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    SN62 PB36 AG2 COPPER Search Results

    SN62 PB36 AG2 COPPER Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    SN62 PB36 AG2 COPPER Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    im-sx20mam

    Abstract: sx20 series SN62 PB36 ag2 SnPb37 SN63 PB37 multicore SN62 PB36 ag2 kester SX20 SN95 solder SN62 PB36 ag2 Copper Multicore Solders
    Text: Lambda’s new surface mountable SX20 Series of Power Modules up to 25W/in 3 are ideally suited for Telecommunications and Network applications. SX20 Series Manufacturing Application Manual IM-SX20MAM Rev. A E90370 12/01 SX20 Manufacturing Application Manual


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    PDF IM-SX20MAM E90370 Sn-Pb37 im-sx20mam sx20 series SN62 PB36 ag2 SnPb37 SN63 PB37 multicore SN62 PB36 ag2 kester SX20 SN95 solder SN62 PB36 ag2 Copper Multicore Solders

    AG04

    Abstract: No abstract text available
    Text: SI00-06 Surging Ideas TVS Diode Application Note PROTECTION PRODUCTS Semtech utilizes a proprietary electroless nickel plate process for the UBM paired with screen printed solder balls. The balls are laid out in a grid with a pin out pattern per JEDEC standard outline MO-211.


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    PDF SI00-06 MO-211. AG04

    SI00-06

    Abstract: SN62 PB36 ag2 SN62 PB36 ag2 Copper design ideas with or without underfill MO-211 SFC05-4 thermal cycling reliability SN62 PB36 ag2 gold smd ag2
    Text: SI00-06 Surging Ideas TVS Diode Application Note PROTECTION PRODUCTS Semtech utilizes a proprietary electroless nickel plate process for the UBM paired with screen printed solder balls. The balls are laid out in a grid with a pin out pattern per JEDEC standard outline MO-211.


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    PDF SI00-06 MO-211. SI00-06 SN62 PB36 ag2 SN62 PB36 ag2 Copper design ideas with or without underfill MO-211 SFC05-4 thermal cycling reliability SN62 PB36 ag2 gold smd ag2

    Sn96Ag4 0.6

    Abstract: Sn96Ag4 solder Sn96Ag4 62Sn36Pb2Ag 107B SN62 PB36 ag2 Copper SN62 PB36 ag2 heat conductivity Automotive Power Electronics
    Text: Thermal Solutions Insulated Aluminum Substrates Thermal Solutions for Power Applications T.T. Electronics is a leading designer and manufacturer of electronic components. As a result of our experience with power components, Anotherm substrates, an innovative method of addressing thermal


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    PDF Mil-Std-202 Sn62/Pb36/Ag2) Sn96Ag4 0.6 Sn96Ag4 solder Sn96Ag4 62Sn36Pb2Ag 107B SN62 PB36 ag2 Copper SN62 PB36 ag2 heat conductivity Automotive Power Electronics

    arctic silver thermal adhesive

    Abstract: LOCTITE ACTIVATOR 7387 NC-SMQ92J SN62 PB36 ag2 Loctite ADHESIVE GAP PAD HUmiseal 1B73 hydrocarbon polymeric Loctite 406 Loctite sumo
    Text: Cree XLamp® LED Soldering & Handling XLamp MPL-EZW LEDs This application note applies to XLamp MPL-EZW LEDs which have order codes in the following format: MPLEZW-XX-XXXX-XXXXXXXXX This application note explains how XLamp MPL-EZW LEDs and assemblies containing


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    PDF CLD-AP36 arctic silver thermal adhesive LOCTITE ACTIVATOR 7387 NC-SMQ92J SN62 PB36 ag2 Loctite ADHESIVE GAP PAD HUmiseal 1B73 hydrocarbon polymeric Loctite 406 Loctite sumo

    NC-SMQ92J solder paste

    Abstract: NC-SMQ92J ADHESIVE GAP PAD Loctite 406 mcpcb reflow criteria SN62 MP SN62 PB36 ag2 hydrocarbon polymeric pliobond 20 Ultrasonic cleaner circuit diagram
    Text: Cree XLamp® LED Soldering & Handling XLamp MP-L EasyWhite LEDs This application note applies to XLamp MP-L EasyWhite LEDs which have order codes in the following format: MPLEZW-XX-XXXX-XXXXXXXXX This application note explains how XLamp MP-L EasyWhite LEDs and assemblies


