SOCKET 940 PIN PACKAGE Search Results

socket 940 pin package

Abstract: AMD top marking socket 940 AMD 940 Pin Package amd socket 940 pin grid array socket 940 pin AMD socket s1 amd 940 2576-6 UPGA
Contextual Info: AMD Socket 940 Design Specification Publication # 25766 Revision: 3.03 Issue Date: September 2003 2002, 2003 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. “AMD” products. AMD makes no representations or

AMD Socket S1 PIN LAYOUT

Abstract: amd athlon PIN LAYOUT voltage ground socket 940 pin package amd socket 940 PIN LAYOUT 940 SOCKET PIN LAYOUT AMD socket s1 amd FX PIN LAYOUT amd athlon PIN LAYOUT socket 940 socket s1
Contextual Info: AMD Socket 940 Qualification Plan Publication # 30353 Revision: 3.04 Issue Date: September 2003 2003 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. “AMD” products. AMD makes no representations or

Contextual Info: Micro D Series Filtered Connectors For designs that require even smaller connector packages, API’s Spectrum Control brand has designed a line of filtered Micro D-Subminiature connectors. This line of connectors offers a range of reliable filtering options, including capacitive and ESD versions,

Contextual Info: Micro D Series Filtered Connectors For designs that require even smaller connector packages, Spectrum has designed a line of filtered Micro D-Subminiature connectors. This line of connectors offers a range of reliable filtering options, including capacitive and ESD versions, and several sizes and

56-F011-110-JP

Abstract: micro D 37 connectors FC57 FC59
Contextual Info: Micro D Series Filtered Connectors For designs that require even smaller connector packages, Spectrum has designed a line of filtered Micro D-Subminiature connectors. This line of connectors offers a range of reliable filtering options, including capacitive and ESD versions, and several sizes and

920MHz

Abstract: RFMD PA LTE class c tuned amplifier
Contextual Info: RFPA3800 RFPA3800 GaAs HBT 150 MHz to 960MHz Power Amplifier GaAs HBT 150MHz TO 960MHz POWER AMPLIFIER Package: SOIC-8 Features  5W Output Power P1dB  High Linearity: OIP3>48dBm  High Efficiency    Low Noise: NF=3.2dB at 945MHz 5V to 7V Operation

UMK105cg

Abstract: 500R07S1R2 GSM WCDMA repeater circuit LQP15MN 500R07S RFMD PA LTE DS120611 RFPA3800 500r07 MuRata Electronics Kamaya
Contextual Info: RFPA3800 RFPA3800 GaAs HBT 150 MHz to 960MHz Power Amplifier GaAs HBT 150MHz TO 960MHz POWER AMPLIFIER Package: SOIC-8 Features  5W Output Power P1dB  High Linearity: OIP3>48dBm  High Efficiency    Low Noise: NF=3.2dB at 945MHz 5V to 7V Operation

Contextual Info: RFPA3800 RFPA3800 GaAs HBT 150 MHz to 960MHz Power Amplifier GaAs HBT 150MHz TO 960MHz POWER AMPLIFIER Package: SOIC-8 Features  5W Output Power P1dB  High Linearity: OIP3>48dBm  High Efficiency  Low Noise: NF=3.2dB at 945MHz  5V to 7V Operation

am2 SOCKET PIN LAYOUT

Abstract: socket 940 am2 pin socket am2 am2 socket pin out socket 939 socket 940 socket AM2 retention AM2 socket data MMC socket tl081 datasheets
Contextual Info: APPLICATION SPECIFICATION 114-13092 LEVER-ACTUATED ZERO INSERTION FORCE ZIF MICRO PIN GRID ARRAY (PGA) SOCKETS 940, 939 & AM2 NOTE : 1. All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimetres. Unless otherwise specified,

Contextual Info: HB56D136 Series 1,048,576-word x 36-bit High Density Dynamic RAM Module HITACHI ADE-203-209A Z Rev 1.0 Sept. 20, 1994 Description The HB56D136 is a 1-M X 36-bit dynamic RAM module, mounted 8 pieces of 4 Mbit DRAM (HM514400CS/CLS) sealed in SOJ package and 2 pieces of 2 Mbit DRAM (HM512200BS/BLS) sealed in

Contextual Info: HB56D136 Series 1,048,576-word x 36-bit High Density Dynamic RAM Module HITACHI ADE-203-209A Z Rev 1.0 Sept. 20, 1994 Description The HB56D136 is a 1-M x 36-bit dynamic RAM module, mounted 8 pieces of 4 Mbit DRAM (HM514400CS/CLS) sealed in SOJ package and 2 pieces of 2 Mbit DRAM (HM512200BS/BLS) sealed in

amd socket 939

Abstract: socket 940 CTLB027193-003 CTLB027193-007 QPS940 CTLB021793-008
Contextual Info: 501-571 Qualification Test Report 14May04 Rev A EC 0990-0606-04 Lever Actuated ZIF Micro PGA 939 and 940 Position Sockets | 1. INTRODUCTION 1.1. Purpose Testing was performed on the Tyco Electronics lever-actuated Zero Insertion Force ZIF micro Pin Grid

