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    SO8 PCB PATTERN Search Results

    SO8 PCB PATTERN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    HSDC-EXTMOD03B-DB Renesas Electronics Corporation Digital Pattern Generation board for High-speed JESD204B DACs Visit Renesas Electronics Corporation
    ZLEDPCB2 Renesas Electronics Corporation LED Test PCBs Visit Renesas Electronics Corporation
    ZLEDPCB10 Renesas Electronics Corporation LED Test PCB - 12x 0.5W Visit Renesas Electronics Corporation
    ZLEDPCB1B Renesas Electronics Corporation LED Test PCB - 3W Visit Renesas Electronics Corporation
    ZLEDPCB8 Renesas Electronics Corporation LED Test PCB - 5W Visit Renesas Electronics Corporation

    SO8 PCB PATTERN Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    1206-8 chipfet layout

    Abstract: AN811 1206 footprint dimension 1206-8 chipfet 1206 pads layout so8 pcb pattern 1206 8 ChipFET 1206 footprint Resistor dimensions 1206 to mm vishay so-8 pin dimensions
    Text: AN812 Vishay Siliconix Dual-Channel 1206-8 ChipFETr Power MOSFET Recommended Pad Pattern and Thermal Performance INTRODUCTION New Vishay Siliconix ChipFETs in the leadless 1206-8 package feature the same outline as popular 1206-8 resistors and capacitors but provide all the performance of true power


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    PDF AN812 AN811, 12-Dec-03 1206-8 chipfet layout AN811 1206 footprint dimension 1206-8 chipfet 1206 pads layout so8 pcb pattern 1206 8 ChipFET 1206 footprint Resistor dimensions 1206 to mm vishay so-8 pin dimensions

    AN811

    Abstract: 1206-8 chipfet layout 1206 pads layout 1206 8 ChipFET Resistor dimensions 1206 to mm AN812
    Text: AN811 Vishay Siliconix Single-Channel 1206-8 ChipFETr Power MOSFET Recommended Pad Pattern and Thermal Performance INTRODUCTION New Vishay Siliconix ChipFETs in the leadless 1206-8 package feature the same outline as popular 1206-8 resistors and capacitors but provide all the performance of true power


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    PDF AN811 AN812 12-Dec-03 AN811 1206-8 chipfet layout 1206 pads layout 1206 8 ChipFET Resistor dimensions 1206 to mm AN812

    so8 pcb pattern

    Abstract: 1206-8 chipfet layout vishay so-8 pin dimensions TA812 71127
    Text: TA812 Vishay Siliconix Dual-Channel 1206-8 ChipFETt Power MOSFET Recommended Pad Pattern and Thermal Performance Michael Speed INTRODUCTION New Vishay Siliconix ChipFETst in the leadless 1206-8 package feature the same outline as popular 1206-8 resistors and capacitors but provide all the performance of true power


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    PDF TA812 28-Feb-00 so8 pcb pattern 1206-8 chipfet layout vishay so-8 pin dimensions TA812 71127

    so8 pcb pattern

    Abstract: MOSFET SO-8
    Text: AN812 Vishay Siliconix Dual-Channel 1206-8 ChipFETt Power MOSFET Recommended Pad Pattern and Thermal Performance Michael Speed INTRODUCTION New Vishay Siliconix ChipFETst in the leadless 1206-8 package feature the same outline as popular 1206-8 resistors and capacitors but provide all the performance of true power


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    PDF AN812 28-Feb-00 so8 pcb pattern MOSFET SO-8

    ta811

    Abstract: No abstract text available
    Text: TA811 Vishay Siliconix Single-Channel 1206-8 ChipFETt Power MOSFET Recommended Pad Pattern and Thermal Performance Michael Speed INTRODUCTION New Vishay Siliconix ChipFETst in the leadless 1206-8 package feature the same outline as popular 1206-8 resistors


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    PDF TA811 28-Mar-00 ta811