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    PDF CLD-AP36 NC-SMQ92J solder paste NC-SMQ92J ADHESIVE GAP PAD Loctite 406 mcpcb reflow criteria SN62 MP SN62 PB36 ag2 hydrocarbon polymeric pliobond 20 Ultrasonic cleaner circuit diagram

    sn62pb36ag2

    Abstract: SN62 PB36 ag2 Copper SN62 PB36 ag2 Sn96Ag4 107B how to make an electronics components testing board "1 watt led" SN62 PB36 ag2 heat conductivity Automotive Power Electronics FR4 substrate 1.6mm
    Text: Thermal Solutions Insulated Aluminum Substrates Thermal Solutions for Hi Brightness LED Applications TT electronics is a leading designer and manufacturer of electronic components. As a result of our experience with power components, Anotherm substrates were developed as an innovative method of


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    PDF

    J-STD-005

    Abstract: 1092-03A-5 62NCLR-A 292-06A-5 1092-04A-5 hakko AVX0402YG104ZAT2A SMA end launch for pcb 142-0761-841-A SN62 PB36 ag2 heat conductivity
    Text: AMMP-XXXX Production Assembly Process Application Note 5386 Description Package Features This document describes and illustrates the attachment and detachment of Avago’s 5x5mm packaged products in a PCB soft board environment. The AMMP package has a solid copper filled cavity to allow optimum thermal transfer of the packaged device to the PCB and associated heat


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    PDF 42-0761-891-A DC-40GHz 092-04A-5 092-03A-5 DC-50GHz 492-03A-5 493-03A-5 AVX0402YG104ZAT2A SMT-0805 08052F47SZ6BBOD J-STD-005 1092-03A-5 62NCLR-A 292-06A-5 1092-04A-5 hakko AVX0402YG104ZAT2A SMA end launch for pcb 142-0761-841-A SN62 PB36 ag2 heat conductivity

    underfill

    Abstract: Aluminum alloys physical properties AN-1050 SILICON CONTROL RECTIFIER DETAILS alsic 105 SN62 PB36 ag2 International Power Devices silicon carbide LED lead-free solder joint reliability thermal cycle alsic
    Text: Application Note AN-1050 DirectFETTM Technology Materials and Practices Application Note Table of Contents Page Factors Causing Thermal Fatigue .2 Summarized Test Results .2


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    PDF AN-1050 underfill Aluminum alloys physical properties AN-1050 SILICON CONTROL RECTIFIER DETAILS alsic 105 SN62 PB36 ag2 International Power Devices silicon carbide LED lead-free solder joint reliability thermal cycle alsic

    underfill

    Abstract: SILICON CONTROL RECTIFIER DETAILS AN-1050 Aluminum alloys physical properties Ablestik underfill SN62 PB36 ag2 Copper SN62 PB36 ag2 alsic 105 alsic
    Text: AN-1050 DirectFET TM Technology Materials and Practices Application Note page Factors causing thermal fatigue 2 Summarized test results 2 Use of underfill beneath devices 3 Use of lead-free solder alloys 3 Use of insulated metal substrates 4 Use of conformal coatings


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    PDF AN-1050 AN-1035, underfill SILICON CONTROL RECTIFIER DETAILS AN-1050 Aluminum alloys physical properties Ablestik underfill SN62 PB36 ag2 Copper SN62 PB36 ag2 alsic 105 alsic

    Untitled

    Abstract: No abstract text available
    Text: Product Datasheet Jan 4, 2012 9.9-12.5Gb/s Optical Modulator Driver TGA4953-SL OC-192 Metro and Long Haul Applications Surface Mount Package Key Features and Performance • • • • • • • Description The TriQuint TGA4953-SL is part of a series of


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    PDF OC-192 TGA4953-SL TGA4953-SL Sn63/Pb37 Sn62/Pb36/Ag2

    Untitled

    Abstract: No abstract text available
    Text: Product Datasheet May 11, 2011 9.9-12.5Gb/s Optical Modulator Driver TGA4953-SL OC-192 Metro and Long Haul Applications Surface Mount Package Key Features and Performance • • • • • • • Description The TriQuint TGA4953-SL is part of a series of


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    PDF OC-192 TGA4953-SL TGA4953-SL Sn63/Pb37 Sn62/Pb36/Ag2

    AN1035

    Abstract: tamura solder paste SN62 PB36 ag2 kester IRF6604 DirectFet SN62 PB36 ag2 Copper Tamura kaken 100N IRF6601 IRF6602
    Text: AN-1035 DirectFET TM Technology Board Mounting Application Note page Device construction 2 Design considerations 3 Assembly considerations 4 Mechanical test results 5 International Rectifier AN-1035 DirectFET Technology Board Mounting Application Note Introduction


