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    SOT1263 Search Results

    SOT1263 Datasheets (2)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SOT1263
    NXP Semiconductors Reflow soldering footprint SOT1263 Original PDF 285.91KB 1
    SOT1263
    NXP Semiconductors Microlead ultra small surface-mounted plastic package; 3 leads Original PDF 316.11KB 1

    SOT1263 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of SOT1263 package SOT1263 1.4 0.9 0.9 0.5 0.4 0.3 2x (2×) (2×) 0.375 0.15 (2×) 0.2 0.25 (2×) 0.3 0.35 (2×) 0.4 0.45 solder land solder land plus solder paste solder paste deposit


    Original
    OT1263 OT1263 sot1263 PDF

    Contextual Info: Package outline Microlead ultra small surface-mounted plastic package; 3 leads SOT1263 I A c L HE D B A 1 3 e b 2 E bp 0.08 A B 0.08 A B 0.5 Dimensions Unit 1 mm scale A 1 b bp c D E e HE L I max 0.40 0.28 0.20 0.17 0.85 0.65 0.40 1.05 0.15 0.20 nom 0.37 0.22 0.15 0.12 0.80 0.60


    Original
    OT1263 sot1263 PDF