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    STMICROELECTRONICS MARKING CODE DATE BGA Search Results

    STMICROELECTRONICS MARKING CODE DATE BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54LS42/BEA Rochester Electronics LLC 54LS42 - DECODER, BCD-TO-DECIMAL - Dual marked (M38510/30703BEA) Visit Rochester Electronics LLC Buy
    5446/BEA Rochester Electronics LLC 5446 - Decoder, BCD-To-7-Segment, With Open-Collector Outputs - Dual marked (M38510/01006BEA) Visit Rochester Electronics LLC Buy
    5447/BEA Rochester Electronics LLC 5447 - Decoder, BCD-To-7-Segment, With Open-Collector Outputs - Dual marked (M38510/01007BEA) Visit Rochester Electronics LLC Buy
    MG8097/B Rochester Electronics LLC 8097 - Math Coprocessor - Dual marked (8506301ZA) Visit Rochester Electronics LLC Buy
    5490/BCA Rochester Electronics LLC 5490 - Decade Counter - Dual marked (M38510/01307BCA) Visit Rochester Electronics LLC Buy

    STMICROELECTRONICS MARKING CODE DATE BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    STMicroelectronics smd marking code

    Abstract: smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MLD-MIC/05/943 Notification Date 02/23/2005 CONVERSION TO PB-FREE PRODUCTION MIC - MICROCONTROLLERS 1/4 PCN MLD-MIC/05/943 - Notification Date 02/23/2005 Table 1. Change Identification Product Identification Product Family/Commercial Product


    Original     		PDF MLD-MIC/05/943 MLD-MIC/05/943 STMicroelectronics smd marking code smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK

    STMicroelectronics marking code date

    Abstract: BGA288, 19X19 LOT code stmicroelectronics Date Code Marking STMicroelectronics BGA288 Qualification STMicroelectronics date CODE ST BGA STMicroelectronics lot number STMicroelectronics code date marking
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN CMG-IMG/04/457 INTRODUCTION OF KINSUS SUBSTRATE LEAD FREE PACKAGE FOR ST20DC2 2004/02/26 PCN CMG-IMG/04/457 Product Family /Commercial Product ST20DC2 Type Of Change Package assembly material change Reason For Change


    Original     		PDF CMG-IMG/04/457 ST20DC2 ST20DC2. BGA288 19x19 25-Jun-2004 19-Apr-2004 18-Jun-2004 STMicroelectronics marking code date BGA288, 19X19 LOT code stmicroelectronics Date Code Marking STMicroelectronics Qualification STMicroelectronics date CODE ST BGA STMicroelectronics lot number STMicroelectronics code date marking

    STMicroelectronics smd marking code

    Abstract: BGA and QFP Package 14x14 STMICROELECTRONICS MSL STMicroelectronics date code tssop-14 HiQuad package STMicroelectronics pentawatt date code opto mold compound infineon msl TQFP 14X20 ST TSSOP Marking
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN CRP/04/744 LEAD-FREE CONVERSION PROGRAM Compliance with RoHS 1 1 RoHS = Restriction of the use of certain Hazardous Substances European directive 2002/95/EC November 18, 2004 Page 1/12 2004 STMicroelectronics - All Rights Reserved


    Original     		PDF CRP/04/744 2002/95/EC) STMicroelectronics smd marking code BGA and QFP Package 14x14 STMICROELECTRONICS MSL STMicroelectronics date code tssop-14 HiQuad package STMicroelectronics pentawatt date code opto mold compound infineon msl TQFP 14X20 ST TSSOP Marking

    STMicroelectronics smd marking code

    Abstract: TOPSIDE MARKING STMicroelectronics smd marking code stmicroelectronics AN1553 IEC286-3 SMD ST MICROELECTRONICS STMicroelectronics marking code date BGA
    Text: AN1553 APPLICATION NOTE Flip-Chip 300µm recommendations for Audio Power Amplifier by Jean-Marc BUGNARD 1 - INTRODUCTION 2 - PRODUCT DESCRIPTION The competitive market of portable equipment, notably the mobile phone market, is driven by a challenging development of highly integrated


    Original     		PDF AN1553 STMicroelectronics smd marking code TOPSIDE MARKING STMicroelectronics smd marking code stmicroelectronics AN1553 IEC286-3 SMD ST MICROELECTRONICS STMicroelectronics marking code date BGA

    EIA standards 783

    Abstract: smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code
    Text: AN1235 Application note IPAD 500 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip Chips. For information on 400 µm Flip Chips, see Application note AN2348.


