SOT817 Search Results
SOT817 Datasheets (2)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT817-1 |
|
HVQFN100: plastic thermal enhanced very thin quad flat package | Original | 241.31KB | 1 | ||
| SOT817-1 |
|
Footprint for reflow soldering SOT817-1 | Original | 19.26KB | 1 |
SOT817 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: Package outline HVQFN100: plastic thermal enhanced very thin quad flat package; no leads; 100 terminals; body 12 x 12 x 0.85 mm SOT817-1 B D D1 A terminal 1 index area A4 A E1 E c A1 detail X C e1 e 26 y1 C v M C A B w M C b 50 L y 51 25 e e2 Eh 1 terminal 1 |
Original |
HVQFN100: OT817-1 MO-220 | |
MO-220
Abstract: sot817
|
Original |
HVQFN100: OT817-1 MO-220 MO-220 sot817 | |
|
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN100 package SOT817-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout |
Original |
HVQFN100 OT817-1 OT817-1 QFN100 |