EME-7351
Abstract: Compound sumitomo epoxy
Text: Cypress Semiconductor Package Qualification Report QTP# 99112 VERSION 1.0 April, 2000 32 Lead 400mil SOJ Package Level 2 Omedata CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069 Cypress Semiconductor Package: 32 Lead (400mil) SOJ
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400mil)
32Lead
EME7351
CY7C109-VC
CY7C109-VIB
85C/60
EME-7351
Compound
sumitomo epoxy
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SOJ package MSL
Abstract: 8361H Cypress soj 36 140C JESD22
Text: Cypress Semiconductor Qualification Report QTP# 98148 VERSION 1.0 July, 1998 36 Ld, 400-mil SOJ Package Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 36 Ld, 400-mil SOJ QTP# 98148, V. 1.0 Page 2 of 4 July, 1998 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
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400-mil
8361H
JESD22-A112
30C/60
CY7C1049-VC
SOJ package MSL
8361H
Cypress
soj 36
140C
JESD22
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cel 9200
Abstract: hitachi mold cel CY7C199-VC cda 199 Hitachi CEL 9200 9200 hitachi 8361H JESD22
Text: Cypress Semiconductor Package Qualification Report QTP# 000405 VERSION 1.1 July, 2000 SOJ 28 Leads Hitachi Cel 9200 Molding Compound Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069
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85C/85
CY7C199-VC
cel 9200
hitachi mold cel
CY7C199-VC
cda 199
Hitachi CEL
9200
9200 hitachi
8361H
JESD22
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QMI509
Abstract: epoxy qualification CY7C199 JESD22 cda 199 Dexter SOJ package MSL
Text: Cypress Semiconductor Snap Cure Epoxy Qualification Report QTP# 002602 VERSION 1.1 January, 2001 28-lead SOJ and Narrow SOIC Package Level 3 Cypress Philippines CSPI-R CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069
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28-lead
CY7C199
CY6264-SNC
619907866M
619907866M1
QMI509
epoxy qualification
CY7C199
JESD22
cda 199
Dexter
SOJ package MSL
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CEL9200
Abstract: CY7C1019 CY7C1021 CY7C1021V sumitomo silver epoxy
Text: Cypress Semiconductor Qualification Report QTP# 97416 VERSION 1.0 June, 1998 1 Meg SRAM, R42D Technology, Fab 4 Qualification CY7C1021V 64K x 16 Static RAM CY7C1019V 128K x 8 Static RAM Cypress Semiconductor, Inc. 1 Meg SRAM - R42D Technology - Fab 4 Device: CY7C1021V/CY7C1019V 7C1321D/7C1319D
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CY7C1021V
CY7C1019V
CY7C1021V/CY7C1019V
7C1321D/7C1319D)
44-pin
CY7C1021)
32-pin
CY7C1019)
CEL9200
CY7C1019
CY7C1021
CY7C1021V
sumitomo silver epoxy
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Hitachi 32k static RAM
Abstract: CY7C192 CY7C197 CY7C199 top markings on hitachi 256k Static RAM SOJ package MSL
Text: Cypress Semiconductor Qualification Report QTP# 99011 VERSION 1.0 April, 1999 256K Static RAM, R28 Technology, Fab 2 CY7C191/192 64K x 4 Static RAM With Separate I/O CY7C194/195/196 64K x 4 Static RAM CY7C197 256K x 1 Static RAM CY7C199 32K x 9 Static RAM
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CY7C191/192
CY7C194/195/196
CY7C197
CY7C199
CY7C192
7C192H)
28-pin,
300-mil
CY7C192
CY7C0251-AC
Hitachi 32k static RAM
CY7C197
CY7C199
top markings on hitachi
256k Static RAM
SOJ package MSL
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7C1341A
Abstract: CY7C1041V33 CY7C1049V33 CY7C1049V33-VC
Text: Cypress Semiconductor Qualification Report QTP# 97396 VERSION 1.2 June, 1999 4 Meg SRAM, R42D Technology, Fab 4 Qualification CY7C1049V33 512K x 8 Static RAM CY7C1041V33 256K x 16 Static RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Marc Hartranft
