SOT310 Search Results

MS-022

Abstract: QFP80
Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 20 x 3 mm SOT310-1 c y X A 64 41 65 40 ZE e A A2 E HE (A 3) A1 θ wM Lp bp pin 1 index L 25 80 detail X 24 1 wM bp e ZD v M A

QFP80

Contextual Info: Philips Semiconductors Package outlines QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 20 x 3.0 mm 1995 Feb 04 5-24 SOT310-1

Contextual Info: Package outline QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 20 x 3 mm SOT310-1 c y X A 64 41 65 40 ZE e A A2 E HE (A 3) A1 wM θ Lp bp pin 1 index L 25 80 detail X 24 1 wM bp e ZD v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

b0246

Abstract: PH2955T 045H2 SMCP055 SGS-Ates B0246A B0-246 MJE2955T ST MJE2901K MJE2955K
Contextual Info: POWER SILICON PNP Item Number Part Number I C 5 10 15 20 >= 30 SOT3805 SOT3825 SOT3825 SOT3825 SOT3105 SOT3115 SOT3125 ST29051 ~gH~g~ 35 40 SOT3807 SOT3827 SOT3827 SOT3827 2SB871A 2SB936A 2SB948A 2SB896A ~~~~~~~ 45 50 SK3183 BOW22 B0664 B0664 B0246 B0206

sot310

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 20 x 3.0 mm SOT310-1 c y X A 64 41 65 40 ZE e E HE A A2 (A 3) A1 θ wM Lp bp pin 1 index L 25 80 detail X 24 1 wM bp e ZD v M A

QFP80

Abstract: jedec QFP80 MS-022 QFP80 16 24
Contextual Info: PDF: 2000 Jan 20 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 20 x 3.0 mm SOT310-1 c y X A 64 41 65 40 ZE e E HE A A2 (A 3) A1 θ wM Lp bp pin 1 index L 25 80 detail X 24 1 wM bp e ZD v M A

VSXO162

Abstract: V68D VNC2 one chip tv ic QFP80 MHA495
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA9715H/A Y/C one-chip processor VHS standard Product specification Supersedes data of August 1993 File under Integrated Circuits, IC02 1996 Oct 21 Philips Semiconductors Product specification Y/C one-chip processor (VHS standard)

TQFP80 footprint dimensions

Abstract: QFP44 footprint STK403-040
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mute detector

Abstract: trick BT 140 TDA9715H VID 200-12 S4 FB G044 3T24 AG34 VS38 din 45324
Contextual Info: NAPC/PHILIPS SEMICOND b3E D m b b S B ^ M ÜÜ77L7M G23 M S I C 3 Philips Semiconductors Preliminary specification Y/C one-chip processor VHS standard TDA9715H/A FEATURES • Luminance noise reduction (YNR) • Chrominance noise reduction (CNR) • Saturation dependent writing

Philips tea1090

Abstract: tea1090 tea1402 pcf2705p philips TEA1090T SAA7321GP TDA2579A LMT 393 N TDA3653bq TEA5713
Contextual Info: PHILIPS SEMICONDUCTORS PRODUCT DISCONTINUATION NOTICE NUMBER DN-41 DATED JUNE 30, 1999 EXHIBIT 'A' PHILIPS PHILIPS PHILIPS PART NUMBER PKG PART DESCRIPTION PHILIPS LAST TIME LAST TIME REPLACEMENT STATUS 12 NC NUMBER BUY DATE DLVY DATE PART CODES COMMENTS

HITEX TELETEST 51

Abstract: P83C852 Ashling CTS51 AVCASE51 icemaster-pe S87C00KSD OM4272 80C552 interfacing AN429 TrackPoint
Contextual Info: Philips Semiconductors 80C51-Based 8-Bit Microcontrollers CONTENTS IC20: 80C51-BASED 8-BIT MICROCONTROLLERS Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

pp td 40

Abstract: AG55-57 d2004-3 sot310 vs38
Contextual Info: INTEGRATED CIRCUITS im m mm TDA9715H/A Y/C one-chip processor VHS standard Preliminary specification Supersedes data of November 1992 File under Integrated Circuits, IC02 August 1993 Philips Semiconductors PHILIPS Philips Semiconductors Preliminary specification

tip340

Abstract: 2sb705 nec BUW23 2sA747A sanken 2SA747A BUW32A B0246C 2SB705 BOX20 2SA747 sanken
Contextual Info: POWER SILICON PNP Item Number Part Number I C 5 10 15 20 25 30 35 40 >= 50 2SA747 2SA747 2SA878 2SA1067 2SA1040 TIP340 2SA1072 2SA1077 2~1:J10;j2K 55 60 2SB955K 2SA1007 2SA1232R 2SA1232Q 2SA1232P 2N6231 BOX20 BOX20 2SA747A ~~p~~1U6 65 70 2SB705 2SB863 2SA1265

SOT411

Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Contextual Info: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors