SOT38 Search Results

Contextual Info: Package outline DIP16: plastic dual in-line package; 16 leads 300 mil ; long body SOT38-1 ME seating plane D A2 A A1 L e Z b1 c w M (e 1) b MH 9 16 pin 1 index E 1 8 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT

SOT385-1 package outline

Abstract: pllmc
Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline PLLMC: plastic leadless module carrier SOT385-1 A1 D A2 A E1 α E A D1 A3 A Cross section A-A not to scale 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 A2 A3 D (1) D1(1) E (1)

SOT382-1

Abstract: MS-022 QFP100 jedec QFP100
Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.6 mm ; body 14 x 20 x 2.8 mm SOT382-1 c y X A 80 51 50 81 ZE e E HE A A2 A1 (A 3) θ wM Lp bp pin 1 index 100 L 31 detail X 30 1 wM bp e v M A

sot382

Contextual Info: PDF: 1999 Nov 16 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT382-2 c y X 80 A 51 50 81 ZE e A E HE A2 A1 (A3) θ wM Lp bp pin 1 index 100 1 L 31 detail X 30 ZD wM bp e

MO-047-AA

Abstract: 047-AA plcc20 jedec A319 MO-047AA SOT380-1
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline PLCC20: plastic leaded chip carrier; 20 leads SOT380-1 eD y eE X bp A 14 18 b1 ZE 13 19 w M 20 HE E 1 pin 1 index A e 3 A4 9 β A1 A 3 k 4 8 Lp v M A ZD e D detail X B HD v M B 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

lqfp44 package outline

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline LQFP44: plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm SOT389-1 c y X 33 23 A 34 22 ZE e E HE A A2 A 3 A1 wM θ pin 1 index bp 44 Lp L 12 detail X 11 1 ZD e v M A wM bp D B HD

sot388b

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline Rectangular single-ended surface-mount package; metal cap; 4 in-line leads SOT388B U A y D U1 E 1 2 3 L1 4 L b Z e c w M e1 e 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A b c D e e1

Contextual Info: HCS410/WM KEELOQ Crypto Read/Write Transponder Module FEATURES PACKAGE TYPES SOT385 Security HCS410/WM • Two programmable 64-bit encryption keys • 16/32-bit bi-directional challenge and response using one of two keys • Programmable 32-bit serial number

MO-001

Contextual Info: PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP16: plastic dual in-line package; 16 leads 300 mil ; long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Transponder immobilizer

Abstract: immobilizer transponder Immobilizer Base station ZA93 Transponder PPM 125KHz sot385 Transponder immobiliser Immobilizer Control Unit home security burglar alarm system diagram definition of Immobilizer
Contextual Info: M HCS410/WM Crypto Read/Write Transponder Module FEATURES PACKAGE TYPES Security SOT385 HCS410/WM • Two programmable 64-bit encryption keys • 16/32-bit bi-directional challenge and response using one of two keys • Programmable 32-bit serial number • Three IFF encryption algorithms

Contextual Info: Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 e ZD w M bp v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: Package outline PLCC20: plastic leaded chip carrier; 20 leads SOT380-1 eD y eE X bp A 14 18 b1 ZE 13 19 w M 20 HE E 1 pin 1 index A e 3 β A4 9 A1 A 3 k 4 8 Lp v M A ZD e D detail X B HD v M B 5 10 mm scale DIMENSIONS (mm dimensions are derived from the original inch dimensions)

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TQFP100 package SOT386-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: Package outline SQFP128: plastic shrink quad flat package; 128 leads lead length 1.6 mm ; body 14 x 20 x 2.72 mm SOT387-3 c y X A 65 64 102 103 e E HE A A2 A1 (A 3) wM pin 1 index L 128 38 1 39 detail X wM bp e θ Lp bp v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

A319

Contextual Info: PDF: 2000 Jan 05 Philips Semiconductors Package outline PLCC20: plastic leaded chip carrier; 20 leads SOT380-1 eD y eE X bp A 14 18 b1 ZE 13 19 w M 20 HE E 1 pin 1 index A e 3 A4 9 β A1 A 3 k 4 8 Lp v M A ZD e D detail X B HD v M B 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

sot386

Abstract: MA26
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD

uhf amplifier design

Abstract: w-TMB uhf amplifier BGY206 MSA486 SC09 MGD353 47VC
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET BGY206 UHF amplifier module Preliminary specification File under Discrete Semiconductors, SC09 1996 May 29 Philips Semiconductors Preliminary specification UHF amplifier module BGY206 FEATURES PINNING - SOT388A • 4.8 V nominal supply voltage

msa486

Abstract: MGD351 BGY122A BGY122B SC09 MGD350
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET BGY122A; BGY122B UHF amplifier modules Preliminary specification File under Discrete Semiconductors, SC09 1996 Apr 26 Philips Semiconductors Preliminary specification UHF amplifier modules BGY122A; BGY122B FEATURES PINNING - SOT388A

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP120: plastic quad flat package; 120 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm SOT383-1 c y X A 61 90 60 91 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L detail X pin 1 index 120 31 30 1 v M A ZD wM

sot382

Contextual Info: PDF: 1999 Jun 15 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.6 mm ; body 14 x 20 x 2.8 mm SOT382-1 c y X A 80 51 50 81 ZE e E HE A A2 A1 (A 3) θ wM Lp bp pin 1 index 100 L 31 detail X 30 1 wM bp e v M A

BGY122A

Abstract: BGY122B MG044
Contextual Info: Philips Semiconductors Preliminary specification UHF amplifier modules BGY122A; BGY122B FEATURES PINNING - SOT388A • Single 4.8 V nominal supply voltage PIN • 1.2 W output power DESCRIPTION 1 RF input • Easy control of output power by DC voltage 2 VC

SOT38

Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline DIP16: plastic dual in-line package; 16 leads 300 mil SOT38-9 ME seating plane D A2 A A1 L b1 e Z c w M (e1) b 9 16 MH b2 pin 1 index E 1 8 5 10 mm scale DIMENSIONS (mm dimensions are derived from the original inch dimensions)

TQFP100

Abstract: tQFP100 package MS-026 MS-026 tqfp100
Contextual Info: PDF: 2000 Feb 02 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD

BGY240S

Abstract: pn1999 snw-eq-608
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET M3D369 BGY240S UHF amplifier module Product specification Supersedes data of 1998 Nov 05 1999 Aug 23 Philips Semiconductors Product specification UHF amplifier module BGY240S FEATURES PINNING - SOT388C • 3.5 V nominal supply voltage