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    STATS CHIPPAC Search Results

    STATS CHIPPAC Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    CD74HCT574QPWRG4Q1
    		Texas Instruments Automotive Catalog High Speed CMOS Logic Octal Positive-Edge-Triggered D-Type Flip-Flops with 3-Stat 20-TSSOP -40 to 125 Visit Texas Instruments
    CD74HCT574QM96G4Q1
    		Texas Instruments Automotive Catalog High Speed CMOS Logic Octal Positive-Edge-Triggered D-Type Flip-Flops with 3-Stat 20-SOIC -40 to 125 Visit Texas Instruments Buy

    STATS CHIPPAC Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    JESD51-2

    Abstract: exposed QFP 144 100L JESD51-7 Techpoint
    Contextual Info: MQFP-ed Exposed Drop-in Heat Slug Metric Quad Flat Pack • 14 x 20mm to 32 x 32mm • 100 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 20mm to 32 x 32mm STATS ChipPAC’s Exposed Drop-In Heat Slug Metric Quad


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    AN 7823

    Abstract: 100L JESD51-2 JESD51-7 Techpoint
    Contextual Info: MQFP-d Heat Spreader Metric Quad Flat Pack • 14 x 14mm to 32 x 32mm • 64 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 14mm to 32 x 32mm STATS ChipPAC’s Heat Spreader Metric Quad Flat Pack MQFP-d is a thermally enhanced version of the QFP


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    exposed QFP 144

    Abstract: exposed QFP 128 TQFP-EP AN 7823 EP 603 QFP-EP 100L 144L JESD51-2 JESD51-7
    Contextual Info: QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 24 x 24mm STATS ChipPAC’s Exposed Pad Quad Flat Pack QFP-ep is a thermally enhanced version of the QFP package. Thermal


    Original     		PDF

    STATS ChipPAC

    Abstract: AN 7823 EP 603 LQFP Package LQFP Package tray QFP JEDEC tray 64 leads qfp 32 QFP PACKAGE thermal resistance Techpoint
    Contextual Info: QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a conventional QFP package FEATURES DESCRIPTION • Combining devices into one package reduces PCB real estate and cost STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die


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    Techpoint

    Abstract: 100L JESD51-2 JESD51-7 lqfp 7x7 tray QFP 128 bonding
    Contextual Info: LQFP Low Profile Quad Flat Pack • 7 x 7mm to 28 x 28mm body sizes • 32 to 208 lead counts • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 28 x 28mm STATS ChipPAC’s LQFP is a low profile 1.4mm version of the QFP. The LQFP is a leadframe based, plastic encapsulated


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    JESD51-7

    Abstract: 100L JESD51-2 STATS ChipPAC Techpoint
    Contextual Info: MQFP Metric Quad Flat Pack • 10 x 10mm to 32 x 32mm body sizes • 44 to 240 lead counts • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 10 x 10mm to 32 x 32mm STATS ChipPAC’s Metric Quad Flat Pack MQFP is a leadframe based, plastic encapsulated package with gull


    Original     		80mmC JESD51-7 100L JESD51-2 STATS ChipPAC Techpoint PDF

    100L

    Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
    Contextual Info: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP


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    cx28500-12

    Abstract: CX28500G-12 CX28500 traceability M28529G-12
    Contextual Info: September 3, 2009 CN-090309 Customer Notification Test Site Transfer for CX28500, M28525, and M28529 Products Dear Valued Customer: This notification is a supplement to CN-071309 regarding the closure of the STATS test facility in San Diego, California, and the test transfer of multiple products. During the qualification process for these products, it was


    Original     		CN-090309 CX28500, M28525, M28529 CN-071309 CX28500-12, CX28500G-12, M28525-12, M28525G-12, M28529-12, cx28500-12 CX28500G-12 CX28500 traceability M28529G-12 PDF

    25821

    Abstract: dallas date code ds12887 25854
    Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC


    Original     		DS1621 DS1869 DE940040AAC DH833210AAB DS2181A DS5002 DE004552ABD DN012259AAL DN028766AAD 25821 dallas date code ds12887 25854 PDF

    JESD51-9

    Abstract: TFLGA AN 7823 JESD51-2
    Contextual Info: FLGA Fine Pitch Land Grid Array • Array molded, cost effective, space-saving packaging solution • Available in 1.20mm TFLGA , 1.00mm (VFLGA), and 0.80mm (WFLGA) maximum thickness • Thinner than FBGA • Exposed thermal/mechanical lands available • Laminate substrate based enabling 2 and 4


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    Analog devices marking Information MSOP

    Abstract: TSSOP-EP 0.5 mm pitch TSSOP tssop 38 footprint Analog 8 msop devices marking AN 7823 Analog devices marking Information PACKAGE TSSOP_ ST TSSOP Marking die paddle MSOP-EP
    Contextual Info: TSSOP and MSOP Small Outline Packages • Wide range of body sizes • 8 to 56 lead counts • Thermally enhanced versions available TSSOP-ep and MSOP-ep FEATURES TSSOP • Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm • Lead Count: 8L to 56L • Lead Pitch: 0.50mm & 0.65mm


    Original     		MO-153) Analog devices marking Information MSOP TSSOP-EP 0.5 mm pitch TSSOP tssop 38 footprint Analog 8 msop devices marking AN 7823 Analog devices marking Information PACKAGE TSSOP_ ST TSSOP Marking die paddle MSOP-EP PDF

