SOT836 Search Results

Contextual Info: Package outline LFBGA167: plastic low profile fine-pitch ball grid array package; 167 balls; body 14 x 14 x 1.05 mm SOT836-1 B D A ball A1 index area A E A2 A1 detail X C e1 e AF AD AB Y 1/2 e y1 C ∅v M C A B b AE e AC AA V T P M K H F D B W U R e2 N L 1/2 e

sot836

Contextual Info: PDF: 2003 Oct 20 Philips Semiconductors Package outline LFBGA167: plastic low profile fine-pitch ball grid array package; 167 balls; body 14 x 14 x 1.05 mm SOT836-1 B D A ball A1 index area A E A2 A1 detail X C e1 e AF AD AB Y 1/2 e ∅v M b ∅w M AE y1 C

ECG004C

Contextual Info: ECG004 The Communications Edge TM Product Information InGaP HBT Gain Block Product Features x DC – 6 GHz Product Description x +28 dBm OIP3 at 1 GHz x 16.2 dB Gain at 1 GHz The ECG004 consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology