T 3637 000 Search Results

Contextual Info: m uss onowBE noted REV. AN DROMONS ME N MCHES TABLE 1 LEAD STYLE -0 2 SEE FIG BOARD SPACE WHEN MATED WITH SOLC "A" USE TERMINAL .2200 [5.5S8] T-1M13—01—X—2 1 .2500 [6.350] -1 2 .2850 [7.239] T—1M14—02—X—2 2 .3150 [8.000] -2 2 .3637 [9.238] T—1M14—03—X—2

Contextual Info: UNLES5 OTHERWISE NOTED REV. AK DIMENSIONS ARE IN INCHES TABLE 1 USE TERMINAL SEE FIG .2 2 0 0 [5 .5 8 8 ] T— 1 M 1 3 -0 1 -X — 2 1 .25 0 0 [6 .3 5 0 ] -1 2 .2 8 5 0 [7 ,2 3 9 ] T-1M 14— 0 2 - X - 2 2 .3150 [8 .0 0 0 ] -2 2 .3637 [9 .2 3 8 ] T-1M 14— 0 3 - X - 2

Contextual Info: T1 / El / ISDN PRI Quad T l / E l 8 Transformers per package For T l/E l/IS D N PRI Telecom Dual and Quad Transceiver Applications 1500 minimum Isolation 40-Pin Surface Mount 50 mil style package Electrical Specifications at 25° C Part Number Turns Ratio

IEC connectors 130-9 12 pin

Abstract: T336-2 T 3637 000 Amphenol 3361 T 3361 001 T 3361 010 T3362000 T 3361 T3361 T3402000
Contextual Info: C 091 A Main Features • Metal threaded coupling acc. to DIN EN 60 130-9 IEC 60 130-9 . • Number of contacts are 2 to 8, 12 and 14. • Internal metal strain relief with half shell construction and snap-in latching. • Complete EMI shielding in fully mated and locked position.

Contextual Info: 'I M Ü ilJ i u i U l i s ï Straight FEATURES . • • ■ ■ Excellent for high density applications Minimizes PC Board stacking height IR, vapor phase and wave solder compatible Chamfered entry prevents pin stubbing Mates with Crane's PGM, IPGM, MPGM Series headers

SO53

Abstract: 91l16 cxrj
Contextual Info: APRIL 29, 1991 TEST REPORT 591192 QUALIFICATION TESTING 68 POSITION PLCC SOCKET SAMTEC CORPORATION w APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. 1 .sxR Contach Research This is to certify that the evaluation described herein was

ml 94v-0

Contextual Info: ATP/ATL Series A 'i.r l- c ' FEATURES ./ T SINGLE ROW 1 to 36 positions Chamfered entry prevents pin stubbing High reliability tuning fork contact Standoffs reduce rework due to flux residue Low insertion force and Hi Temp versions available Mates with PEG, MPEG, DPEG, LPEG, TPEG headers

Contextual Info: VTP7840 VTP Process Photodiodes P A C K A G E DIMENSIONS inch mm PRODUCT DESCRIPTION CASE 51 Planar silicon photodiode in a transfer molded, large lensed sidelooker pack­ age. The dark package material filters out visible light but passes infrared. These diodes exhibit low dark current

Vactec

Abstract: VTP4085 VTP4085S
Contextual Info: VTP Process Photodiodes V T P 4085, 4085S PACKAGE DIMENSIONS inch mm .067 (1 .7 0 ) .305 ( 7 . 7 5 ) CASE 13 (0 . 5 1 ) CERAMIC CHIP ACTIVE AREA: .032 in2 ¡21 ram2) PRODUCT DESCRIPTION Large area planar silicon photodiode mounted on a two lead ceramic sub­

Contextual Info: VTP1188S VTP Process Photodiodes CASE 12 LENSED CERAMIC CHIP ACTIVE AREA: .017 in2 11 mm2 PRODUCT DESCRIPTION Large area planar silicon photodiode mounted on a two lead ceramic substrate. A clear molded lens is used to increase sensitivity. Low junction

VTP5050

Abstract: 0RVR k4070 F508
Contextual Info: VTP5050 VTP Process Photodiodes P A C K A G E DIMENSIONS inch mm PRODUCT DESCRIPTION CASE 14 Planar silicon photodiode in a “flat” window, dual lead TO-5 package. Cathode is common to the case. These diodes exhibit low dark current under reverse bias and fast speed of response.

VTP7840

Contextual Info: VTP7840 VTP Process Photodiodes P A C K A G E D IM E N S IO N S inch mm PR O D U C T D ESC R IP T IO N CASE 51 Planar silicon photodiode in a transfer molded, large lensed sidelooker pack­ age. The dark package material filters out visible light but passes infrared.

Photodiode vactec

Abstract: EG*G Vactec VTP1232
Contextual Info: VTP1232 VTP Process Photodiodes P A C K A G E DIMENSIONS inch mm 2 4 0 ( 6 .1 0 ) M IN IM U M .05-0 ( t . 2 7 ) , .030 (0 .7 6 ) .2 2 0 (5 .5 9 ) . 3 4 (8 . 6 ) .1 7 (4 . 3 ) ^<t£)nom- .026 (0 .6 6 ) [.0 1 7 .2 0 0 ( 5 . 0 8 ) .1 8 0 ( 4 . 5 7 ) c JL (0 .4 3 )

Contextual Info: SO LDER SUFFIX CUSTOM ER TERMINAL R oH S L E A D P b -F R E E LF1 Sn96% , A q 4 % Yes No ioe nrr 1:1 DOT LOCATES TERM. #1 RD+ (T )- .610 ±.015 [15.49 ±.38] T-JJJJ RX+ JïTTTL RD- - RX- 1:1 TD+ @ - 1.135 MAX. [28.83] TX+ liü jJ CTD @ - j^TTTL T D -@ .088 REF. 7

Contextual Info: VTP8350 VTP Process Photodiodes PACKAGE DIMENSIONS inch mm PRODUCT DESCRIPTION CASE 11 Planar silicon photodiode mounted on a two lead ceramic substrate and coated with a thick layer of clear epoxy. These diodes exhibit low dark current under reverse bias and fast

Contextual Info: VTP5050 VTP Process Photodiodes PACKAGE DIMENSIONS inch mm PRODUCT DESCRIPTION CASE 14 Planar silicon photodiode in a “flat” window, dual lead TO-5 package. Cathode is common to the case. These diodes exhibit low dark current under reverse bias and fast speed of response.

IEC130

Abstract: T3638404 C091 T 3361 D T 3437 902 IEC connectors 130-9 DIN 42 504 circular connector T 3379 552
Contextual Info: Amphenol C 091 A/B/D Circular Connectors Amphenol-Tuchel Electronics GmbH General information These connectors are designed and produced in conformity with the low-voltage directive 72/23/EWG respectively Gerätesicherheitsgesetz (German law). We reserve the right to change the design due to improvement in quality,

IEC-60286-3 0402

Abstract: vishay melf WSL2010 WSL2512 WSR2 0.05
Contextual Info: Surface Mount Resistor Packaging Vishay Resistor Packaging FILM CHIP PACKAGING BLISTER TAPE ON REEL BULK FEEDING MAGAZINE ACC. IEC 60286-3 SIZE TAPE WIDTH 0201 0402 0603 0805 1206 1210 DIAMETER PIECES/ REEL 8 mm 180 mm/7" 10 000 P0/RT7 Papertape 330 mm/13"

Contextual Info: sC jU C .•£ i i B r . c t F O R S O T H ' m R I ADs.D A N D BAYO NET REC EPTAC LES r - - M SQUARE— 1 r s a n B AY O N ET RECEPTACLE 4 8 -1 0 R X X -X X X M S 2 4 2 6 4 R X X B -X X X TH R E A D E D RECEPTACLE 4 8 -0 0 R X X -X X X M S 2 4 2 6 4 R X X T -X X X

T 3361 001

Abstract: VN02 015 0005 stereo 2.5mm socket pcb 2.5mm female stereo pins DIN 4 PIN CIRCULAR PLASTIC CONNECTORS k 3638 3358 transistor 3402 002 46 amphenol 2 pin male circular plug connector 12 pin din flat
Contextual Info: Amphenol C 091 A/B/D Circular Connectors Amphenol-Tuchel Electronics GmbH General information These connectors are designed and produced in conformity with the low-voltage directive 72/23/EWG respectively Gerätesicherheitsgesetz (German law). We reserve the right to change the design due to improvement in quality,

DIN 42 504

Abstract: Amphenol Assembly instructions T 3437 902 VN02 015 0005 31D004 60668 socapex Amphenol 3361 11d003 512 552
Contextual Info: C 091 D Main Features • Precision metal construction. • Ingress Protection class IP 67. • Threaded coupling acc. to IEC 130-9. • Number of contacts are 3 to 8, 12 and 14. • Internal metal strain relief. • Complete EMI shielding in the fully mated and locked position

ALL-07

Contextual Info: SK3735 DATEREV 4 -M NC PW TRW1C IN D W R E P BELEyEB THE M M ON THIS □RAMflNS TD K ISLIM LC . SMCE THE TECHNICAL n ra ra iA T D N a b v e n m e o f d -w rg c . t h e u s e r EM PLOTS SUCH INFORMATION AT H B OHN DISCRETIDN ANO R S K . PD 5IT m N C M 3U 5TRS3 ASSUUCS ND

Contextual Info: E1/T1/CEPT/ISDN-PRI - T3/E3/D3/STS-1 Interface Transformers for Telecommunication Products NT MAGNETICS s.r.o. Chebská 27 322 00 Plzeñ Tel: Int. + 420 377 - 338 351 Fax: Int. + 420 377 - 338 350 Email: talema@talema.cz Web Site: www.ntmagnetics.cz TALEMA ELEKTRONIK GMBH

Contextual Info: AMPLIMITE Subminiature D Connectors Catalog 82068 Revised 1-96 HD-20 All-Plastic Straight Posted Connectors With ACTION PIN Contacts Receptacles Low and High Profile .243 [6.17] , t D ' r 080±oio 1 [2.03±0 25] With Standard Mounting Holes .312 [7.92] #4-40 Thread