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    SOT835 Search Results

    SOT835 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SOT835-1
    NXP Semiconductors Plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink Original PDF 304.82KB 1

    SOT835 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: Package outline HBGA672: plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink B D SOT835-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AK AH AF AD AB Y V T P M K H F D B AJ AG AE e AC heatsink AA W U e2 R N


    Original
    HBGA672: OT835-1 MS-034 PDF

    MS-034

    Abstract: sot835
    Contextual Info: PDF: 2003 Nov 21 Philips Semiconductors Package outline HBGA672: plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink B D SOT835-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e ∅v M C A B b y1 C y ∅w M C AL


    Original
    HBGA672: OT835-1 MS-034 MS-034 sot835 PDF

    forward converter with TL431

    Abstract: 800 WATT MOSFET AMPLI DIAGRAM tk75003 Opt pam circuit
    Contextual Info: TK75003 Power Conversion ICs POWER-FACTOR-CORRECTION/PRIMARY-SIDE CONTROLLER FEATURES APPLICATIONS • Power Factor Correction/Line Harmonics ■ Power Factor Correction Converters Reduction to Meet IEC1000-3-2 Requirements ■ Off-Line Power Supplies ■ Optimized for Offline Operation


    OCR Scan
    TK75003 IEC1000-3-2 OT-89-5 TK75003 TK75002 TK75003. 15voltstoturnontheTK TK75003, 1000pF forward converter with TL431 800 WATT MOSFET AMPLI DIAGRAM Opt pam circuit PDF