SOT570 Search Results

TFBGA180

Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm D SOT570-2 A B ball A1 index area A A2 E A1 detail X C e1 e ∅v M C A B b 1/2 e P N M L K J H G F E D C B A ball A1

Contextual Info: Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 1/2 e e ball A1 index area P N M L K J H G F E D C B A shape optional 4x y1 C ∅v M C A B

Contextual Info: Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls SOT570-3 A B D ball A1 index area E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b M M C C A B C y y1 C P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 2 3 4 5 6 7 8 9 10 11

TFBGA180

Abstract: TFBGA-180 e 1220 sot570
Contextual Info: PDF: 2000 Nov 02 Philips Semiconductors Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm D SOT570-2 A B ball A1 index area A E A2 A1 detail X C e1 v M B y y1 C ∅w M b e v M A P N M L K J H G F E D C B A

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT570-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT570-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

MO-216

Abstract: SOT-57 TFBGA180 TFBGA-180
Contextual Info: PDF: 2003 Jul 17 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 1/2 e e ball A1 index area P N M L K J H G F

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA180 package SOT570-3 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm D SOT570-2 A B ball A1 index area A E A2 A1 detail X C e1 e y1 C ∅v M C A B ∅wM C b 1/2 e y P N e M L K J H e2 G F 1/2 e E D C B ball A1 index area A 1

TFBGA180

Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 1/2 e e P N M L K J H G F E D C B A shape optional 4x

11-90

Abstract: TFBGA180 sot570
Contextual Info: PDF: 2000 Mar 08 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A P N M e L

intel date code marking NAND Flash

Abstract: ARMv5TE instruction set MLC nand 2012 153 ball eMMC memory flash controller usb state machine for ahb to apb bridge iNAND eMMC 4 41 emmc spi bridge emmc bga 162 LPC3130FET180
Contextual Info: LPC3130/3131 Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller Rev. 2 — 29 May 2012 Product data sheet 1. General description The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB 2.0 On-The-Go OTG , up to 192 KB SRAM, NAND flash controller, flexible external bus

LPC2000

Abstract: LPC2458 LPC2458FET180 TFBGA180 m81I
Contextual Info: LPC2458 Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface Rev. 02 — 25 November 2008 Product data sheet 1. General description NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bit

LPC24XX

Abstract: timer video tms 9937 LPC2478FBD208 mst 702 lf LPC2468 pcb LPC2478 ARM7TDMI motor driver ic 7324 LPC247x LPC2478 pcb LPC2468FBD208
Contextual Info: UM10237 LPC24XX User manual Rev. 04 — 26 August 2009 User manual Document information Info Content Keywords LPC2400, LPC2458, LPC2420, LPC2460, LPC2468, LPC2470, LPC2478, ARM, ARM7, 32-bit, Single-chip, External memory interface, USB 2.0, Device, Host, OTG, Ethernet, CAN, I2S, I2C, SPI, UART, PWM, IRC,

CE-ATA version 1.1

Contextual Info: LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals Rev. 3.5 — 11 October 2012 Preliminary data sheet 1. General description The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embedded

CE-ATA version 1.1

Abstract: NXP P60
Contextual Info: LPC1850/30/20/10 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller Rev. 3.1 — 15 December 2011 Preliminary data sheet 1. General description The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embedded

Contextual Info: LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals Rev. 2.1 — 23 September 2011 Objective data sheet 1. General description The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embedded

sdram pcb layout

Contextual Info: LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals Rev. 3 — 5 December 2011 Objective data sheet 1. General description The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embedded

voltage regulator 7133-1

Contextual Info: LPC1850/30/20/10 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller Rev. 3 — 6 December 2011 Preliminary data sheet 1. General description The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embedded

Contextual Info: LPC1850/30/20/10 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller Rev. 5.1 — 9 August 2012 Preliminary data sheet 1. General description The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embedded

LPC1778FET

Contextual Info: LPC178x/7x 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC Rev. 3 — 27 December 2011 Objective data sheet 1. General description The LPC178x/7x is an ARM Cortex-M3 based microcontroller for embedded applications

Contextual Info: LPC1850/30/20/10 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller Rev. 6.1 — 7 February 2013 Product data sheet 1. General description The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embedded

lpc13xx

Abstract: Tag 8506 4440 IC mp3 player circuit diagram emmc EXT_CSD ts 8808 bluetooth mp3 player circuit diagram 339pe
Contextual Info: D D R R A A A A A FT FT FT FT FT D R R A A FT FT FT FT A A R R D D D D R R A FT FT FT A A R R D D D R A F FT FT A A R R D D User manual D Rev. 1.03 — 27 May 2010 R R R LPC3130/31 User manual D D D UM10314 D FT FT A A R R D D D R A FT D R A Document information

lpc43

Contextual Info: LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals Rev. 3.4 — 4 September 2012 Preliminary data sheet 1. General description The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embedded