    Original     		PDF AN1235 AN2348. EIA standards 783 smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code

    EIA 763

    Abstract: AN2348 EIA standards 783 STMicroelectronics smd marking code WLCSP stencil design 10E12 10E4 10E8 AN1235 ANTISTATIC
    Text: AN2348 Application note IPAD and ASD Application Specific Devices 400 µm Flip-Chip: Package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip-Chips. For information on 500 µm FlipChips, see Application note AN1235.


    Original     		PDF AN2348 AN1235. EIA 763 AN2348 EIA standards 783 STMicroelectronics smd marking code WLCSP stencil design 10E12 10E4 10E8 AN1235 ANTISTATIC

    EIA 763

    Abstract: EIA-481-C EIA standards 783 underfill WLCSP stencil design 10E12 10E4 10E8 AN1235 AN2348
    Text: AN1235 Application note IPAD and ASD Application Specific Devices 500 µm Flip-Chip: Package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip-Chips. For information on 400 µm FlipChips, see Application note AN2348.


    Original     		PDF AN1235 AN2348. EIA 763 EIA-481-C EIA standards 783 underfill WLCSP stencil design 10E12 10E4 10E8 AN1235 AN2348

    Tape Resistivity 10E8 Ohm 10E4

    Abstract: STMicroelectronics smd marking code smd diode order marking code stmicroelectronics 10E12 10E4 10E8 AN1235 IEC286-3 J-STD-020A Lead Free reflow soldering profile BGA
    Text: AN1235 APPLICATION NOTE ASD and IPAD™ FLIP-CHIP: PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE I - INTRODUCTION The competitive market of portable equipment, notably the mobile phone market, is driven by a challenging development of highly integrated products. To allow manufacturers of portable equipment to reduce


    Original     		PDF AN1235 Tape Resistivity 10E8 Ohm 10E4 STMicroelectronics smd marking code smd diode order marking code stmicroelectronics 10E12 10E4 10E8 AN1235 IEC286-3 J-STD-020A Lead Free reflow soldering profile BGA

    WLCSP stencil design

    Abstract: PI0297 JESD22-B101 wlcsp inspection WLCSP66 onyx EIA 763 st micro trace date code
    Text: PI0297 Package Information Description of WLCSP for microcontrollers and recommendations for use Introduction This document describes the WLCSP wafer level chip size package , and provides recommendation on how to use it. Only WLCSP for microcontrollers are described herein.


    Original     		PDF PI0297 WLCSP stencil design JESD22-B101 wlcsp inspection WLCSP66 onyx EIA 763 st micro trace date code

    AN2348

    Abstract: EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12
    Text: AN2348 Application note IPAD 400 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip Chips. For information on 500 µm Flip Chips, see Application note AN1235.


    Original     		PDF AN2348 AN1235. AN2348 EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12

    WLCSP66

    Abstract: PI0297 EIA-481-C EIA 481-C WLCSP64 WLCSP underfill WLCSP stencil design comintec onyx32 smd code marking wlcsp 9
    Text: PI0297 Package Information Description of WLCSP for microcontrollers and recommendations for use Introduction This document describes the WLCSP wafer level chip size package , and provides recommendation on how to use it. Only WLCSP for microcontrollers are described herein.


