SIZE20 Search Results

mat rot

Abstract: HE507
Contextual Info: 5, í 0,9 z TECHNICAL D " SHELL Steel CONTACTS ELECTRI CAL CL I MAT 10 MECHANICAL L t i nned Glass f i l l e d th e rm o p la s tic . F l a m e r e t a r d a n t t o UL 9 4 V - 0 . r e s i s t to s h o r t term te m p e ra tu re Co I o u r : b I a c k .

Contextual Info: CAO info N OUTIL N D'ETUDE Tai1le boitie A B E A B C D 3 1,19 30 . 43 39 , 52 38 . 76 53 , 42 52 . 65 69 . 70 68 . 9 4 67 , 31 66 . 55 1 6 . 46 16. 21 2 4 . 79 24 . 54 38 , 51 38 . 25 5 4 , 97 5 4 . 71 52 , 56 52 . 30 17 16 25 25 39 38 55 55 52 52 B' c D D'

Contextual Info: 1G 1rA i G LElD-S11B SPECIFICATIONS D S M -3 1 8 , D S M -5 9 0 S E R IE S Insulator Material: Black High Temperature Thermoplastic Pin Material: Brass Socket Material: Phosphor Bronze Shell Material: Steel Plating: Gold on Contacts, Nickel on Shell, Tin-Lead on Tails

DR2000

Abstract: RF Based Wireless Electronic Notice Board pc rj11 to db9 RJ11 to RS232 ANSI C63.4 db9 to rj11 0620 500-078 accident identification using rf DB9 Female / RJ11 cable
Contextual Info: RFM DR2000 Development Board DR2000 Virtual Wire  Development Kit Hardware Warranty Limited Hardware Warranty. RF Monolithics, Inc. “RFM” warrants solely to the purchaser that the hardware components of the DR2000 Virtual Wire Development Kit (the “Kit”) will be free from

BACC47EF1

Abstract: BACC47 BACC66 TRI-STAR BACC47EG1 BACC47EF3 BACC47EG BACC47EF2 arinc 600 coax pin size 8 317-2222-301
Contextual Info: ARINC 404 Types: • Environmental • Non-Environmental Shell Configurations: • Plug / Receptacle Pin or Socket S One Gang, type “A” Shell S One Gang, type “B” Shell S Two Gang, type “B” shell S Three Gang, type “B” shell S Four Gang, type “B” shell

BACC63 Series

Abstract: BACC63 BACC10GH BOEING bacc63 BACC45FT BACC63BP bacc10 BACC10JS BACC45FN BACC45
Contextual Info: CYLINDRICAL C48 Series/MIL-C-26500 Accessories & Application Tooling Boeing: BACC45 / BACC63 Series MIL-C-26500 C48 Series Introduction • Qualified to MIL-C-26500. ■ Styles qualified to Boeing BACC45 Series. FEATURES ■ Styles qualified to Boeing BACC63 Series.

intc 001107

Abstract: SPC560 PCR 406 J APC UPS CIRCUIT DIAGRAM SPC560P SPC560x spc560b transistor pcr 606 j STMICROELECTRONICS MSL PCR 606 J
Contextual Info: RM0017 Reference manual SPC560B4x, SPC560B5x, SPC560C4x, SPC560C5x 32-bit MCU family built on the embedded Power Architecture Introduction The SPC560x is a new family of next generation microcontrollers built on the Power Architecture™ embedded category. This document describes the features of the family and

bosch ecu pinout

Abstract: SPC560P BOSCH ECU microcontroller RM0022 bosch edc 15 bosch me 7.6.3 flex ecu bosch bosch ecu 0 261 200 218 connection diagram ISO26262 BOSCH ECU voltage line
Contextual Info: RM0022 Reference manual 32-bit MCU family built on the Power Architecture embedded category for automotive chassis and safety electronics applications Introduction The SPC560Pxx is the first member of a family of microcontrollers based on the Power ArchitectureTM targeting chassis and safety market segment, specifically the Electrical

7 segment display LTS 542

Abstract: lts 543 pin configuration lts 543 data sheet LTS 543 7 segment display 10 pin LTS 543 transmitter circuit in GPR lts 543 series pin diagram lts 542 pin diagram mips16 instruction set lts 543 pin diagram
Contextual Info: Preliminary User’s Manual VR4121 64/32-bit Microprocessor µPD30121 Document No. U13569EJ1V0UM00 1st edition Date Published August 1998 N CP(K) Printed in Japan [MEMO] 2 VR3000, VR4000, VR4100, VR4102, VR4111, VR4120, VR4121, VR4300, VR4305, VR4310, VR4400, VR5000,

DC-37PTI

Abstract: ms24266r bacc63bn LGA 478 SOCKET PIN LAYOUT 94v-0 lcd display BACC45 BACC63CB bacc10gh BACC63BV MIL-C-27500
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

Contextual Info: REFERENCES PART NUMBERS CONNECTEUR STANDARD ! STANDARD CONNECTOR Les embases série III livrées avec leur noix de détrompage sont différentes selon qu’elles s’accouplent avec une fiche clicker-nut ou une fiche de rack. Choisir la référence de l’embase dans la partie correspondante du tableau - partie gauche : fiche clicker-nut,

CN0966

Abstract: MS24266 BACC45FN MS24266R22 MS24265 "1.6 - 20 UNEF-2A BACC45FT mil-c-26500 C0909 1.062-18
Contextual Info: MIL-C-26500 C48 Series Introduction GENERAL DESCRIPTION The C48 Series describes a family of connectors qualified to MIL-C-26500. While maintaining the MIL-C-26500 mating interface, this product has also been expanded to include qualifications to numerous Boeing specifications

Contextual Info: F-206-1 1G 1rA i G LElD-S11B D S M -3 1 8, D S M -5 9 0 S E R IE S SPECIFICATIONS DSM For complete specifications and recommended PCB layouts see www.samtec.com? DSM-318 or www.samtec.com?DSM-590

mpc5606

Abstract: MS-146 7 Segment sm 41056 MPC5606SRM MPC5602 intc 001107 bosch amplifier 0811 405 028 bosch 30333 S13 instrument cluster schematic UO03
Contextual Info: Devices Supported: MPC5602S MPC5604S MPC5606S MPC5606SRM Rev. 3 11 Aug 2009 MPC5606S Microcontroller Reference Manual, Rev. 3 Freescale Semiconductor 1 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available

DIN 41529

Abstract: bacc10 MIL-C-83513 connector BACC45FT BACC10GH BACC45FN S2402D PTI 30 040 ga BACC45FM cd 1191 acb
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

BACC63CB

Abstract: bacc63bv m32029 BACC45 BACC45FT M22759/33-26-9 BACC45FN BACC63BP MIL-C-39029/31 Cinch Connectors bacc45ft
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

Contextual Info: Inserts Available C48 Series Showing Front Face of Socket Inserts Shell Size-12 Shell Size-10 Shell Size-8 (Y) (Y) (Y) (Y) (Y) Shell Size-16 Shell Size-14 (Y) (Y) (Y) Shell Size-18 (Y) 3 Shell Size-20 (Y) (Y) (Y) (Y) Shell Size-22 (Y) (Y) Shell Size-24 (Y)

SX28AC

Contextual Info: Designing Virtual Peripherals for the SX Programming Considerations and Standards by Craig Webb Introduction To take full advantage of the SX’s unique capabilities and high execution speed, a number of virtual peripherals VP’s already exist1, and more are currently under development. These VP’s are modules of

225791-1

Contextual Info: Interconnection Systems Selection Guide 82750 Revised 7-95 ARINC 404 Rack and Panel Connectors Pin and Socket Connectors ARINC 404 Rack and Panel Connectors Performance Characteristics Environmentally sealed RME series connectors are designed per Military

ioa18

Abstract: RY5FD01D intel 775 motherboard diagram VR4131 VR4111 modem VR4121 marking M5D DCU 0805 UPD30131 uPD31173 PFN DIODE
Contextual Info: Preliminary User’s Manual VR4131 64/32-Bit Microprocessor Hardware µPD30131 Document No. U15350EJ2V0UM00 2nd edition Date Published March 2002 N CP(K) 2002 2000 Printed in Japan [MEMO] 2 Preliminary User’s Manual U15350EJ2V0UM NOTES FOR CMOS DEVICES

rdc 19230

Abstract: tag 9035 PTC 2272 CS4281 SBR 2512 programmable divider circuit tc 8052 7492 PIN CONFIGURATION ICL 7211 data sheet CS4280-CM 9721 220
Contextual Info: Confidential Draft 3/7/00 CS4281 Programming Manual ft Revision 1.17w D ra 3/7/00 P.O. Box 17847, Austin, Texas 78760 512 445 7222 FAX: (512) 445 7581 http://www.cirrus.com Copyright  Cirrus Logic, Inc. 2000 (All Rights Reserved) MAR’00 DS308PRM1 1

Contextual Info: 1G 1rA i G LElD-S11B SPECIFICATIONS D S M -3 1 8 , D S M -5 9 0 S E R IE S Insulator Material: Black High Temperature Thermoplastic Pin Material: t o Brass Socket Material: Phosphor Bronze Shell Material: Steel Plating: Gold on Contacts, Nickel on Shell, Tin-Lead on Tails

SJT07

Abstract: F404 EI- 33C marking 2j4 socapex sx
Contextual Info: SJT 00 C l 16-35 P A F404 LF Ser i es - 1 I I I I I SJ T : St andar d scoop-proof Juni or Tr i -Lock Connector SJ TP : Back p a n e l mo u n t e d SJT00 SJTP00 Sh e l l type -00 : WaI I mo u n t r e c e p t a c I e 07 : Jam n u t r e c e p t a c I e

IC BOSCH 30536

Abstract: bosch 30439 BOSCH 30535 BOSCH 30443 3528 pwm bosch 30536 3525 PWM MPC5606S MPC5606SRM S13 instrument cluster schematic
Contextual Info: MPC5606S Microcontroller Reference Manual Devices Supported: MPC5602S MPC5604S MPC5606S MPC5606SRM Rev. 5 4 May 2010 MPC5606S Microcontroller Reference Manual, Rev. 5 Freescale Semiconductor 1 MPC5606S Microcontroller Reference Manual, Rev. 5 2 Freescale Semiconductor