SOT531 Search Results

Contextual Info: Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e 1 2 shape optional 4x

BGA316

Abstract: MS-034
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C Y W V U T R P N M L K

BGA316

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M Y W V U T R P N M L K J H G F E D C B A

BGA316

Abstract: sot531
Contextual Info: PDF: 1999 Sep 14 Philips Semiconductors Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 D D1 ball A1 index A2 E1 E A A1 detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P N M L K J H G F E D C B A e 1 2

Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10

handbook philips ic26 packaging

Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Contextual Info: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

diagram lcd tv Philips 32

Abstract: high level block diagram for i2c controller jpeg encoder block diagram of digital TV RS-232 to i2c converter saa8 SAA8122 PR3001 digital DSC controller digital still camera controller
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA8122 Digital Still Camera Preliminary specification Supersedes data of File under Integrated Circuits, ICXX 1999 sep 01 Philips Semiconductors Preliminary specification Digital Still Camera SAA8122 FEATURES • Support a wide range of CCD VGA,SVGA,QGA,XGA,EQGA

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors