SOT9 Search Results

SOT539A

Abstract: SOT975B SOT540A SOT538A sot538b sot988 SOT608B
Contextual Info: Air-cavity plastic packages SOT987B SOT895A Bias/temperature sensing SOT981A SOT988B SOT896B Bias/temperature sensing SOT986B Push-pull configuration SOT982A MMIC configuration SOT980A SOT1015BG Bias/temperature sensing Increase the flexibility of application-specific design by using LDMOS RF power

BUW13

Abstract: BUW13A buw13a philips semiconductor BA102 BUW13A-S Philips BUW13A
Contextual Info: Product specification Philips Semiconductors BUW13; BUW13A Silicon diffused power transistors High-voltage, high-speed, glass-passivated npn power transistors in a SOT93 envelope, intended fo r use in converters, inverters, sw itching regulators, m oto r co n tro l systems etc.

Contextual Info: SOT905-1 HVQFN24; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 19 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

Contextual Info: Package outline HLSON10R: plastic thermal enhanced low profile small outline package; no leads; 10 terminals; resin based; body 4 x 4 x 1.1 mm SOT931-1 X A B D E A A1 terminal 1 index area detail X e1 terminal 1 index area L1 v w b e 1 5 M M C C A B C y1 C

Contextual Info: Package outline DFN1714-8: plastic, thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm SOT972-2 X A B D A E A1 c terminal 1 index area detail X terminal 1 index area e e1 1 6 C C A B C v w b y1 C y L k Eh

Contextual Info: Package outline BGA564: plastic ball grid array package; 564 balls; body 40 x 40 x 1.75 mm SOT947-1 B D D1 A ball A1 index area E1 E A A1 A2 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E

Contextual Info: Package outline TQFP64: plastic thin quad flat package; 64 leads; body 7 x 7 x 1 mm SOT928-1 c y X A 48 33 32 49 ZE e E w pin 1 index HE A A2 A3 A1 M θ bp Lp L 17 64 1 detail X 16 ZD e bp w v M A v M B M B D HD 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 4 x 4 x 0.8 mm A B D SOT969-1 ball A1 index area E A A2 A1 detail X e1 1/2 e ∅v ∅w b e C C A B C M M y y1 C H G F e E e2 D C 1/2 e B A ball A1 index area 1 2 3 4 5 6 7 8

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT962-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 12 x 12 x 1 mm B D SOT966-1 A ball A1 index area E A2 A A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M L K J H G F E D C B A ball A1 index area

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA56 package SOT911-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm B D SOT950-1 A ball A1 index area E A A2 A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M L K J H G F E D C B A e e2 ball A1 index area

Contextual Info: SOT991-1 VFBGA56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 19 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

Contextual Info: Package outline XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm B D SOT996-2 A E A A1 detail X terminal 1 index area e1 1 4 8 5 C C A B C v w b e L1 y y1 C L2 L X 1 2 mm scale Dimensions mm are the original dimensions

Contextual Info: PC board footprint NXP Semiconductors Footprint for reflow soldering of HLQFN64 package SOT903-1 Hx D 1/2 P P C 0.065 Vd Vd1 Vx 0.12 SLy1 Hy By Vy3 Vy2 SPy1 Ay SLy SPy Vy1 SPx SPx2 SPx1 SLx1 SLx Bx Ax solder lands solder paste solder resist occupied area SPy1

Contextual Info: Package outline HLQFN56R: plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based; body 8 x 8 x 1.35 mm B D SOT935-2 A terminal 1 index area E A detail X e1 e L1 L C b 1/2 e 15 28 14 C A B C v w y1 C y 29 e e2 Eh 1 terminal 1

Contextual Info: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls A B D SOT999-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b W V U T R P N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9

Contextual Info: Package outline HUQFN88U: plastic thermal enhanced ultra thin quad flat package; no leads; 88 terminals; UTLP based; body 6 x 6 x 0.55 mm B D SOT942-1 A terminal 1 index area E A A1 detail X e2 v w M eR L e1 C A B C M A11 v w b 1/2 e A12 B11 D2 L1 C e A22

buw13a philips semiconductor

Abstract: buw13a BUW13 S0T93 BUW1 buw13a philips
Contextual Info: Product specification Philips Semiconductors Silicon diffused power transistors BUW13; BUW13A High-voltage, high-speed, glass-passivated npn power transistors in a SOT93 envelope, intended for use in converters, inverters, switching regulators, motor control systems etc.

250 B 340 smd Transistor

Contextual Info: PBSS4021SP 20 V, 6.3 A PNP/PNP low VCEsat BISS transistor Rev. 2 — 11 October 2010 Product data sheet 1. Product profile 1.1 General description PNP/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT96-1 (SO8) medium power Surface-Mounted Device (SMD) plastic package.

TRANSISTOR SMD MARKING CODE 210

Abstract: 250 B 340 smd Transistor 4032SPN marking code 33 SMD ic transistor smd code marking 420 TRANSISTOR SMD MARKING CODE 42 TRANSISTOR SMD MARKING CODES MARKING SMD PNP TRANSISTOR FR
Contextual Info: PBSS4032SPN 30 V NPN/PNP low VCEsat BISS transistor Rev. 2 — 14 October 2010 Product data sheet 1. Product profile 1.1 General description NPN/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT96-1 (SO8) medium power Surface-Mounted Device (SMD) plastic package.

SOT96

Contextual Info: SO 8 SOT96-1 Tape reel SMD; standard product orientation 12NC ending 115 Rev. 1 — 23 November 2012 Packing information 1. Packing method Printed plano box Barcode label Reel Tape Barcode label Circular sprocket holes opposite the label side of reel QA Seal

Contextual Info: Package outline HVSON8: plastic, thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm SOT908-2 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e C b 1 C A B C v w 4 y y1 C L k Eh 8 5 Dh 1 Dimensions

Contextual Info: Package outline TFBGA84: plastic thin fine-pitch ball grid array package; 84 balls; body 7 x 7 x 0.8 mm B D SOT904-1 A ball A1 index area A E A2 A1 detail X e1 ∅v ∅w b e C M M C A B C y y1 C N M L e K J H e2 G F E D C B A ball A1 index area 1 2 3 4 5 6