    Original     		PDF PI0297 WLCSP66 PI0297 EIA-481-C EIA 481-C WLCSP64 WLCSP underfill WLCSP stencil design comintec onyx32 smd code marking wlcsp 9

    STR912FAW44X6

    Abstract: STR91xFAxxxxx ARM966E-S BGA144 LFBGA144 LQFP128 LQFP80 STR91XFA STR912FAW4 STR91xFAxxx
    Text: STR91xFA Errata sheet STR91xFA limitations and corrections Silicon identification STR91x microcontrollers have two major salestype groups, as follows: ● The initial group consists of STR91xFxxxxx devices, for example STR912FW44X6, with silicon revisions B, and D. Detailed technical information for these devices can be


    Original     		PDF STR91xFA STR91xFA STR91x STR91xFxxxxx STR912FW44X6, STR91xF STR91xFAxxxxx STR912FAW44X6, STR912FAW44X6 ARM966E-S BGA144 LFBGA144 LQFP128 LQFP80 STR912FAW4 STR91xFAxxx

    ARM str91x

    Abstract: STR912FAW44x6 STR912 STR912FA Part Marking STMicroelectronics flash memory PL190 8 Bit ADC Flash Generic STMicroelectronics LQFP marking code date STR912FAW44x6* datasheet ARM966E-S
    Text: STR91xFA Errata sheet STR91xFA limitations and corrections Silicon identification STR91x microcontrollers have two major salestype groups, as follows: ● The initial group consists of STR91xFxxxxx devices, for example, STR912FW44X6, with silicon revisions B and D. Detailed technical information for these devices can be


    Original     		PDF STR91xFA STR91xFA STR91x STR91xFxxxxx STR912FW44X6, STR91xF STR91xFAxxxxx STR912FAW44X6, ARM str91x STR912FAW44x6 STR912 STR912FA Part Marking STMicroelectronics flash memory PL190 8 Bit ADC Flash Generic STMicroelectronics LQFP marking code date STR912FAW44x6* datasheet ARM966E-S

    STR912FAW44X6

    Abstract: STR912FAW4 STR912FAW44x6* datasheet LQFP80 PL190 ARM966E-S BGA144 LFBGA144 LQFP128 STR912FW44X6
    Text: STR91xFA Errata sheet STR91xFA limitations and corrections Silicon identification STR91x microcontrollers have two major salestype groups, as follows: ● The initial group consists of STR91xFxxxxx devices, for example, STR912FW44X6, with silicon revisions B and D. Detailed technical information for these devices can be


    Original     		PDF STR91xFA STR91xFA STR91x STR91xFxxxxx STR912FW44X6, STR91xF STR91xFAxxxxx STR912FAW44X6, STR912FAW44X6 STR912FAW4 STR912FAW44x6* datasheet LQFP80 PL190 ARM966E-S BGA144 LFBGA144 LQFP128 STR912FW44X6

    MICRO SD card footprint PCB

    Abstract: micro SD card CARD PCB FOOTPRINT ST6G3244ME ST6G3244 IL801
    Text: ST6G3244ME Level translator for SD, SDIO, mini SD, and micro SD Cards with internal I/O supply and ±15 kV ESD protection Features • Supports 60 MHz clock rate ■ Supports DDR mode for SD Card ■ Compliant with – SD Specification Part 1 Physical Layer


    Original     		PDF ST6G3244ME SDR12, SDR25, DDR50) MICRO SD card footprint PCB micro SD card CARD PCB FOOTPRINT ST6G3244ME ST6G3244 IL801

    QST108

    Abstract: AN2035 AN2036 CHARGE-TRANSFER TOUCH SENSOR LQFP32 7x7 Pb-free package QUANTUM CAPACITIVE AN1181 AN1709 AN2547 JESD97
    Text: QST108 Capacitive touch sensor device 8 keys with individual key state outputs or I2C interface Not For New Design Features • Patented charge-transfer design ■ Up to 8 independent QTouch keys supported ■ Individual key state outputs or I2C interface


    Original     		PDF QST108 QST108 AN2035 AN2036 CHARGE-TRANSFER TOUCH SENSOR LQFP32 7x7 Pb-free package QUANTUM CAPACITIVE AN1181 AN1709 AN2547 JESD97

    SPC563M64

    Abstract: ps4127 PS4890 SPC563M64L5 ps8845 NEXUS FLASH ERASE ps5060 BGA208 LQFP144 LQFP176
    Text: SPC563M64 Errata sheet SPC563M64 device errata JTAG_ID = 0x2AE01041 Introduction This errata sheet describes all the functional and electrical problems known in the revision 2.1 of the SPC563M64 devices, identified with the JTAG_ID = 0x2AE01041 and the Flash


