sot86
Abstract: SGC-2486Z GaN hemt D7628
Text: SGC-2486Z SGC-2486Z 50MHz to 4000MHz Active Bias Silicon Germanium Cascadable Gain Block 50MHz to 4000MHz ACTIVE BIAS SILICON GERMANIUM CASCADABLE GAIN BLOCK RFMD Green, RoHS Compliant, Pb-Free Package: SOT86 Product Description Features RFMD’s SGC-2486Z is a high performance SiGe HBT MMIC amplifier utilizing a Darlington configuration with a patented active bias network. The
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SGC-2486Z
50MHz
4000MHz
4000MHz
SGC-2486Z
1000pF
sot86
GaN hemt
D7628
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Untitled
Abstract: No abstract text available
Text: Package outline BGA288: plastic ball grid array package; 288 balls; body 27 x 27 x 1.55 mm D SOT869-1 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C Y W e V U T R P N M L e2 K J 1/2 e H G F E D C B A shape optional 4x
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BGA288:
OT869-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA240: plastic thin fine-pitch ball grid array package; 240 balls; body 12 x 12 x 0.7 mm D B SOT868-1 A ball A1 index area A E A2 A1 detail X C e1 ∅v ∅w b e M M y y1 C C A B C U T R P N e M L K e2 J H G F E D C B A ball A1 index area
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TFBGA240:
OT868-1
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA624: plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink D D1 SOT860-1 B A ball A1 index area j E1 E A A2 A1 detail X C e1 e AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e M M AJ AG e AE AC
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HBGA624:
OT860-1
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Untitled
Abstract: No abstract text available
Text: Package outline HTSSOP24: plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad D SOT864-1 A E c y X exposed die pad HE v M A DH Z 13 24 A 3 A2 Eh A A1 pin 1 index θ Lp detail X 1 L
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HTSSOP24:
OT864-1
MO-153
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sot862
Abstract: No abstract text available
Text: Package outline Philips Semiconductors LFBGA336: plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1.05 mm D SOT862-1 B A ball A1 index area A E A2 A1 detail X C e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D
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LFBGA336:
OT862-1
sot862
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SGC-2486Z
Abstract: No abstract text available
Text: SGC2486Z SGC2486Z 50MHz to 4000MHz Active Bias Silicon Germanium Cascadable Gain Block 50MHz to 4000MHz ACTIVE BIAS SILICON GERMANIUM CASCADABLE GAIN BLOCK Package: SOT86 Product Description Features RFMD’s SGC2486Z is a high performance SiGe HBT MMIC amplifier utilizing a Darlington configuration with a patented active bias network. The
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SGC2486Z
50MHz
4000MHz
4000MHz
SGC2486Z
1000pF
SGC-2486Z
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Untitled
Abstract: No abstract text available
Text: AG303-86 InGaP HBT Gain Block Product Features • • • • • • • • DC – 6000 MHz 20.5 dB Gain @ 900 MHz +14 dBm P1dB @ 900 MHz +26 dBm OIP3 @ 900 MHz Single Voltage Supply Internally matched to 50 Ω Robust 1000V ESD, Class 1C Lead-free/RoHS-compliant SOT86 package
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AG303-86
AG303-86
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SGC-2486Z
Abstract: No abstract text available
Text: SGC-2486Z SGC-2486Z 50MHz to 4000MHz Active Bias Silicon Germanium Cascadable Gain Block 50MHz to 4000MHz ACTIVE BIAS SILICON GERMANIUM CASCADABLE GAIN BLOCK RFMD Green, RoHS Compliant, Pb-Free Package: SOT86 Product Description Features RFMD’s SGC-2486Z is a high performance SiGe HBT MMIC amplifier utilizing a Darlington configuration with a patented active bias network. The
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SGC-2486Z
50MHz
4000MHz
4000MHz
SGC-2486Z
1000pF
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Untitled
Abstract: No abstract text available
Text: Package outline HLLGA48R: plastic thermal enhanced low profile land grid array package; 48 lands; resin based; body 8 x 7 x 1.25 mm D SOT863-1 A B land 1 index area E e1 L1 v w b e 13 M M y1 C C A B C A y 24 L C 25 12 e e2 Eh 1 36 land 1 index area 48 37 Dh
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HLLGA48R:
OT863-1
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm B D SOT865-3 A terminal 1 index area E A c A1 detail X C e1 9 y1 C C A B C v w b e L y 16 17 8 e2 Eh e 1 24 terminal 1 index area 32
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HVQFN32:
OT865-3
MO-220
sot865-3
