SOT86 Search Results

sot86

Abstract: SGC-2486Z GaN hemt D7628
Contextual Info: SGC-2486Z SGC-2486Z 50MHz to 4000MHz Active Bias Silicon Germanium Cascadable Gain Block 50MHz to 4000MHz ACTIVE BIAS SILICON GERMANIUM CASCADABLE GAIN BLOCK RFMD Green, RoHS Compliant, Pb-Free Package: SOT86 Product Description Features RFMD’s SGC-2486Z is a high performance SiGe HBT MMIC amplifier utilizing a Darlington configuration with a patented active bias network. The

Contextual Info: Package outline BGA288: plastic ball grid array package; 288 balls; body 27 x 27 x 1.55 mm D SOT869-1 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C Y W e V U T R P N M L e2 K J 1/2 e H G F E D C B A shape optional 4x

Contextual Info: Package outline TFBGA240: plastic thin fine-pitch ball grid array package; 240 balls; body 12 x 12 x 0.7 mm D B SOT868-1 A ball A1 index area A E A2 A1 detail X C e1 ∅v ∅w b e M M y y1 C C A B C U T R P N e M L K e2 J H G F E D C B A ball A1 index area

Contextual Info: Package outline HBGA624: plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink D D1 SOT860-1 B A ball A1 index area j E1 E A A2 A1 detail X C e1 e AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e M M AJ AG e AE AC

Contextual Info: Package outline HTSSOP24: plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad D SOT864-1 A E c y X exposed die pad HE v M A DH Z 13 24 A 3 A2 Eh A A1 pin 1 index θ Lp detail X 1 L

sot862

Contextual Info: Package outline Philips Semiconductors LFBGA336: plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1.05 mm D SOT862-1 B A ball A1 index area A E A2 A1 detail X C e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D

SGC-2486Z

Contextual Info: SGC2486Z SGC2486Z 50MHz to 4000MHz Active Bias Silicon Germanium Cascadable Gain Block 50MHz to 4000MHz ACTIVE BIAS SILICON GERMANIUM CASCADABLE GAIN BLOCK Package: SOT86 Product Description Features RFMD’s SGC2486Z is a high performance SiGe HBT MMIC amplifier utilizing a Darlington configuration with a patented active bias network. The

Contextual Info: AG303-86 InGaP HBT Gain Block Product Features • • • • • • • • DC – 6000 MHz 20.5 dB Gain @ 900 MHz +14 dBm P1dB @ 900 MHz +26 dBm OIP3 @ 900 MHz Single Voltage Supply Internally matched to 50 Ω Robust 1000V ESD, Class 1C Lead-free/RoHS-compliant SOT86 package

SGC-2486Z

Contextual Info: SGC-2486Z SGC-2486Z 50MHz to 4000MHz Active Bias Silicon Germanium Cascadable Gain Block 50MHz to 4000MHz ACTIVE BIAS SILICON GERMANIUM CASCADABLE GAIN BLOCK RFMD Green, RoHS Compliant, Pb-Free Package: SOT86 Product Description Features RFMD’s SGC-2486Z is a high performance SiGe HBT MMIC amplifier utilizing a Darlington configuration with a patented active bias network. The

Contextual Info: Package outline HLLGA48R: plastic thermal enhanced low profile land grid array package; 48 lands; resin based; body 8 x 7 x 1.25 mm D SOT863-1 A B land 1 index area E e1 L1 v w b e 13 M M y1 C C A B C A y 24 L C 25 12 e e2 Eh 1 36 land 1 index area 48 37 Dh

Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm B D SOT865-3 A terminal 1 index area E A c A1 detail X C e1 9 y1 C C A B C v w b e L y 16 17 8 e2 Eh e 1 24 terminal 1 index area 32

Contextual Info: Package outline LFBGA336: plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1.05 mm D SOT862-1 B A ball A1 index area A E A2 A1 detail X C e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A M M e e2 1/2 e ball A1

Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm D B SOT865-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 M M y y1 C C A B C L 17 8 e e2 Eh 1/2 e 1 24 terminal 1

sot868

Abstract: TFBGA240
Contextual Info: Package outline Philips Semiconductors TFBGA240: plastic thin fine-pitch ball grid array package; 240 balls; body 12 x 12 x 0.7 mm D SOT868-1 B A ball A1 index area A E A2 A1 detail X C e1 ∅v ∅w b e M M y1 C C A B C y U T R P N e M L K e2 J H G F E D C

Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm SOT865-2 B D D1 A terminal 1 index area E1 E A A2 c A1 detail X e1 C 1/2 e 9 y1 C C A B C v w b e L y 16 17 8 e2 Eh e 1 24 terminal 1

Contextual Info: Package outline TFBGA393: plastic thin fine-pitch ball grid array package; 393 balls; body 14 x 14 x 0.7 mm D B SOT861-1 A ball A1 index area E A A2 A1 detail X C e1 e 1/2 e ∅v ∅w b AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A M M e e2 1/2 e

Contextual Info: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 6 x 6 x 0.85 mm D B SOT866-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 L M M y y1 C C A B C 17 8 e e2 Eh 1/2 e 1 24 terminal 1

sot863

Abstract: 24LC HLLGA48
Contextual Info: Package outline Philips Semiconductors HLLGA48: plastic thermal enhanced low profile land grid array package; 48 lands; body 8 x 7 x 1.4 mm D SOT863-1 A B land 1 index area E e1 L1 v w b e 13 M M y1 C C A B C A y 24 L C 25 12 e e2 Eh 1 36 land 1 index area

SGC-2386Z

Contextual Info: SGC-2386Z SGC-2386Z 50MHz to 4000MHz Active Bias Silicon Germanium Cascadable Gain Block 50MHz to 4000MHz ACTIVE BIAS SILICON GERMANIUM CASCADABLE GAIN BLOCK RFMD Green, RoHS Compliant, Pb-Free Package: SOT86 Product Description Features RFMD’s SGC-2386Z is a high performance SiGe HBT MMIC amplifier utilizing a Darlington configuration with a patented active bias network. The

MS-034

Abstract: sot860 HBGA624
Contextual Info: Package outline Philips Semiconductors HBGA624: plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink D D1 SOT860-1 B A ball A1 index area j E1 E A A2 A1 detail X C e1 e AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVQFN32 package SOT865-3 Hx Gx D P 0.025 0.025 C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVQFN32 package SOT865-2 Hx Gx D P 0.025 0.025 C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

SOT86

Abstract: RF SOT86 SiGe HBT GAIN BLOCK MMIC AMPLIFIER SGC-2386Z SOT-86
Contextual Info: SGC-2386Z SGC-2386Z 50MHz to 4000MHz Active Bias Silicon Germanium Cascadable Gain Block 50MHz to 4000MHz ACTIVE BIAS SILICON GERMANIUM CASCADABLE GAIN BLOCK RFMD Green, RoHS Compliant, Pb-Free Package: SOT86 Product Description Features RFMD’s SGC-2386Z is a high performance SiGe HBT MMIC amplifier utilizing a Darlington configuration with a patented active bias network. The

Contextual Info: Package outline LFBGA336: plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1 mm D SOT862-2 B A ball A1 index area A E A2 A1 detail X C e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A M M e e2 1/2 e ball A1