    DUAL ROW QFN leadframe

    Abstract: QFN tray qfn 4x4 JEDEC qfn tray tray qfn 8x8 tray qfn 6x6 QFN tray 8x8 tray qfn 9x9 QFN 64 8x8 PACKAGE TRAY AN 7823 JEDEC qfn tray 5x5
    Contextual Info: QFN Quad Flat No-Lead Package • Punch or Saw singulated formats • Body sizes from 2 x 2mm to 12 x 12mm • Pin counts from 4L to 156L • Square or rectangular body sizes • Leads on four sides of the body QFN • Leads on two opposing sides of the


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    techpoint

    Abstract: AN 7823 Unbiased HAST 130, 85 RH, 100 Hrs
    Contextual Info: FLGA-SD Fine Pitch Land Grid Array - Stacked Die • Stacking of die allows for more functionality in an array molded, cost effective, space saving package solution • Available in 1.2mm TFLGA , 1.0mm (VFLGA), and 0.8mm (WFLGA) maximum thickness • Thinner than FBGA


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    AN 7823

    Abstract: Techpoint
    Contextual Info: BCC Bump Chip Carrier BCC+ exposed paddle without ground ring • Saw singulated format • Package height 0.8mm max. • Square body size (rectangular body designable) • Staggered dual row or single row bump design BCC+ (exposed paddle with ground ring)


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    VFBGA 120

    Abstract: VFBGA package tray tray 23X23 10x14 239.2 AN 7823 chippac tray 8X14 vFBGA* 96 bALL
    Contextual Info: FBGA-SD Fine Pitch Ball Grid Array - Stacked Die • FBGA-SD: Laminate substrate based enabling 2 & 4 layers of routing flexibility • FBGA-T-SD: Single metal layer tape based substrate with dense routing & good electrical performance • Available in 1.4mm LFBGA-SD , 1.2mm (TFBGASD/TFBGA-T-SD), 1.0mm (VFBGA-SD/VFBGA-TSD) & 0.80mm (WFBGA-SD) maximum package


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    997E-07

    Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS21352 A4 DK031452AB LQFP STRESS: HIGH VOLTAGE LIFE MONITOR DATE ASSEMBLY


    Original     		DK031452AB DS21352 DM941230AG DN041061AAE DK007198AAF DK016058AA DK016058AA DS2108 997E-07 PDF

    dallas date code ds1230

    Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS1620 D1 JUN '01 27096 0109 CPS ChipPac, China DH046190AAI SOIC 50 50 DS1869 A3 JUN '00


    Original     		DH046190AAI DS1620 DS1869 DH833210AAB DS5002 DN028766AAD DN030363AAA J-STD-020 DS1302 dallas date code ds1230 PDF

    ECG sensor

    Abstract: epic sensor ECG Semiconductors WLCSP flip chip FO-WLP micromechanical
    Contextual Info: Plessey Semiconductors debuts ECG sensor from passive component project - Electro. Page 1 of 2 ADVERTISE | SUBSCRIBE Home Semiconductors Packaging MEMS LEDs Displays Photovoltaics Energy Storage ElectroIQ E-Source Magazines Plessey Semiconductors debuts ECG sensor from


    Original     		/03/plessey-semiconductors-debuts-ecg-sen ECG sensor epic sensor ECG Semiconductors WLCSP flip chip FO-WLP micromechanical PDF

    TI date code

    Abstract: 271-14
    Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS21352 A4 DN033071AAA LQFP STRESS: HIGH VOLTAGE LIFE MAR '01 26769 0103


    Original     		DS21352 DN033071AAA DS2108 DN041061AAE TI date code 271-14 PDF

    TI date code

    Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C3 JUN '00 25568 0011 Carsem S DM941230AG


    Original     		DM941230AG DM941226AA DS2502 DM941226AA DM941230AG TI date code PDF

    25804

    Contextual Info: RELIABILITY MONITOR DS1000Z-25 OCT '00 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 150x1.4 OSEP 0033 PROCESS Single Poly, Single Metal DE009456ACE 8 SOIC 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1


    Original     		DS1000Z-25 DS1000 DE009456ACE 150x1 DS87C520 DE029195AAB 650x65 25804 PDF

    dallas date code ds1230

    Abstract: dallas ds1230 25919 DS1230
    Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 DE940040AAC SOIC A7 MAR '00 25224 9950 OSEP PACKAGE READ POINT QTY FAIL 50 50 RELIABILITY MONITOR STRESS:


    Original     		DS1621 DE940040AAC DS5002 DS87C520 DM925587AAF DK935356AAB DK933191AAJ DE952427AAD DE014522ADB dallas date code ds1230 dallas ds1230 25919 DS1230 PDF

    DALLAS DS80C320

    Abstract: 25863
    Contextual Info: RELIABILITY MONITOR DS1232L JAN '00 Monitor DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232 C2-L 150 9948 PROCESS Single Poly, Single Metal DK933191AAJ 8 SOIC ATP Anam, PI 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7


    Original     		DS1232L DS1232 DK933191AAJ HRS87C520 DS87C520 DE013425AAD J-STD-020 30C/60% DALLAS DS80C320 25863 PDF

    JSTD-020

    Abstract: DM035 26438
    Contextual Info: RELIABILITY MONITOR DS1232L JAN '01 MONITOR REVISION DATE CD LOT NUMBER PINS PACKAGE 0051 DK038265AAC 8 C2-L SOIC PROCESS Single Poly, Single Metal 0.8 µm Standard Process DEVICE DS1232 WIDTH ASSEMBLY SITE 150x1.4 ATP Anam, PI JOB NO DESCRIPT Cf: 60% Ea: 0.7


    Original     		DS1232L DK038265AAC DS1232 J-STD-020 85C/85% 14x20x DS80CH11 DS80CH11 DN034351AA JSTD-020 DM035 26438 PDF