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA336: plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1.05 mm D SOT862-1 B A ball A1 index area A E A2 A1 detail X C e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A M M e e2 1/2 e ball A1
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LFBGA336:
OT862-1
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm D B SOT865-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 M M y y1 C C A B C L 17 8 e e2 Eh 1/2 e 1 24 terminal 1
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HVQFN32:
OT865-1
MO-220
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sot868
Abstract: TFBGA240
Text: Package outline Philips Semiconductors TFBGA240: plastic thin fine-pitch ball grid array package; 240 balls; body 12 x 12 x 0.7 mm D SOT868-1 B A ball A1 index area A E A2 A1 detail X C e1 ∅v ∅w b e M M y1 C C A B C y U T R P N e M L K e2 J H G F E D C
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TFBGA240:
OT868-1
sot868
TFBGA240
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm SOT865-2 B D D1 A terminal 1 index area E1 E A A2 c A1 detail X e1 C 1/2 e 9 y1 C C A B C v w b e L y 16 17 8 e2 Eh e 1 24 terminal 1
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HVQFN32:
OT865-2
sot865-2
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA393: plastic thin fine-pitch ball grid array package; 393 balls; body 14 x 14 x 0.7 mm D B SOT861-1 A ball A1 index area E A A2 A1 detail X C e1 e 1/2 e ∅v ∅w b AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A M M e e2 1/2 e
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TFBGA393:
OT861-1
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Untitled
Abstract: No abstract text available
Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 6 x 6 x 0.85 mm D B SOT866-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 L M M y y1 C C A B C 17 8 e e2 Eh 1/2 e 1 24 terminal 1
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HVQFN32:
OT866-1
Plastic075
MO-220
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sot863
Abstract: 24LC HLLGA48
Text: Package outline Philips Semiconductors HLLGA48: plastic thermal enhanced low profile land grid array package; 48 lands; body 8 x 7 x 1.4 mm D SOT863-1 A B land 1 index area E e1 L1 v w b e 13 M M y1 C C A B C A y 24 L C 25 12 e e2 Eh 1 36 land 1 index area
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HLLGA48:
OT863-1
sot863
24LC
HLLGA48
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SGC-2386Z
Abstract: No abstract text available
Text: SGC-2386Z SGC-2386Z 50MHz to 4000MHz Active Bias Silicon Germanium Cascadable Gain Block 50MHz to 4000MHz ACTIVE BIAS SILICON GERMANIUM CASCADABLE GAIN BLOCK RFMD Green, RoHS Compliant, Pb-Free Package: SOT86 Product Description Features RFMD’s SGC-2386Z is a high performance SiGe HBT MMIC amplifier utilizing a Darlington configuration with a patented active bias network. The
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SGC-2386Z
50MHz
4000MHz
4000MHz
SGC-2386Z
1000pF
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MS-034
Abstract: sot860 HBGA624
Text: Package outline Philips Semiconductors HBGA624: plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink D D1 SOT860-1 B A ball A1 index area j E1 E A A2 A1 detail X C e1 e AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b
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HBGA624:
OT860-1
MS-034
MS-034
sot860
HBGA624
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HVQFN32 package SOT865-3 Hx Gx D P 0.025 0.025 C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HVQFN32
OT865-3
sot865-3
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HVQFN32 package SOT865-2 Hx Gx D P 0.025 0.025 C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HVQFN32
OT865-2
sot865-2
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SOT86
Abstract: RF SOT86 SiGe HBT GAIN BLOCK MMIC AMPLIFIER SGC-2386Z SOT-86
Text: SGC-2386Z SGC-2386Z 50MHz to 4000MHz Active Bias Silicon Germanium Cascadable Gain Block 50MHz to 4000MHz ACTIVE BIAS SILICON GERMANIUM CASCADABLE GAIN BLOCK RFMD Green, RoHS Compliant, Pb-Free Package: SOT86 Product Description Features RFMD’s SGC-2386Z is a high performance SiGe HBT MMIC amplifier utilizing a Darlington configuration with a patented active bias network. The
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SGC-2386Z
50MHz
4000MHz
4000MHz
SGC-2386Z
1000pF
SOT86
RF SOT86
SiGe HBT GAIN BLOCK MMIC AMPLIFIER
SOT-86
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA336: plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1 mm D SOT862-2 B A ball A1 index area A E A2 A1 detail X C e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A M M e e2 1/2 e ball A1
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LFBGA336:
OT862-2
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