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CY7C1049V33
CY7C1041V33
CY7C1049V/CY7C1041V
7C1349D/7C1341D)
CY7C1049V33/CY7C1041V33
36/44-pin0C,
CY7C1049V33-VC
30C/60
7C1341A
CY7C1041V33
CY7C1049V33
CY7C1049V33-VC
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CY62256LL-PC
Abstract: VIC068A-GC VIC64-NC VIC64-UMB PALCE22V10-JI PALC16L8Q PLD VME A113 CY7B923 JESD22-A113
Text: Cypress Semiconductor Product Reliability 1997 Published June, 1997 CYPRESS SEMICONDUCTOR PRODUCT RELIABILITY TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS SEMICONDUCTOR TOTAL QUALITY MANAGEMENT SYSTEM. 1 2.0 ELECTRICAL AVERAGE OUTGOING QUALITY. 2
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PALCE22V10-JC
FLASH-FL22D
CY62256LL-PC
VIC068A-GC
VIC64-NC
VIC64-UMB
PALCE22V10-JI
PALC16L8Q
PLD VME
A113
CY7B923
JESD22-A113
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SOJ package MSL
Abstract: 7C109A CY7C109 JESD22 R42HD R42HD FAB4
Text: Cypress Semiconductor Qualification Report QTP# 98085 VERSION 1.0 June, 1998 1 Meg SRAM, R42HD Technology, Hot Aluminum CY7C109/CY7C1009 128K x 8 SRAM 5V Operation Cypress Semiconductor, Inc. 1 Meg SRAM - R42HD Technology, Hot Al - Fab 4 Device: CY7C109 (7C109H)
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R42HD
CY7C109/CY7C1009
CY7C109
7C109H)
R42HD
32-pin,
400-mil
SOJ package MSL
7C109A
CY7C109
JESD22
R42HD FAB4
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CY7C1049
Abstract: CY7C1041 JESD22 9200 hitachi 98248
Text: Cypress Semiconductor Qualification Report QTP# 98248 VERSION 1.0 June, 1998 4 Meg SRAM, R42HD Technology 5V operation CY7C1049 512K x 8 Static RAM CY7C1041 256K x 16 Static RAM Cypress Semiconductor, Inc. 4 Meg SRAM - R42HD Technology - Fab 4 Device: CY7C1049 (7C1549A)
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R42HD
CY7C1049
CY7C1041
7C1549A)
R42HD
36-pin,
400-mil
CY7C1049
CY7C1041
JESD22
9200 hitachi
98248
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land pattern for TSOP 2 86 PIN
Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS
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CY7C1041BV33
Abstract: CY7C1046BV33 CY7C1049BV33
Text: Cypress Semiconductor Product Qualification Report QTP# 000305 VERSION 1.0 March, 2000 4 Meg Asynchronous SRAM R52D-3 Technology at Fab 4 CY7C1041BV33 256K x 16 Static RAM CY7C1046BV33 1M x 4 Static RAM CY7C1049BV33 512K x 8 Static RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:
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R52D-3
CY7C1041BV33
CY7C1046BV33
CY7C1049BV33
CY7C1041BV33/CY7C1046BV33/CY7C1049BV33
CY7C1049BV33
R52-3D
CY7C1049B-----------------------STRESS:
CY7C1329-AC
CY7C1041BV33
CY7C1046BV33
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SOJ 44 PCB land
Abstract: SOJ package MSL QFP 128 bonding tsop package MSL 48 pin ic qfj HQFP208 R400 S115 ED-7401-2 TSOP II 54 Package
Text: 1. パッケージの分類 1. パッケージの分類 1 1-1. パッケージの動向 - 2 1-2. パッケージの分類 - 5 1-3. パッケージの種類と特徴 - 7
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ba732
Abstract: COBCHIP ON BOARD ED-7303 QFP 128 bonding
Text: 作成： 前回作成： 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 1 章 パッケージの分類 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 1 章部分とな
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QMI 509 epoxy
Abstract: SUMITOMO eme-6600hr 6600HR SOJ package MSL QMI 509 epoxy datasheet CY7C63001A-SC JESD22 EME6600HR mold compound EME 6600HR
