SOT99 Search Results

Contextual Info: SOT991-1 VFBGA56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 19 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

Contextual Info: Package outline XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm B D SOT996-2 A E A A1 detail X terminal 1 index area e1 1 4 8 5 C C A B C v w b e L1 y y1 C L2 L X 1 2 mm scale Dimensions mm are the original dimensions

Contextual Info: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls A B D SOT999-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b W V U T R P N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9

Contextual Info: Package outline HVQFN28: plastic thermal enhanced very thin quad flat package; no leads; 28 terminals; body 5 x 5 x 0.85 mm B D SOT993-1 A terminal 1 index area E A A1 c detail X e1 b e 8 14 v w C C A B C M M y1 C y L 7 15 e e2 Eh 21 1 terminal 1 index area

Contextual Info: Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4 x 4.5 x 0.65 mm Β ∆ SOT991-1 Α βαλλ Α1 ινδεξ αρεα Ε Α Α2 Α1 δεταιλ Ξ ε1 C ∅ϖΜ Χ Α Β ∅ωΜ Χ β ε Η Γ Φ Ε ∆ Χ Β

Contextual Info: Reflow soldering footprint 2.400 pa + oa 2.000 0.500 0.500 0.250 0.025 0.025 4.250 3.400 pa + oa 2.000 4.000 0.900 www.nxp.com 2009 NXP B.V. solder lands placement area solder paste occupied area Dimensions in mm sot996-2_fr All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not

Contextual Info: Package outline HWQFN24: plastic thermal enhanced very very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.75 mm B D SOT994-1 A terminal 1 index area E A A1 c detail X e1 1/2 e ∅v ∅w b e 7 12 M M C C A B C y1 C y L 13 6 e e2 Eh 1/2 e 1

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA256 package SOT999-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XSON8 package SOT996-3 Hx Gx P D P1 0.025 0.025 Hy By Gy Ay B solder lands placement area solder paste occupied area DIMENSIONS in mm P P1 Ay By B D Gx Gy Hx Hy 0.5 0.5 4 2 0.9 0.25 2

Contextual Info: Package outline HVQFN28: plastic thermal enhanced very thin quad flat package; no leads; 28 terminals; body 5 x 5 x 0.85 mm A B D SOT993-3 terminal 1 index area E A A1 c detail X e1 e 8 14 C C A B C v w b y y1 C L 15 7 e e2 Eh 1 21 terminal 1 index area 28

Contextual Info: Package outline VFBGA469S: plastic very thin fine-pitch ball grid array package; 469 balls; top 152 lands; stackable; body 14 x 14 x 0.6 mm D e4 ball/land A1 index area 1 2 3 4 6 5 7 8 B D1 e3 9 10 11 SOT990-1 ∅v ∅w b1 12 13 14 15 16 18 20 17 19 C A B

Contextual Info: Package outline LFBGA544: plastic low profile fine-pitch ball grid array package; 544 balls; body 14 x 14 x 1.25 mm B D SOT992-1 A ball A1 index area E A A2 A1 detail X e1 e AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e M M C C A B C y y1 C AE AC AA e W U

kt819g

Abstract: SOT9202 SM2174 2N3055-1 044VH10 B0450 2N3055-6 diode GG 71 SOT9903 STS107
Contextual Info: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 SOT9903 SOT9903 TIP73B 2N6488 044VH10 B0545B B0545B SK3510 ~~;~:; 25 30 SK3027 SK3029 SK3620 SK3563 BOW41 SM2174 2N3236 B0184 ~+~~g~ 35 40 • 45 50 2N6472 OTL7530 2N5972 BOX23 B0451 BOX23/40636 BOT55

Contextual Info: Package outline LFBGA459: plastic low profile fine-pitch ball grid array package; 459 balls A B D SOT998-1 ball A1 index area E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of HWQFN24 package SOT994-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

Contextual Info: Package outline HLQFN48R: plastic thermal enhanced low profile quad flat package; no leads; 48 terminals; resin based; body 7 x 7 x 1.15 mm A B D SOT995-2 terminal 1 index area A E detail X e1 e L1 L C 1/2 e v w b 13 24 C A B C y1 C y 25 12 e e2 Eh 1/2 e 1

Contextual Info: XS ON 8U SOT996-2 XSON8 U ; Reel pack, Reverse; SMD, 7" Q3/T4 Standard product orientation Orderable part number ending ,125 or H Ordering code (12NC) ending 125 Rev. 5 — 2 May 2013 Packing information 1. Packing method Printed plano box Barcode label Reel

NXP 12NC ending

Abstract: SOT996-2 SOT996 SOT99
Contextual Info: SOT996-2 Reversed product orientation 12NC ending 125 Rev. 02 — 24 April 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT996-2 125

Contextual Info: Package outline HLQFN48R: plastic thermal enhanced low profile quad flat package; no leads; 48 terminals; resin based; body 7 x 7 x 1.2 mm A B D SOT995-1 terminal 1 index area A E detail X e1 e L1 L 1/2 e v w b 13 24 M M C C A B C y1 C y 25 12 e e2 Eh 1/2 e

nz104

Contextual Info: 74LVC2G66 Bilateral switch Rev. 7 — 22 June 2012 Product data sheet 1. General description The 74LVC2G66 is a low-power, low-voltage, high-speed Si-gate CMOS device. The 74LVC2G66 provides two single pole, single-throw analog switch functions. Each switch has two input/output terminals nY and nZ and an active HIGH enable input (nE).

MARKING V7 6-PIN

Contextual Info: 74LVC3G14 Triple inverting Schmitt trigger with 5 V tolerant input Rev. 11 — 6 July 2012 Product data sheet 1. General description The 74LVC3G14 provides three inverting buffers with Schmitt trigger input. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.

PA9540

Abstract: PA9540B
Contextual Info: PCA9540B 2-channel I2C-bus multiplexer Rev. 04 — 3 September 2009 Product data sheet 1. General description The PCA9540B is a 1-of-2 bidirectional translating multiplexer, controlled via the I2C-bus. The SCL/SDA upstream pair fans out to two SCx/SDx downstream pairs, or channels.

Marking code V7

Contextual Info: 74LVC2G00 Dual 2-input NAND gate Rev. 11 — 22 June 2012 Product data sheet 1. General description The 74LVC2G00 provides a 2-input NAND gate function. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in a mixed 3.3 V and 5 V environment.

74AHC3GU04

Abstract: 74AHC3GU04DC 74AHC3GU04DP 74AHC3GU04GM JESD22-A114E MO-187
Contextual Info: 74AHC3GU04 Inverter Rev. 03 — 26 January 2009 Product data sheet 1. General description The 74AHC3GU04 is a high-speed Si-gate CMOS device. This device provides the inverting single stage function. 2. Features • Symmetrical output impedance ■ High noise immunity