    Original     		PDF SPC563M64 SPC563M64 0x2AE01041 0x2AE01041 RM0015 ps4127 PS4890 SPC563M64L5 ps8845 NEXUS FLASH ERASE ps5060 BGA208 LQFP144 LQFP176

    SPC563M64

    Abstract: e7112 MINUS16 SPC560B PS/QFP176 RM0015 FlexCAN E8431 QFP-176 SPC563M64L7
    Text: SPC563M64 Errata sheet SPC563M64 device errata JTAG_ID = 0x2AE01041, EmbAlgo v3.6 Introduction This errata sheet describes all the functional and electrical problems known in the revision 2.0 of the SPC563M64 devices, identified with the JTAG_ID = 0x2AE01041 and the Flash


    Original     		PDF SPC563M64 SPC563M64 0x2AE01041, 0x2AE01041 RM0015 0x2AE01041 e7112 MINUS16 SPC560B PS/QFP176 FlexCAN E8431 QFP-176 SPC563M64L7

    LQFP32 7x7 Pb-free package

    Abstract: QST108KT6 QFN 7X7 32-pin "Touch Sensor IC" thin film filter GPON AN2035 AN2036 AN1181 AN1709 AN2547
    Text: QST108 Capacitive touch sensor device 8 keys with individual key state outputs or I2C interface Not For New Design Features • Patented charge-transfer design ■ Up to 8 independent QTouch keys supported ■ Individual key state outputs or I2C interface


    Original     		PDF QST108 LQFP32 LQFP32 7x7 Pb-free package QST108KT6 QFN 7X7 32-pin "Touch Sensor IC" thin film filter GPON AN2035 AN2036 AN1181 AN1709 AN2547

    JESD79-2B

    Abstract: CR88 DDR2-667 STLS2E02 STLS2F01 1013tdi
    Text: STLS2F02-LP high performance 64-bit superscalar MIPS Loongson 2F microprocessor Preliminary Data Features • 64-bit superscalar architecture ■ 800 MHz clock frequency ■ Single/double precision floating-point units ■ New streaming multimedia instruction set


    Original     		PDF STLS2F02-LP 64-bit DDR2-667 27x27 JESD79-2B CR88 STLS2E02 STLS2F01 1013tdi

    E329

    Abstract: No abstract text available
    Text: QST108 Capacitive touch sensor device 8 keys with individual key state outputs or I2C interface Not For New Design Features • Patented charge-transfer design ■ Up to 8 independent QTouch keys supported ■ Individual key state outputs or I2C interface


    Original     		PDF QST108 LQFP32 QST108 E329

    Untitled

    Abstract: No abstract text available
    Text: QST104 Capacitive touch sensor device 4 keys with individual key state outputs or I2C interface Preliminary Data Features • Patented charge-transfer design ■ Up to 4 independent QTouch keys supported ■ Individual key state outputs or I2C interface


    Original     		PDF QST104 LQFP32 QST104

    AN2547

    Abstract: JESD97 LQFP32 QST608
    Text: QST608 Capacitive touch sensor device with rotor or slider plus five extra keys and I2C interface Preliminary Data Features • Patented charge-transfer design ■ Rotor or slider plus five extra keys ■ Up to five general-purpose outputs ■ I2C interface


    Original     		PDF QST608 AN2547 JESD97 LQFP32 QST608

    dad2000

    Abstract: dlp dad2000 MARKING 3D regulator
    Text: DLPA200 www.ti.com DLPS015C – APRIL 2010 – REVISED SEPTEMBER 2013 DLP DLPA200 DMD Micromirror Driver Check for Samples: DLPA200 FEATURES 1 • • • • • APPLICATIONS • • • Industrial: – Direct Imaging Lithography – Laser Marking and Repair Systems


    Original     		PDF DLPA200 DLPS015C DLPA200 dad2000 dlp dad2000 MARKING 3D regulator