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    SOT619 Search Results

    SOT619 Datasheets (10)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT619-1
    NXP Semiconductors Footprint for reflow soldering SOT619-1 Original PDF
    SOT619-11
    NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals Original PDF
    SOT619-1_518
    NXP Semiconductors HVQFN48; Reel dry pack, SMD, 13"Q1/T1 standard orientationOrderable part number ending, 518 or YOrdering code (12NC) ending 518 Original PDF
    SOT619-2
    NXP Semiconductors Footprint for reflow soldering SOT619-2 Original PDF
    SOT619-4
    NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm Original PDF
    SOT619-5
    NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.9 mm Original PDF
    SOT619-6
    NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm Original PDF
    SOT619-7
    NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm Original PDF
    SOT619-8
    NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm Original PDF
    SOT619-9
    NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm Original PDF

    SOT619 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: 4 1  +9 SOT619-1 HVQFN48; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending, 518 or Y Ordering code 12NC) ending 518 Rev. 1 — 21 October 2013 Packing information 1. Packing method %DUFRGHODEHO 'U\DJHQW %DJ (6'SULQW


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    OT619-1 HVQFN48; OT619-1 PDF

    Contextual Info: Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.9 mm D SOT619-5 A B terminal 1 index area E A A1 c detail X C e1 e 1/2 e v w b 13 24 L M M y y1 C C A B C 25 12 e e2 Eh 1/2 e 1 36 terminal 1


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    HVQFN48: OT619-5 MO-220 PDF

    HVQFN48

    Abstract: MO-220 sot619
    Contextual Info: Package outline Philips Semiconductors HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.9 mm D SOT619-5 A B terminal 1 index area E A A1 c detail X C e1 e 1/2 e v w b 13 M M y1 C C A B C y 24 L 25 12 e e2


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    HVQFN48: OT619-5 MO-220 HVQFN48 MO-220 sot619 PDF

    HVQFN48

    Abstract: MO-220 k MO-220 sot619 e1a4
    Contextual Info: PDF: 2000 Sep 29 Philips Semiconductors Package outline HVQFN48: plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm SOT619-2 B D D1 A terminal 1 index area A E1 A4 A1 E detail X k k e1 b e C v M B y y1 C w M 13 24 v M A


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    HVQFN48: OT619-2 MO-220 HVQFN48 MO-220 k MO-220 sot619 e1a4 PDF

    Contextual Info: Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm A B D SOT619-11 terminal1 index area E A A1 c detail X e1 e L 1/2 e 13 24 12 C C A B C v w b y1 C y 25 e e2 Eh 1/2 e 1 terminal1 index area


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    HVQFN48: OT619-11 MO-220 sot619-11 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN48 package SOT619-2 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


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    HVQFN48 OT619-2 OT619-2 PDF

    Contextual Info: Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm B D SOT619-8 A terminal 1 index area E A A1 c detail X e1 e 1/2 e v w b 13 24 L M M C C A B C y1 C y 25 12 e e2 Eh 1/2 e 1 36 terminal 1


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    HVQFN48: OT619-8 met75 MO-220 PDF

    HVQFN48

    Abstract: MO-220
    Contextual Info: PDF: 2002 Oct 18 Philips Semiconductors Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm A B D SOT619-1 terminal 1 index area A E A1 c detail X C e1 1/2 e e 13 24 y y1 C v M C A B w M C


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    HVQFN48: OT619-1 MO-220 HVQFN48 MO-220 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN48 package SOT619-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


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    HVQFN48 OT619-1 OT619-1 PDF

    Contextual Info: PDF: 2000 Sep 29 Philips Semiconductors Package outline HVQFN48: plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm A B D SOT619-1 terminal 1 index area A4 A E detail X e1 b e C v M B 13 y y1 C w M 24 v M A L 25 12


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    HVQFN48: OT619-1 MO-220 PDF

    B13W

    Abstract: HVQFN48 Thin Quad flat package mo-220 MO-220 sot619
    Contextual Info: PDF: 2001 Sep 07 Philips Semiconductors Package outline HVQFN48: plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm SOT619-3 B D D1 A terminal 1 index area A E1 A4 A1 E detail X C e1 1/2 e e y y1 C ∅v M C A B b 13


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    HVQFN48: OT619-3 MO-220 B13W HVQFN48 Thin Quad flat package mo-220 MO-220 sot619 PDF

    Contextual Info: Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm D SOT619-6 A B terminal 1 index area E A A1 c detail X e1 C e 1/2 e v w b 13 24 L M M y y1 C C A B C 25 12 e e2 Eh 1/2 e 1 36 terminal 1


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    HVQFN48: OT619-6 Pla075 MO-220 PDF

    HVQFN48

    Abstract: Thin Quad flat package mo-220 MO-220 sot619
    Contextual Info: PDF: 2001 Aug 14 Philips Semiconductors Package outline HVQFN48: plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm A B D SOT619-1 terminal 1 index area A A4 E detail X C e1 1/2 e e 13 y y1 C ∅v M C A B b ∅w M C


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    HVQFN48: OT619-1 MO-220 HVQFN48 Thin Quad flat package mo-220 MO-220 sot619 PDF

    Contextual Info: Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm A B D SOT619-4 terminal 1 index area A E A1 c detail X C e1 1/2 e e 24 L y y1 C v M C A B w M C b 13 25 12 e e2 Eh 1/2 e 36 1 terminal 1