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    PDF AN-1035 065mm. pp1509-1523 AN1035 tamura solder paste SN62 PB36 ag2 kester IRF6604 DirectFet SN62 PB36 ag2 Copper Tamura kaken 100N IRF6601 IRF6602

    Untitled

    Abstract: No abstract text available
    Text: Product Datasheet Jan 4, 2012 9.9-12.5Gb/s Optical Modulator Driver TGA4953-SL OC-192 Metro and Long Haul Applications Surface Mount Package Key Features and Performance • • • • • • • Description The TriQuint TGA4953-SL is part of a series of


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    PDF TGA4953-SL OC-192 TGA4953-SL Sn63/Pb37 Sn62/Pb36/Ag2

    CR1206 vishay

    Abstract: pin configuration 500K variable resistor zener diodes color coded capacitor 106 35K CR0002 vishay interactive pin diagram 1K variable resistor diode AG2 12S50 202 variable resistor
    Text: VISHAY INTE R TECHNO L O G Y , INC . INTERACTIVE data book thick film products vishay techno vse-db0003-0608 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents


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    PDF vse-db0003-0608 CR1206 vishay pin configuration 500K variable resistor zener diodes color coded capacitor 106 35K CR0002 vishay interactive pin diagram 1K variable resistor diode AG2 12S50 202 variable resistor

    tamura solder paste

    Abstract: AN-1035 SN63 PB37 multicore SN62 PB36 ag2 kester SN62 MP AN1035 tamura solder paste PROFILE Litton SN62 PB36 ag2 100N
    Text: Application Note AN-1035 DirectFET Technology Board Mounting Table of Contents Page Device construction Design considerations Assembly considerations Mechanical test results Model-specific data 2 2 3 5 8 DirectFET™ is a new surface mount semiconductor technology designed primarily for boardmounted power applications. It eliminates unnecessary elements of packaging that contribute to


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    PDF AN-1035 150mm 025mm 500mm tamura solder paste AN-1035 SN63 PB37 multicore SN62 PB36 ag2 kester SN62 MP AN1035 tamura solder paste PROFILE Litton SN62 PB36 ag2 100N

    TNV1

    Abstract: SN62 PB36 ag2 electronic series and parallel circuits flowing SIEMENS WASHING machine U01 SMD 24S12 SXA15 SXA15-24S05 SXA15-24S12 SXA15-24S3V3
    Text: SXA15 SERIES NEW Product Application Note 115 Rev. 01 - July 2000 • • • • • Surface mount isolated DC/DC converter High reliability, rugged design Low weight, open frame package 2:1 input voltage range 18-36V Full operation over the temperature range of -40°C to


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    PDF SXA15 8-36V A3-11 TNV1 SN62 PB36 ag2 electronic series and parallel circuits flowing SIEMENS WASHING machine U01 SMD 24S12 SXA15-24S05 SXA15-24S12 SXA15-24S3V3

    L02 SMD

    Abstract: SIEMENS WASHING machine SN62 PB36 ag2 24S12 SXA15 SXA15-24S05 SXA15-24S12 SXA15-24S3V3 SMD L02 TNV1
    Text: SXA15 SERIES Application Note 115 1. Introduction 2 2. Models 2 3. General Description Electrical Description Physical Construction 2 2 4. Features and Functions Undervoltage lockout set-point Remote ON/OFF operation Output voltage trim Output voltage adjust by voltage source


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    PDF SXA15 24S12 A3-11 A3-10 L02 SMD SIEMENS WASHING machine SN62 PB36 ag2 24S12 SXA15-24S05 SXA15-24S12 SXA15-24S3V3 SMD L02 TNV1

    smd ag2

    Abstract: artesyn power supply EN61000-4-5 SXA10 SXA10-48S05 SXA10-48S12 SXA10-48S2V5 SXA10-48S3V3
    Text: SXA10 SERIES NEW Product Application Note 102 Rev. 05 - March 2000 • • • • • • Surface mount isolated DC/DC converter High reliability, rugged design Low weight, open frame package 3:1 input voltage range 25-75V Adjustable Undervoltage Lockout UVLO


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    PDF SXA10 5-75V smd ag2 artesyn power supply EN61000-4-5 SXA10-48S05 SXA10-48S12 SXA10-48S2V5 SXA10-48S3V3

    M9627

    Abstract: uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire
    Text: SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL 1989 Document No. C10535EJ8V0IF00 8th edition Date Published February 1997 N Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in


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    PDF C10535EJ8V0IF00 M9627 uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire

    marking code SMD Transistor 2ak

    Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


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    PDF C10535EJ9V0IF00 marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste

    GE4F

    Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


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    PDF C10535EJ9V0IF00 GE4F UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00