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Catalog Datasheet	Type	Document Tags	PDF
LFBGA324 Abstract: MO-205 Contextual Info: PDF: 2003 Feb 18 Philips Semiconductors Package outline LFBGA324: plastic low profile fine-pitch ball grid array package; 324 balls; body 16 x 16 x 1.2 mm A B D SOT571-1 ball A1 index area A E A2 A1 detail X C e1 1/2 e e ∅v M C A B b y1 C y ∅w M C V U	Original	LFBGA324: OT571-1 MO-205 LFBGA324 MO-205	PDF
LFBGA324 Abstract: MO-205 SOT571 LFBGA-324 Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline LFBGA324: plastic low profile fine-pitch ball grid array package; 324 balls; body 16 x 16 x 1.2 mm B D SOT571-1 A ball A1 index area A E A2 A1 detail X C e1 v M B b e y y1 C ∅w M v M A V U T e R P N	Original	LFBGA324: OT571-1 MO-205 LFBGA324 MO-205 SOT571 LFBGA-324	PDF
ISO10918 Abstract: TDA9991 sdram controller smd transistor A1 3 PIN usb ccd controller ic FXA1022 LFBGA324 PR3001 SAA8122A SAA8122AEL Contextual Info: SAA8122A Digital Still Camera Processor ImagIC family Rev. 01 — 20 April 2000 Objective specification 1. Description The DSC SAA8122A is a high performance, low power, single-chip Million Instructions Per Second (MIPS) based signal processor, part of the ImagIC family,	Original	SAA8122A SAA8122A FXA1022, TDA9991) TDA9952) ISO10918 TDA9991 sdram controller smd transistor A1 3 PIN usb ccd controller ic FXA1022 LFBGA324 PR3001 SAA8122AEL	PDF
TDA9952 Abstract: sdram controller FXA1022 LFBGA324 PR3001 SAA8122A SAA8122AEL TDA9991 Contextual Info: SAA8122A Digital Still Camera Processor ImagIC family Rev. 03 — 22 November 2000 Objective specification 1. Description The DSC SAA8122A is a high performance, low power, single-chip Million Instructions Per Second (MIPS) based signal processor, part of the ImagIC family,	Original	SAA8122A SAA8122A FXA1022, TDA9991) TDA9952) TDA9952 sdram controller FXA1022 LFBGA324 PR3001 SAA8122AEL TDA9991	PDF
BAYER COLOUR PATTERN Contextual Info: SAA8122A Digital Still Camera Processor ImagIC family Rev. 02 — 2 October 2000 Objective specification 1. Description The DSC SAA8122A is a high performance, low power, single-chip Million Instructions Per Second (MIPS) based signal processor, part of the ImagIC family,	Original	SAA8122A SAA8122A FXA1022, TDA9991) TDA9952) BAYER COLOUR PATTERN	PDF
JEDEC TRAY DIMENSIONS Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors	Original	manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package	PDF