    AN811

    Abstract: No abstract text available
    Text: AN811 Vishay Siliconix Single-Channel 1206-8 ChipFETt Power MOSFET Recommended Pad Pattern and Thermal Performance Michael Speed INTRODUCTION The legs of the device are very short, again helping to reduce the thermal path to the external heatsink/pcb and allowing a


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    PDF AN811 28-Mar-00 AN811

    SO8 package fairchild

    Abstract: so8 pcb pattern microfet
    Text: February 2002 Application Note 7527 Dual Channel MicroFET 3x2 Power MOSFET Recommended Land Pattern and Thermal Performance Roman Gurevich , Scott Pearson , Ray Poremba Introduction Fairchild ’s new dual MicroFET™ 3x2 package with two exposed drain pads provides a true surface-mount alternative that greatly improves thermal characteristics, high current handling capability and low on-resistance. These


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    SO8 package fairchild

    Abstract: No abstract text available
    Text: October 2001 Application Note 7526 Single Channel MicroFET 3x2 Power MOSFET Recommended Land Pattern and Thermal Performance Roman Gurevich , Scott Pearson , Ray Poremba Introduction Fairchild ’s new MicroFET™ 3x2 package with exposed drain pad provides a true surface-mount alternative that


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    SO8 package fairchild

    Abstract: 021L2
    Text: February 2002 Application Note 7526 Single Channel MicroFET 3x2 Power MOSFET Recommended Land Pattern and Thermal Performance Roman Gurevich , Scott Pearson , Ray Poremba Introduction Fairchild ’s new MicroFET™ 3x2 package with exposed drain pad provides a true surface-mount alternative that


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    "thermal via" PCB D2PAK

    Abstract: JESD24-3 "thermal via" PCB D-PAK so8 pcb pattern double sided pcb, thermal via powersi so8 footprint AN-994 thermal PCB D2PAK IRF3706S
    Text: Evaluation of Power MOSFET Thermal Solutions for Desktop and Mobile Processor Power Tim McDonald and John Ambrus International Rectifier Corporation 233 Kansas Street El Segundo, CA 90245 USA Tmcdona1@irf.com, jambrus1@irf.com as presented at PCIM China, March 2002


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    PDF HFPC2001 AN-994, JESD24-3, "thermal via" PCB D2PAK JESD24-3 "thermal via" PCB D-PAK so8 pcb pattern double sided pcb, thermal via powersi so8 footprint AN-994 thermal PCB D2PAK IRF3706S

    VFQFPN8* footprint

    Abstract: so8 pcb pattern VFQFPN8 MLP8 FOOTPRINT mlp8 land pattern VFQFPN land pattern M25PXX SO8 NARROW so8 footprint AN1579
    Text: AN1579 APPLICATION NOTE Compatibility between the SO8 Package and the MLP Package for the M25Pxx in Your Application CONTENTS • FITTING MORE IN THE SAME AREA – Cross sections of the MLP and SO8 ■ ■ The new MicroLeadframe Package MLP is the ideal solution


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    PDF AN1579 M25Pxx 150mil 16Mbit, 150mil) VFQFPN8* footprint so8 pcb pattern VFQFPN8 MLP8 FOOTPRINT mlp8 land pattern VFQFPN land pattern SO8 NARROW so8 footprint AN1579

    PowerPAK SO-8

    Abstract: so8 pcb pattern SO8L vishay so-8 pin dimensions vishay power pak SO-8L SO-8 V 052 PowerPAK SO-8L 8L 05 Ansys led vishay power pak SO-8 package dimension
    Text: VISHAY SILICONIX Power ICs and Power MOSFETs Application Note 913 The PowerPAK SO-8L: A Package with Thermo-Mechanical Resilience By Kandarp Pandya Vishay is adding to its package portfolio with the PowerPAK SO-8L, an AEC Q101 qualified package. Its power cycling


