TCR500 Search Results

TCR1000

Abstract: TCR500 TCR500-PCI
Contextual Info: Install Guide – TCR500-PCI New Installations 1. Verify your package contents o TCR500-PCI Time Code Reader PCI card o TCR Installation & Software CD CD Contents: Masterclock, Inc. provides the following on the Installation & Software CD, which ships with the TCR card.

JEDEC 2a

Contextual Info: Datasheet CBW-Series Bondable Chip Resistors, non-magnetic Sizes: 0402, 0603, 0805, 1206 Features: •      Chip Resistors in thick film technology AgPd termination for flip chip assembly face-down; for conductive epoxy assembly or Gold termination for wire bonding (US/TC; face-up) as well as flip chip

Contextual Info: CBW-Series Bondable Chip Resistors, non-magnetic Sizes: 0402, 0603, 0805, 1206 Features: • • • • • • Chip Resistors in thick film technology AgPd termination for face-down assembly flip chip; for conductive epoxy assembly or Gold termination for face-up assembly (wire bondable US/TC)

WR08X

Abstract: WW18X wr06x WT04X WR20X WR12X
Contextual Info: Walsin Technology Corporation WUSN h t t p ://w w w .p a s s iv e c o m p o n e n t .c o m Thick Film Chip Resistors & Arrays Quick Reference Data • General purpose Chip-R Type Series No. Size Power rating at 70°C WR12X WR12A 1206 3216 1/4W General purpose

Contextual Info: CBR Series High Temperature Bondable Thick Film Chip Resistors • • • • • • • • Resistances from 10Ohms to 1TOhms AgPd Termination for face-down assembly Gold Termination for face-up assembly Power Rating 0.05 to 0.25Watt Resistance Tolerances to ± 5%

TCR500

Abstract: SiCr wire bond 60k4
Contextual Info: PMC Passive Micro Components OVERVIEW PMC thin-film technology offers comprehensive materials and processes combinations allowing electronic designers superior space saving, tolerance and signal integrity for semi custom designs in the MHz to GHz spectrum.