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    HVQFN48: OT619-4 MO-220 PDF

    Contextual Info: Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm SOT619-9 B D D1 A terminal 1 index area E1 E A A4 A1 c detail X e1 e L 1/2 e 13 24 C C A B C v w b y y1 C 25 12 e e2 Eh 1/2 e 1 terminal 1


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    HVQFN48: OT619-9 MO-220 sot619-9 PDF

    HVQFN48

    Abstract: MO-220 sot619
    Contextual Info: PDF: 2002 Oct 02 Philips Semiconductors Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm A B D SOT619-4 terminal 1 index area A E A1 c detail X C e1 e 1/2 e v M C A B w M C b 13 24


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    HVQFN48: OT619-4 MO-220 HVQFN48 MO-220 sot619 PDF

    HVQFN48

    Abstract: MO-220
    Contextual Info: PDF: 2002 Oct 23 Philips Semiconductors Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm SOT619-2 B D D1 A terminal 1 index area E1 A E A4 A1 c detail X C e1 e 1/2 e 13 24 L y y1 C


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    HVQFN48: OT619-2 MO-220 HVQFN48 MO-220 PDF

    LPC2148 i2c

    Abstract: BGB210S lpc2148 interfacing 2.8" TFT LCD DISPLAY BGB210 embedded c code to interface lpc2148 with sensor BGW200 TDA8932T tda8920bj NXP PN531 TDA8947J equivalent
    Contextual Info: Building blocks for vibrant media Highlights of the NXP product portfolio Building blocks for vibrant media  At NXP Semiconductors, the new company founded by Philips, we’re driven by a single purpose — to deliver vibrant media technologies that create better sensory experiences.


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    OT363 SC-88) LPC2148 i2c BGB210S lpc2148 interfacing 2.8" TFT LCD DISPLAY BGB210 embedded c code to interface lpc2148 with sensor BGW200 TDA8932T tda8920bj NXP PN531 TDA8947J equivalent PDF

    free av to hdmi cable circuit diagram

    Abstract: "PCIe PHY" hdmi specifications HVQFN48 MO-220 PTN3381B dongle diagram flow design PTN3361B
    Contextual Info: PTN3381B Enhanced performance HDMI/DVI level shifter with voltage regulator, dongle detect support and active DDC buffer Rev. 2 — 15 October 2010 Product data sheet 1. General description The PTN3381B is a high-speed level shifter device which converts four lanes of low-swing


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    PTN3381B PTN3381B free av to hdmi cable circuit diagram "PCIe PHY" hdmi specifications HVQFN48 MO-220 dongle diagram flow design PTN3361B PDF

    tda10024

    Abstract: TDA10024HN tda1825 TDA10024HN demodulator NXP TDA10024HN TDA18254AHN can tuner nxp TDA1002 EIA/JESD22-C101 HVQFN48
    Contextual Info: TDA18254AHN Cable Silicon Tuner Rev. 3 — 13 September 2010 Product data sheet 1. General description The TDA18254AHN is a Silicon Tuner IC designed specifically for high definition multi-tuner cable Set Top Boxes STB supporting single streaming and multi-streaming


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    TDA18254AHN TDA18254AHN TDA10024HN tda10024 TDA10024HN tda1825 TDA10024HN demodulator NXP TDA10024HN can tuner nxp TDA1002 EIA/JESD22-C101 HVQFN48 PDF

    Contextual Info: IMPORTANT NOTICE Dear customer, As from February 2nd 2009, ST and Ericsson have merged Ericsson Mobile Platforms and ST-NXP Wireless into a 50/50 joint venture "ST‐Ericsson". As a result, the following changes are applicable to the attached


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    free av to hdmi circuit diagram

    Abstract: free hdmi to av circuit diagram PTN3360 hdmi specifications HVQFN48 MO-220 dvi to hdmi CABLE wiring dongle diagram flow design
    Contextual Info: PTN3361B HDMI/DVI level shifter with dongle detect support and active DDC buffer Rev. 02 — 7 October 2009 Product data sheet 1. General description The PTN3361B is a high-speed level shifter device which converts four lanes of low-swing AC-coupled differential input signals to DVI v1.0 and HDMI v1.3a compliant open-drain


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    PTN3361B PTN3361B free av to hdmi circuit diagram free hdmi to av circuit diagram PTN3360 hdmi specifications HVQFN48 MO-220 dvi to hdmi CABLE wiring dongle diagram flow design PDF

    ISP1362

    Abstract: TFBGA128 portable dvd player power supply ISP1583 CP2147 philips ISP1362 pSOS PXA255 ISP1761 HVQFN14
    Contextual Info: Semiconductors Application Matrix Carkit Digital still camera Digital TV Digital video camera Digital video recorder DVD recorder Dongle/bridge Game console Hub Hub: device bay Hub: docking station Hub: monitor Media player Mobile phone Modem: cable/DSL MP3/audio jukebox


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    nxp tv tuner

    Abstract: TDA18260HN
    Contextual Info: TDA18260HN Dual cable silicon tuner Rev. 5 — 4 July 2012 Product short data sheet 1. General description The TDA18260HN is a dual silicon tuner IC designed specifically for high definition multi-tuner cable Set-Top Boxes STBs supporting single streaming and multi-streaming


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    TDA18260HN TDA18260HN TDA10025HN nxp tv tuner PDF