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    PDF O-252) 09-Jan-09 PowerPAK SO-8 so8 pcb pattern SO8L vishay so-8 pin dimensions vishay power pak SO-8L SO-8 V 052 PowerPAK SO-8L 8L 05 Ansys led vishay power pak SO-8 package dimension

    IPC9502

    Abstract: SO8 package fairchild FDS7066N3 FDS7066N7 soldering station IPC-9502
    Text: Application Note 7006 June 2004 Guidelines for Using Fairchild's SO-8 FLMP Dennis Lang, Applications Engineer Introduction The Flip chip in Leaded Molded Package FLMP SO-8 minimizes both Printed Circuit Board (PCB) space and RDS(ON) in a convenient, familiar SO-8 sized package. The FLMP SO-8 employs


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    AN1703

    Abstract: DIODE SMD 44w st mosfet "thermal via" PCB D2PAK to220 pcb footprint Soldering guidelines and SMD footprint design "Intelligent Power Devices" FOOTPRINT PCB AN-1703 thermal resistance measurement
    Text: AN1703 APPLICATION NOTE GUIDELINES FOR USING ST’S MOSFET SMD PACKAGES R.Gulino 1. ABSTRACT The trend from through-hole packages to low-cost SMD-applications is marked by the improvement of chip technologies. "Silicon instead of heatsink" is therefore possible in many cases. Many applications


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    PDF AN1703 AN1703 DIODE SMD 44w st mosfet "thermal via" PCB D2PAK to220 pcb footprint Soldering guidelines and SMD footprint design "Intelligent Power Devices" FOOTPRINT PCB AN-1703 thermal resistance measurement

    AN-994-1

    Abstract: to247 pcb footprint MQFP64 PLCC-44
    Text: AN-994-1 Rev. 2.0 MAXIMIZING THE EFFECTIVENESS OF YOUR SMD ASSEMBLIES Gil Alivio John Ambrus Tim McDonald Richard Dowling 2 of 7 IR Application Note –994 Rev. 2 Title: Maximizing the Effectiveness of Your SMD1 Assemblies Topics Covered: • Section I: How we Measure Rth (JA)


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    PDF AN-994-1 AN-994-1 to247 pcb footprint MQFP64 PLCC-44

    SBOS156A

    Abstract: SBOS156
    Text: OPA445 SBOS156A − MARCH 1987 − REVISED AUGUST 2006 High Voltage FET-Input OPERATIONAL AMPLIFIER FEATURES DESCRIPTION D WIDE-POWER SUPPLY RANGE: D D D ±10V to ±45V HIGH SLEW RATE: 15V/µs LOW INPUT BIAS CURRENT: 10pA STANDARD-PINOUT TO-99, DIP, SO-8 PowerPAD, AND SO-8 SURFACE-MOUNT


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    PDF OPA445 SBOS156A OPA445 SBOS156

    Untitled

    Abstract: No abstract text available
    Text: OPA445 SBOS156A − MARCH 1987 − REVISED AUGUST 2006 High Voltage FET-Input OPERATIONAL AMPLIFIER FEATURES DESCRIPTION D WIDE-POWER SUPPLY RANGE: D D D ±10V to ±45V HIGH SLEW RATE: 15V/µs LOW INPUT BIAS CURRENT: 10pA STANDARD-PINOUT TO-99, DIP, SO-8 PowerPAD, AND SO-8 SURFACE-MOUNT


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    PDF OPA445 SBOS156A OPA445

    SBOA021

    Abstract: No abstract text available
    Text: OPA445 SBOS156A − MARCH 1987 − REVISED AUGUST 2006 High Voltage FET-Input OPERATIONAL AMPLIFIER FEATURES DESCRIPTION D WIDE-POWER SUPPLY RANGE: D D D ±10V to ±45V HIGH SLEW RATE: 15V/µs LOW INPUT BIAS CURRENT: 10pA STANDARD-PINOUT TO-99, DIP, SO-8 PowerPAD, AND SO-8 SURFACE-MOUNT