HB56D136

Abstract: HB56D136BW-6C HB56D136BW-6CL HB56D136BW-7C HB56D136BW-7CL HB56D136BW-8C HB56D136BW-8CL
Contextual Info: HB56D136 Series 1,048,576-word x 36-bit High Density Dynamic RAM Module ADE-203-209A Z Rev 1.0 Sept. 20, 1994 Description The HB56D136 is a 1-M × 36-bit dynamic RAM module, mounted 8 pieces of 4 Mbit DRAM (HM514400CS/CLS) sealed in SOJ package and 2 pieces of 2 Mbit DRAM (HM512200BS/BLS) sealed

Contextual Info: HB56D136 Series 1,048,576-word x 36-bit High Density Dynamic RAM Module ADE-203-209A Z Rev 1.0 Sept. 20, 1994 Description The HB56D136 is a 1-M × 36-bit dynamic RAM module, mounted 8 pieces of 4 Mbit DRAM (HM514400CS/CLS) sealed in SOJ package and 2 pieces of 2 Mbit DRAM (HM512200BS/BLS) sealed in

Contextual Info: Catalog 82045 J B k lifl Metrimate Pin and Socket Connectors Revised 3-98 Square Grid Connectors Free-Hanging and Panel Mount Connectors Material: Socket Contact Plug Housing Receptacle Housing Accepts Socket Contacts (Accepts Pin Contacts) Panel Latches

HB56D136SBW-7B

Abstract: HB56D136
Contextual Info: ADE-203-209A Z HB56D136BW/SBW Series 1,048,576-word x 36-bit High Density Dynamic RAM Module Rev. 1.0 Sept. 20, 1994 The HB56D136 is a 1-M × 36-bit dynamic RAM module, mounted 8 pieces of 4 Mbit DRAM (HM514400BS/BLS/CS/CLS) sealed in SOJ package and 2 pieces of 2 Mbit DRAM

Contextual Info: 1 2 3 4 5 6 7 REV. A 8 ECN.N0. RELEASED DATE 0 7 /2 2 /0 4 NOTES: ^Material Cover: Thermoplastic LCP, IJL 9 4 V - Rated, Ivory Color. Base: Thermoplastic LCP, UL 94V-C Rated, Black Color. Lever: Stainless Steel. Contact: Copper Alloy. Plating: Gold Plating Over Nickel on Contact Area;

B 4045

Abstract: 207121 207015-1 207121-3 tab 2453 207532-3 213792-1 207603-1 207019-1
Contextual Info: Data downloaded from http://www.anglia.com - the website of Anglia - tel: 01945 474747 METRIC Catalogue 1654741 Metrimate Pin and Socket Connectors Revised 1-04 Dimensions are millimetres over inches. Square Grid Connectors Free-Hanging and Panel Mount Connectors

amphenol 97 22-22

Abstract: Radsok 10-40569 10-597107-161 74696 10-40565 10-74696 10SL-3 Amphenol Radsok amphe-power 14 mm p-lok
Contextual Info: Table of Contents Page Amphenol AC Threaded , AC-B (Reverse Bayonet) Series Connectors Introduction/General Information . 1

tp1019

Abstract: 46756-2 69120-1 69099 16022 58095-1 69653 daniels* m310 M310 408-4374
Contextual Info: Application Specification 114- 16022 High Current Pin and Socket Contacts NOTE i 07 DEC 09 Rev B All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2_.

Contextual Info: Series 570 .070 [1.78] Pitch Pin-to-Pin Sockets for Shrink-DIP packages FEATURES: • Accommodates shrink-pack ICs with pin-to-pin spacing of .070 [1.77] produced by Hitachi, Mitsubishi, T.I., and others for microprocessors and microcomputers. • Single-beam contact pins with low insertion force.

Contextual Info: Series 570 .070 [1.78] Pitch Pin-to-Pin Sockets for Shrink-DIP packages FEATURES: • Accommodates shrink-pack ICs with pin-to-pin spacing of .070 [1.77] produced by Hitachi, Mitsubishi, T.I., and others for microprocessors and microcomputers. • Single-beam contact pins with low insertion force.

Contextual Info: Series 570 .070 [1.78] Pitch Pin-to-Pin Sockets for Shrink-DIP packages FEATURES: • Accommodates shrink-pack ICs with pin-to-pin spacing of .070 [1.77] produced by Hitachi, Mitsubishi, T.I., and others for microprocessors and microcomputers. • Single-beam contact pins with low insertion force.

Contextual Info: Series 570 .070 [1.78] Pitch Pin-to-Pin Sockets for Shrink-DIP Packages FEATURES: •Accommodates shrink-pack ICs with pin-to-pin spacing of .070 [1.77] produced by Hitachi, Mitsubishi, T.I., and others for microprocessors and microcomputers. •Single-beam contact pins with low insertion force.