SOLDER BALLS Search Results

V356

Contextual Info: NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ASME Y14.5M-1994. 2. THE BASIC SOLDER BALL GRID PITCH IS 1.27mm. 3. THE MAXIMUM SOLDER BALL MATRIX SIZE IS 20 X 20. 4. THE MAXIMUM ALLOWABLE NUMBER OF SOLDER BALLS IS 400. A A 8

Contextual Info: UNLESS OTHERWISE SPECIFIED ALIL DIMENSIONS AND TOLERANCES CONFORM TO A3ME Y14.6M -19B4. THE BASIC SOIDER BALL GRID PITCH IS O.&Omm. THE MAXIMUM SOLDER BAN. MATRIX SIZE IB 10 X 10. THE MAXIMUM ALLOWABLE NUMBER OF SOLDER BALLS IS 100. DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER.

ph0n

Contextual Info: B O TTO M VIEW 2 4 0 SO LD ER BALLS NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ASME Y14.5M -1994. 2. THE BASIC SOLDER BALL GRID PITCH IS 1.00mm. 3. THE MAXIMUM SOLDER BALL MATRIX SIZE IS 18 X 18. 4. THE MAXIMUM ALLOWABLE NUMBER OF SOLDER BALLS IS 324.

all ic data

Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
Contextual Info: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile

all ic data

Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
Contextual Info: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile

Intel reflow soldering profile BGA

Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Contextual Info: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.

c 6090

Abstract: IPC-A-610 k type thermocouple Thermocouple Type K oven 65psi
Contextual Info: Lead Free Solder Reflow Profile - SMD Trimpot Products Process Description Materials 1. Apply solder paste to test board 8 - 10 mil thick Temperature Time Interval • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Alloy water soluble or no clean solder paste

mutoh ip-220

Contextual Info: Database for Properties of Lead-Free Solder Alloys DATABASE FOR PROPERTIES OF LEAD-FREE SOLDER ALLOYS Version 1.0 This database is a joint project of ELFNET and COST 531 Action. COST 531 ACTION ON LEAD-FREE SOLDER ALLOYS EURPEAN LEAD-FREE SOLDERING NETWORK

all ic data

Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
Contextual Info: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as

C 6090

Abstract: g10 smd transistor SMD g10 Water soluble water soluble cleaning reflow profile 245 solder paste
Contextual Info: Lead Free Solder Reflow Profile - SMD Trimmers Process Description 1. Apply solder paste to test board 8 - 10 mil thick Materials Time Interval Temperature • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Alloy water soluble or no clean solder paste (see note 1)

smema specifications

Abstract: smema AN038 smema control EAN-102068
Contextual Info: DESIGN APPLICATI0N NOTE - AN038 Solder Reflow Recommendations Sn/Pb and Pb Free for Plastic RFICs Overview The stages used in a solder profile We are often asked what the solder reflow profile should be for SMDI devices mounted on PCB’s using high volume production equipment. The reflow profile is

IPC-610A

Abstract: 65psi
Contextual Info: Lead Free Solder Reflow Profile – SMD Trimmers Process Description Materials Temperature 1. Apply solder paste to test board 8 - 10 mil thick • Sn Ag Cu Alloy water soluble or no clean solder paste1 • Single sided epoxy glass (G10) (UL approved) • PC board approx. 4x4x.06 in.

Contextual Info: Solder reflow recommendations Solder reflow profiles consist of four stages. They are: • Preheat • Pre-flow • Reflow • Cool down It is critical to have the rate of temperature change, maximum temperature, and time duration within each stage controlled to create solder joints that have flowed properly. An example of a

a6xb

Contextual Info: NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO DATUM PLANE Z. 4. DATUM Z SEATING PLANE IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.

BB1110B7

Abstract: BB1110B13
Contextual Info: 4200 Bonita Place, Fullerton, CA 92635 BB1110B AND BB2110DI -DDR SRAM TERMINATOR NETWORKS. DESCRIPTION Networks are designed to terminate SSTL_2 Class I and Class II systems. Networks use thick film resistors with high temperature solder balls. With solder balls on resistor side no via connection and ceramic substrate

r2km

Contextual Info: D X Y F 4X R2 NOTES: 1. DIMENSIONS IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO DATUM PLANE Z. 4. DATUM Z SEATING PLANE IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.

Contextual Info: D X F DETAIL K NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO DATUM PLANE Z. 4. DATUM Z SEATING PLANE IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.

senju solder paste

Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.3 SOLDER SUPPLY PROCESS 2.3.1 SOLDER PASTE 1 Material Composition Soldering paste is mainly made from soldering powder and flux. Soldering powder makes up approximately 80-95wt% of soldering paste

Rosin Flux Type RMA

Contextual Info: VJ Soldering Recommendations Vishay Surface Mount Multilayer Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 6. Soldering With a Solder Iron: A. Our tin-plated termination terminations code “X” is recommended for all attachment methods which use solder.

vapor condensation cooling

Abstract: 45034
Contextual Info: VJ Soldering Recommendations Vishay Surface Mount Multilayer Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 6. Soldering With a Solder Iron: A. Our tin-plated termination terminations code “X” is recommended for all attachment methods which use solder.

90Pb 10Sn solder paste

Abstract: underfill with or without underfill Flip Chip Substrate nitto chip
Contextual Info: APPLICATION NOTE Solder bumped ICs AN01028 Philips Semiconductors Application information Solder bumped ICs AN01028  Koninklijke Philips Electronics N.V. 2001 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright

Contextual Info: 新製品紹介 実装接合用Cuコア鉛フリーはんだボール Cu Cored Pb-Free Solder Ball for Solder Jointing Cu cored Pb-free solder ball：CNSA3A5C, CNSAC タブレット端末に代表されるよう めっきが均一に施されており滑らか

Vitramon

Abstract: vitramon VJ
Contextual Info: VJ Soldering Recommendations Vishay Vitramon Multilayer Ceramic Chip Capacitors Speciality Products SOLDERING RECOMMENDATIONS 1. Termination Selection: 6. Soldering With a Solder Iron: A. Our tin-plated termination terminations code “X” is recommended for all attachment methods which use solder.

solder mask

Abstract: BGA NSMD ball Application Note 1126 BGA
Contextual Info: Solder Mask and Trace Recommendations for FBGAs Application Note By Rudy Sterner 1. Abstract This application note provides recommendations for solder masks used with FBGAs and escape considerations for traces. The recommendations reflect current industry practices. As always, it is a good idea