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    PDF OPA445 SBOS156A OPA445 SBOA021

    Untitled

    Abstract: No abstract text available
    Text: OPA445 SBOS156A − MARCH 1987 − REVISED AUGUST 2006 High Voltage FET-Input OPERATIONAL AMPLIFIER FEATURES DESCRIPTION D WIDE-POWER SUPPLY RANGE: D D D ±10V to ±45V HIGH SLEW RATE: 15V/µs LOW INPUT BIAS CURRENT: 10pA STANDARD-PINOUT TO-99, DIP, SO-8 PowerPAD, AND SO-8 SURFACE-MOUNT


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    PDF OPA445 SBOS156A OPA445

    Untitled

    Abstract: No abstract text available
    Text: OPA445 SBOS156B − MARCH 1987 − REVISED APRIL 2008 High Voltage FET-Input OPERATIONAL AMPLIFIER FEATURES DESCRIPTION D WIDE-POWER SUPPLY RANGE: D D D ±10V to ±45V HIGH SLEW RATE: 15V/µs LOW INPUT BIAS CURRENT: 10pA STANDARD-PINOUT TO-99, DIP, SO-8 PowerPAD, AND SO-8 SURFACE-MOUNT


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    PDF OPA445 SBOS156B OPA445

    Untitled

    Abstract: No abstract text available
    Text: OPA445 SBOS156B − MARCH 1987 − REVISED APRIL 2008 High Voltage FET-Input OPERATIONAL AMPLIFIER FEATURES DESCRIPTION D WIDE-POWER SUPPLY RANGE: D D D ±10V to ±45V HIGH SLEW RATE: 15V/µs LOW INPUT BIAS CURRENT: 10pA STANDARD-PINOUT TO-99, DIP, SO-8 PowerPAD, AND SO-8 SURFACE-MOUNT


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    PDF OPA445 SBOS156B OPA445 OPA445â

    Untitled

    Abstract: No abstract text available
    Text: OPA445 SBOS156B − MARCH 1987 − REVISED APRIL 2008 High Voltage FET-Input OPERATIONAL AMPLIFIER FEATURES DESCRIPTION D WIDE-POWER SUPPLY RANGE: D D D ±10V to ±45V HIGH SLEW RATE: 15V/µs LOW INPUT BIAS CURRENT: 10pA STANDARD-PINOUT TO-99, DIP, SO-8 PowerPAD, AND SO-8 SURFACE-MOUNT


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    PDF OPA445 SBOS156B OPA445

    OPA445

    Abstract: OPA445ADDA OPA445AP OPA445AU OPA445BM powerPAD
    Text: OPA445 SBOS156B − MARCH 1987 − REVISED APRIL 2008 High Voltage FET-Input OPERATIONAL AMPLIFIER FEATURES DESCRIPTION D WIDE-POWER SUPPLY RANGE: D D D ±10V to ±45V HIGH SLEW RATE: 15V/µs LOW INPUT BIAS CURRENT: 10pA STANDARD-PINOUT TO-99, DIP, SO-8 PowerPAD, AND SO-8 SURFACE-MOUNT


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    PDF OPA445 SBOS156B OPA445 OPA445ADDA OPA445AP OPA445AU OPA445BM powerPAD

    OPA445

    Abstract: OPA445ADDA OPA445AP OPA445AU OPA445BM
    Text: OPA445 SBOS156B − MARCH 1987 − REVISED APRIL 2008 High Voltage FET-Input OPERATIONAL AMPLIFIER FEATURES DESCRIPTION D WIDE-POWER SUPPLY RANGE: D D D ±10V to ±45V HIGH SLEW RATE: 15V/µs LOW INPUT BIAS CURRENT: 10pA STANDARD-PINOUT TO-99, DIP, SO-8 PowerPAD, AND SO-8 SURFACE-MOUNT


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    PDF OPA445 SBOS156B OPA445 OPA445ADDA OPA445AP OPA445AU OPA445BM