SOT624 Search Results

SOT624 Datasheets (2)

Part	ECAD Model	Manufacturer	Description	Datasheet Type	PDF	PDF Size	Page count
SOT624-1		NXP Semiconductors	Footprint for reflow soldering SOT624-1	Original	PDF	11.55KB	1
SOT624-1		NXP Semiconductors	Plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink	Original	PDF	364.2KB	1

Catalog Datasheet	Type	Document Tags	PDF
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA1312 package SOT624-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	HBGA1312 OT624-1 OT624-1	PDF
Contextual Info: Package outline HBGA1312: plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink B D SOT624-1 A ball A1 index area A E A2 A1 detail X C e1 AV AT AP AM AK AH AF AD AB Y V T P M K H F D B ∅w M C AW AU AR AN AL AJ AG	Original	HBGA1312: OT624-1 MS-034	PDF
MS-034 Abstract: sot624 Contextual Info: PDF: 2001 Feb 13 Philips Semiconductors Package outline HBGA1312: plastic, heatsink ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm A B D SOT624-1 ball A1 index area A E A2 A1 detail X e1 C v M B b e ∅w M v M A AW AV AU AT AR AP AN AM AL AK AJ	Original	HBGA1312: OT624-1 MS-034 MS-034 sot624	PDF
MS-034 Abstract: HBGA1312 Contextual Info: PDF: 2003 Jan 29 Philips Semiconductors Package outline HBGA1312: plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink B D SOT624-1 A ball A1 index area A E A2 A1 detail X C e1 AV AT AP AM AK AH AF AD AB Y V T P M	Original	HBGA1312: OT624-1 MS-034 MS-034 HBGA1312	PDF