Text: Cypress Semiconductor Package Qualification Report QTP# 023401 VERSION 2.0 GI July, 2004 32-lead SOIC package using Sumitomo EME 6600HR Mold Compound, MSL1 Cypress Philippines CML-R CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Principal Reliability Engineer
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32-lead
6600HR
28-44lead
635mils
01BLL-SI
610221877M
CY62128BLL-SI
QMI 509 epoxy
SUMITOMO eme-6600hr
SOJ package MSL
QMI 509 epoxy datasheet
CY7C63001A-SC
JESD22
EME6600HR
mold compound
EME 6600HR
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mil-std 883d method 1010
Abstract: No abstract text available
Text: QUALITY & RELIABILITY CYPRESS 2001 Q1 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination
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tsop 928
Abstract: No abstract text available
Text: QUALITY & RELIABILITY CYPRESS 2001 Q2 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination
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Untitled
Abstract: No abstract text available
Text: QUALITY & RELIABILITY CYPRESS 2000 Q4 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination
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cmos tsmc 0.18
Abstract: reliability data analysis report failure test report
Text: QUALITY & RELIABILITY CYPRESS 2000 Q3 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination
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cmos tsmc 0.18
Abstract: No abstract text available
Text: CYPRESS QUALITY & RELIABILITY 2000 Q2 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination
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Untitled
Abstract: No abstract text available
Text: Mounting Conditions Date: 2013.10.03 The following information is used for the reflow conditions of Lyontek Products, and please follows the package type to choose the suitable conditions. All the conditions are compliant with JEDEC J-STD-020 and IPC-1066.
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J-STD-020
IPC-1066.
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tqfp 10x10 tray
Abstract: tqfp 14x14 tray QFN tray Tube 4-400 tray tqfp 14x14 1.4 156 QFN 12X12 LQFP 48 Package Box A7 SOT-89 HS-2000-1 QFN Shipping Trays
Text: The Operation Instruction of Packing Materials Purpose Warehouse and subcontractors according to the instruction for purchasing and incoming inspection , formulate the Operation Instruction of Packing Materials. Scope Related all packing materials in warehouse.
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SMD IC 2025 bl
Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
Text: J2T0011-38-60 ま え が き 平素は「沖半導体製品」を御愛用いただき厚く御礼 申し上げます。 エレクトロニクス分野におきましては 半導体製品 の応用はますます広がりをみせており、その性能 機
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J2T0011-38-60
Copyright1998OKIELECTRICINDUSTRYCO.
J2T0002-38-60
BGA-388
BGA-420
2144-9028-01-X5X1
MIL-M-38510
MIL-STD-883
SMD IC 2025 bl
ssop64
D560
MK 50075 N
QFP Package 128 lead .5mm
DIP16-C-300-2
R400
S115
960f
FPQ20
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Untitled
Abstract: No abstract text available
Text: MI TS UB IS HI L S I s MH2 M3 6 C J - 8 , —1 O 7 5 4 9 7 4 7 2 - B I T a 0 9 7 l5 2 - W 0 n D B Y 3 6 -B IT D Y N A M lC RAM DESCRIPTION The M1I2M36CJ is 2097152 vordX36bit dynamic RAM. This consists ehight industry standard 1MX1 dy namic RAXis in SOJ and sixteen industry standard
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OCR Scan
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MH2M36C
M1I2M36CJ
vordX36bit
MII2M36CJ-8
MH2M36C
MH2M36CJ)
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