s2

Contextual Info: FINE PITCH SOCKETS E & D _ Specifications for SOP Sockets MATERIALS Body & Frame: Glass reinforced PPS UL 94V-0 Contact: Copper Alloy Plating: TT = 2.03 pm (80 pinch) Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. ELECTRICAL Current Rating: 0.5 Ampere per contact

uPD3599

Abstract: transistor nec 2SK2396 MOS FET BUZ 444 MC-7643 nec 3S4M 4305 regulator nec RD2.4S equivalent 2SC4305 NEC 2sA1441 nec NPN transistor SST 117
Contextual Info: SEMICONDUCTORS SELECTION GUIDE Microcomputer 1 IC Memory 2 Seimi-Custom IC 3 Particular Purpose 4 General Purpose Linear IC 5 Transistor/Diode/Thyristor 6 GaAs Device/ Silicon Microwave Semiconductor 7 Optical Device 8 Packages 9 Index 10 April 1998 The export of these products from Japan is regulated by the Japanese government. The export of some or all of

GE4F

Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
Contextual Info: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written

ATMEL 32P

Abstract: toshiba 94V-0
Contextual Info: SOP— 40 D XX — SMT — TT .Plating Position:. 40 Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags D = .525" Row Spacing. m E h T falEOOOO TiEBDDb a FF na 3 65 1 = Body 2 = Frame 3 = SO Package IC R e c o m m e n d e d PC b o a r d

AXS628319

Abstract: ATMEL soldering iron
Contextual Info: AXS6.fm 169 ページ ２００３年１２月２２日 月曜日 午後１２時１１分 AXS6 SOP IC SOCKETS AXS6 µSOCKET SERIES IC SOCKETS FOR SMALL OUTLINE PACKAGE 3. Space saving The socket occupies an area only 1.25 times the size of the IC. High density

sc5 s dc 6v relay

Abstract: P48D-70-600 UPD66010 UPD7752 AC03E uPD7520 uPA1601 UPD70208H uPD72020 uPD16503
Contextual Info: SEMICONDUCTORS SELECTION GUIDE Microcomputer 1 IC Memory 2 Semi-Custom IC 3 Particular Purpose IC 4 General Purpose Linear IC 5 Transistor/Diode/Thyristor 6 Microwave Device/ Consumer-Use High Frequency Device 7 Optical Device 8 Packages 9 Index 10 October 1997

P20GT-50-375B-2

Contextual Info: SMT — TT SOP — XX A XX Plating Position:_ 8, 14, 20, 24 A = .300" Row Spacing .Blank = Tube Pack TP = Tape and Reel body only *Frames are packaged in vinyl bags •Ì00S371 G0003fc>5 O CD lO t ST7 t 1 = Body 2 = Frame 3 = SO Package IC