SOLDER WITH FLUX Search Results

copper wire s.w.g 22

Abstract: swg copper wire 18SWG EN29454 EN29453 22swg swg copper wire datasheet 22 swg copper wire Halide 43C501D
Contextual Info: SOLDERING SOLDER WIRES, Flux-cored HAND LEAD-FREE SOLDER, ROSIN-FREE FLUX Lead-free solder wires employing a rosin colophony free flux conforming to EN29454. Ideal alternatives for tin/lead cored solder wires in most applications. Offered in a choice of two alloys, these solder wires can be used with existing processes, with minor increases to bit temperatures.

Contextual Info: PCMCIA and CompactFlash Connectors with Solder-Flux Bearing Leads Innovative, award winning technology. Solder-Flux Bearing Lead Connector Soldering Equipment Reduced applied cost with increased output. Interconnection Systems •* H#1' , f f / / ^ ,_

Contextual Info: PC Card and CompactFlash Connectors with Solder-Flux Bearing Leads Innovative, award winning technology. Interconnection Systems ▲ A precise amount of flux-core solder ▲ Proven, consistent solder-joint reliability attached to each lead allows automated soldering

TEKAS00056

Contextual Info: PC Card and CompactFlash Connectors with Solder-Flux Bearing Leads Innovative, award winning technology. Interconnection Systems ▲ A precise amount of flux-core solder ▲ Proven, consistent solder-joint reliability attached to each lead allows automated soldering

Senju

Abstract: H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste SPT-70-OF-2063 Ultrasonic flow
Contextual Info: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).

Senju

Abstract: SPT-70-OF-2063 senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A
Contextual Info: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).

7528A1317

Abstract: ansi-j-std-006 raychem cable D60709
Contextual Info: CUSTOMER DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI-J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004. 3. TERMINATOR BODY: Copper alloy, solder- plated.

ANSI-J-STD-006

Abstract: raychem cable 7528A1317 HEATSHRINKABLE solder SLEEVE
Contextual Info: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI-J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004. 3. TERMINATOR BODY: Copper alloy, solder- plated.

PBT-GF30-FR

Abstract: precidip 110 93 330 Preci-Dip Durtal SA C17200 CH-2800 110-PP-308-41-001001 299-PP-312-XX-001001 15X-PP-632-00-XXX001
Contextual Info: Quick Selector Chart DIL / SIL / TO Sockets DIL Grid 2.54 mm 1.778 mm Sockets Solder tail DIL Sockets 101 102 Solder tail with decoupling capacitor 103 Solder tail ultralow profile 109 Solder tail interconnect 110 Surface mount pick and place Solderless press-fit

Soldering Conditions

Abstract: soldering
Contextual Info: Recommended soldering conditions of EOREX Pb-Free products 1 Surface Mount Type SMD IR reflow with a peak temperature of 260°C Wave soldering with molten solder in a 260°C soldering bath Partial lead heating via a 350°C solder iron tip 2 Through Hole Type (THD) Wave soldering with molten solder in a 260°C soldering bath

Contextual Info: Lead Free Solder Page 1 of 2 Lead Free Solder Sn99 4901 99.3% tin and 0.7% copper M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Cu Tin/Copper alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to

J-STD-006

Abstract: D-110-35 ANSI-J-STD-004 ANSI-J-STD 004
Contextual Info: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyvinylidene fluoride. Maximum Recovered I.D. - 0.76 0.030 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006.

Raychem splice

Abstract: ANSI-J-STD-006 RT-1404 raychem rt-1404 Raychem Specification RT-1404
Contextual Info: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyvinylidene fluoride. Recovered I.D.: 1.90 0.075 max. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI-J-STD-006. FLUX:

bellcore GR-78

Abstract: J-STD-006 SAC305
Contextual Info: Lead Free Solder SAC305 Page 1 of 2 Lead Free Solder Sn96 SAC 305 4900 96.3% tin, 0.7% copper and 3% silver M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder.

murata chip suppression filter NFA

Abstract: NFA81
Contextual Info: 2. Solder Paste Printing and Adhesive Application When reflow soldering the chip EMI suppression filter, the printing must be conducted in accordance with the following cream solder printing conditions. If too much solder is applied, the chip will prone to be

J-STD-004

Abstract: J-STD-006 D-129-05
Contextual Info: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI J-STD-004. APPLICATION

Contextual Info: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyolefin. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004. APPLICATION

J-STD-006

Abstract: J-STD-004 raychem heat shrinkable sleeve J-STD-004 SN63 rol1 06090 ansi-j-std-006
Contextual Info: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI J-STD-004. APPLICATION

06090

Abstract: J-STD-006 ansi-j-std-006 raychem solder sleeve ANSI-J-STD-004
Contextual Info: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn96 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004. APPLICATION

J-STD-006

Abstract: 06090 ansi-j-std-006 J-STD-004 solder sn63 j-std-004
Contextual Info: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI J-STD-004. APPLICATION

Raychem splice

Abstract: J-STD-006
Contextual Info: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004.

IR-1052

Abstract: J-STD-006 ansi-j-std-004 a solder wire
Contextual Info: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROM1 per ANSI-J-STD-004. APPLICATION

D-110

Abstract: J-STD-006 ANSI-J-STD-004 HEATSHRINKABLE solder SLEEVE
Contextual Info: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat-shrinkable, transparent blue, radiation cross-linked modified polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI-J-STD-004.

thermofit insulation

Contextual Info: SPECIFICATION CONTROL DRAWING MATERIALS 1. INSULATION SLEEVE: Heat shrinkable, transparent blue, radiation cross-linked polyvinylidene fluoride. 2. SOLDER PREFORM WITH FLUX: SOLDER: TYPE Sn63 per ANSI J-STD-006. FLUX: TYPE ROL1 per ANSI J-STD-004. APPLICATION