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Catalog Datasheet	MFG & Type	Document Tags	PDF
sot516 Abstract: No abstract text available Text: PDF: 1999 Jun 07 Philips Semiconductors Package outline LFBGA56: plastic low profile fine-pitch ball grid array package; 56 balls; body 6 x 6 x 1.05 mm SOT516-1 D ball A1 index area A2 A E A1 detail X A b ∅w M y v A ZD e ZE K J H G e F E D C B A 1 2 3 4	Original	LFBGA56: OT516-1 sot516	PDF
SOT516 Abstract: LFBGA56 Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline LFBGA56: plastic low profile fine-pitch ball grid array package; 56 balls; body 6 x 6 x 1.05 mm D SOT516-1 A B ball A1 index area A2 A E A1 detail X C e1 v M B b e y y1 C ∅w M v M A K J e H G F e1 E	Original	LFBGA56: OT516-1 SOT516 LFBGA56	PDF
Untitled Abstract: No abstract text available Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10	Original	MBL179 BGA156 OT472-1 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA316	PDF
PZ3064AS10BP Abstract: PZ3064DS10 PZ3064DS10BC Text: INTEGRATED CIRCUITS PZ3064A/PZ3064D 64 macrocell CPLD with enhanced clocking Product specification Supersedes data of 1999 May 07 IC27 Data Handbook Philips Semiconductors 1999 Jun 16 Philips Semiconductors Product specification 64 macrocell CPLD with enhanced clocking	Original	PZ3064A/PZ3064D PZ3064A/PZ3064D 44-pin 56-ball 100-pin PZ3064AS10BP PZ3064DS10 PZ3064DS10BC	PDF
handbook philips ic26 packaging Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50 Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3	Original	AN01026 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA304 OT550-1 BGA316 handbook philips ic26 packaging AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50	PDF
JEDEC TRAY DIMENSIONS Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors	Original	manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package	PDF
Untitled Abstract: No abstract text available Text: Philips Sem iconductors Product specification 64 macrocell CPLD with enhanced clocking FEATURES Table 1. PZ3064A/PZ3064D Features • Industry’s first TotalCMOS PLD - both CM OS design and process technologies PZ3064A/PZ3064D Usable gates • Fast Zero Power FZP™ design technique provides ultra-low	OCR Scan	PZ3064A/PZ3064D PZ3064A/PZ3064D 44-pin 56-ball 100-pin	PDF