SOT707 Search Results
SOT707 Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT707-1 |
|
Plastic thermal enhanced ball grid array package; 584 balls; body 37.5 x 37.5 x 1.42 mm; heatsink | Original | 292.65KB | 1 |
SOT707 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
sot707Contextual Info: PDF: 2002 Nov 22 Philips Semiconductors Package outline HBGA584: plastic thermal enhanced ball grid array package; 584 balls; body 37.5 x 37.5 x 1.42 mm; heatsink B D SOT707-1 A ball A1 index area A E A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C AJ |
Original |
HBGA584: OT707-1 sot707 | |
|
Contextual Info: Package outline HBGA584: plastic thermal enhanced ball grid array package; 584 balls; body 37.5 x 37.5 x 1.42 mm; heatsink B D SOT707-1 A ball A1 index area A E A2 A1 detail X C e1 b e AH AF AD AB Y V T P M K H F D B AJ AG e AE AC AA W heatsink U e2 R N L |
Original |
HBGA584: OT707-1 |