SOT27 Search Results

DIP14

Abstract: DIP-14 SOT27-1 MAR111
Contextual Info: Philips Semiconductors Package outlines DIP14: plastic dual in-line package; 14 leads 300 mil 1995 Mar 11 1 SOT27-1

FERROXCUBE 4330

Abstract: FERROXCUBE 4330-030 MSM88 uhf amplifier BGY114D BGY114E HB 100B
Contextual Info: Product specification Philips Semiconductors UHF amplifier modules BGY114D; BGY114E FEATU RES PINNING - SOT278A • 12.5 V nominal supply voltage PIN DESCRIPTION • 6 W output power 1 RF input • Easy control of output power by DC voltage. 2 Vsi 3 Vc 4 Vs2

sot27-1

Abstract: MO-001AA
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline DIP14: plastic dual in-line package; 14 leads 300 mil SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

sot274

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane SDIP64: plastic shrink dual in-line package; 64 leads 750 mil SOT274-1 ME D A2 A L A1 c e Z b1 (e 1) w M MH b 33 64 pin 1 index E 1 32 5 10 mm scale DIMENSIONS (mm are the original dimensions)

4330-030

Abstract: UHF amplifier module BGY201 SC09
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET BGY201 UHF amplifier module Product specification Supersedes data of June 1994 File under Discrete Semiconductors, SC09 1996 May 22 Philips Semiconductors Product specification UHF amplifier module BGY201 FEATURES PINNING - SOT278A

SSOP20 300 mil

Abstract: DIP20 SC603 Package Outline philips ic06
Contextual Info: INTEGRATED CIRCUITS DATA SHEET Package outline drawings January 1996 File under Integrated Circuits, IC06 Philips Semiconductors Package outline drawings INDEX PACKAGE VERSIONS DESCRIPTION PAGE DIP SOT27-1 plastic dual in-line package; 14 leads 300 mil 3

HEF4069UBP

Abstract: HEF4069UBT HEF4069 7Z84371 BAW62 HEF4069UB HEF4069UBD HEF4069UBPN
Contextual Info: HEF4069UB gates HEX INVERTER The HEF4069UB is a general purpose hex inverter. Each o f the six inverters is a single stage. Vdd I b D ii 06 I5 °5 U o4 HEF4069UB 0i I2 O2 I3 O3 Vss 7Z73695 _ Fig. 2 Pinning diagram. HEF4069UBP N : 14-lead DIL; plastic (SOT27-1)

SDIP64

Contextual Info: PDF: 2003 Feb 18 Philips Semiconductors Package outline seating plane SDIP64: plastic shrink dual in-line package; 64 leads 750 mil SOT274-1 ME D A2 A L A1 c e Z b1 (e 1) w M MH b 33 64 pin 1 index E 1 32 5 10 mm scale DIMENSIONS (mm are the original dimensions)

MO-001

Abstract: sot27
Contextual Info: PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP14: plastic dual in-line package; 14 leads 300 mil SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads SOT278B D A F y U q q1 A U2 E U1 p L 1 2 3 4 bp e2 e1 w M e 10 c v A Z Q 20 mm scale DIMENSIONS mm are the original dimensions

sot279a

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline Flanged double-ended ceramic package; 2 mounting holes; 4 leads SOT279A D A F 5 D1 U1 B q C w2 M C M H1 1 c 4 E1 H U2 E A 2 w1 M A M B M p 3 w3 M b Q e 5 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions

MLD233

Abstract: 2322 731 2222 101 18103 transistor c5 5XL10 BLV946 ferroxcube 4322 philips 18103
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET BLV946 UHF power transistor Product specification Supersedes data of 1995 Jun 29 1997 Oct 30 Philips Semiconductors Product specification UHF power transistor BLV946 FEATURES PINNING - SOT273A • Internal input and output matching for easy matching,

Contextual Info: Package outline seating plane SDIP64: plastic shrink dual in-line package; 64 leads 750 mil SOT274-1 ME D A2 A L A1 c e Z b1 (e 1) w M MH b 33 64 pin 1 index E 1 32 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1

Contextual Info: Package outline Flanged ceramic package; 2 mounting holes; 6 leads SOT273A D A F D1 U1 B q C H1 w2 M C M b1 2 c 4 6 E1 H E U2 1 A 3 5 w1 M A M B M p Q w3 M b e 5 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions UNIT

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane SDIP42: plastic shrink dual in-line package; 42 leads 600 mil SOT270-1 ME D A2 L A A1 c e Z b1 (e 1) w M MH b 22 42 pin 1 index E 1 21 5 10 mm scale DIMENSIONS (mm are the original dimensions)

SDIP42

Contextual Info: Philips Semiconductors Package outlines SDIP42: plastic shrink dual in-line package; 42 leads 600 mil 1995 Feb 04 5-8 SOT270-1

MS-020

Abstract: SDIP42
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane SDIP42: plastic shrink dual in-line package; 42 leads 600 mil SOT270-1 ME D A2 L A A1 c e Z b1 (e 1) w M MH b 22 42 pin 1 index E 1 21 5 10 mm scale DIMENSIONS (mm are the original dimensions)

sot273a

Abstract: u21a
Contextual Info: PDF: 1999 Oct 07 Philips Semiconductors Package outline Flanged ceramic package; 2 mounting holes; 6 leads SOT273A D A F D1 U1 B q C H1 w2 M C M b1 2 c 4 6 E1 H E U2 1 A 3 5 w1 M A M B M p Q w3 M b e 5 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions

SDIP64

Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane SDIP64: plastic shrink dual in-line package; 64 leads 750 mil SOT274-1 ME D A2 A L A1 c e Z b1 (e 1) w M MH b 33 64 pin 1 index E 1 32 5 10 mm scale DIMENSIONS (mm are the original dimensions)

PHILIPS OQ 0501

Abstract: philips OQ 051 oq 0066 oq 0051 PHILIPS 036 M/HD 780 footprint jedec MS-026 TQFP mo-001 packages philips
Contextual Info: Philips Semiconductors Package information Package outlines INDEX DESCRIPTION NAME VERSION PAGE DIP dual in-line package plastic dual in-line package; 8 leads (300 mil) plastic dual in-line package; 14 leads (300 mil) SOT97-1 1327 SOT27-1 1328 DIP16 plastic dual in-line package; 16 leads (300 mil); long body

Contextual Info: SOT279A CDFM4; blister pack; standard product orientation 12NC ending 112 Rev. 1 — 16 November 2012 Packing information 1. Packing method Blister cover ESD Label Foam Blister bottom ESD Label Printed plano box Space for additional label Preprinted ESD warning

Contextual Info: Package outline SDIP64: plastic shrink dual in-line package; 64 leads 750 mil ; face down SOT274-2 seating plane D ME A2 A L A1 e Z w b1 M c (e1) MH b 1 32 pin 1 index E 64 33 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 min A2

Contextual Info: Package outline DIP14: plastic dual in-line package; 14 leads 300 mil SOT27-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b MH 8 14 pin 1 index E 1 7 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1

SDIP64

Abstract: 750-mil
Contextual Info: Philips Semiconductors Package outlines SDIP64: plastic shrink dual in-line package; 64 leads 750 mil 1995 Feb 04 5-9 SOT274-1