SOT516 Search Results

sot516

Contextual Info: PDF: 1999 Jun 07 Philips Semiconductors Package outline LFBGA56: plastic low profile fine-pitch ball grid array package; 56 balls; body 6 x 6 x 1.05 mm SOT516-1 D ball A1 index area A2 A E A1 detail X A b ∅w M y v A ZD e ZE K J H G e F E D C B A 1 2 3 4

SOT516

Abstract: LFBGA56
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline LFBGA56: plastic low profile fine-pitch ball grid array package; 56 balls; body 6 x 6 x 1.05 mm D SOT516-1 A B ball A1 index area A2 A E A1 detail X C e1 v M B b e y y1 C ∅w M v M A K J e H G F e1 E

Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10

Contextual Info: Philips Sem iconductors Product specification 64 macrocell CPLD with enhanced clocking FEATURES Table 1. PZ3064A/PZ3064D Features • Industry’s first TotalCMOS PLD - both CM OS design and process technologies PZ3064A/PZ3064D Usable gates • Fast Zero Power FZP™ design technique provides ultra-low

PZ3064AS10BP

Abstract: PZ3064DS10 PZ3064DS10BC
Contextual Info: INTEGRATED CIRCUITS PZ3064A/PZ3064D 64 macrocell CPLD with enhanced clocking Product specification Supersedes data of 1999 May 07 IC27 Data Handbook Philips Semiconductors 1999 Jun 16 Philips Semiconductors Product specification 64 macrocell CPLD with enhanced clocking

handbook philips ic26 packaging

Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Contextual Info: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors