TEBGA Search Results

IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies

Abstract: J-STD-003 BGA reflow guide teBGA J-STD-015 SIZE OF 4V7& PADS FOR REFLOW BGA PROFILING PMC-970951 IPC-D-275 JESD22-A113
Contextual Info: APPLICATION NOTE PMC-970951 ISSUE 1 PMC-Sierra,Inc. SURFACE MOUNT ASSEMBLY of PBGA/TEBGA PACKAGES SURFACE MOUNT ASSEMBLY OF PBGA/TEBGA PACKAGES Issue 1: Sept. 1997 PMC-Sierra, Inc. 105-8555 Baxter Place, Burnaby, BC Canada V5A 4V7 604 415 - 6000 PMC-Sierra,Inc.

BGA-484P-M09

Contextual Info: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 484 PIN PLASTIC BGA-484P-M09 484-pin plastic TEBGA Ball pitch 1.00 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.36 mm Max

nitto GE

Abstract: GE-100L SXVX-50BHG nitto GE-100L SXVX-210BHG SXVX-50 HL832NX SXVX-210 Nitto GE 100 HL832HS
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-07 Product Affected: DATE: September 17, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 17mm x 17mm TEBGA-580 (Green) Product Mark

Marking Code 2K

Contextual Info: EEPROM & Memory Card Code Information 1/2 Last Updated : August 2009 S5XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 12. Package Type 1 : TEBGA A : SDIP C : CHIP BIZ E : LQFP G : CLCC J : ELP L : CERDIP N : COB Q : QFP S : SOP V : SSOP Y : FBGA 2. Large Classfication : MOS (5)

543-pin

Abstract: BGA-543P-M01 bga543
Contextual Info: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU MICROELECTRONICS DATA SHEET 543 PIN PLASTIC BGA-543P-M01 543-pin plastic TEBGA Lead pitch 1.00 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.36 mm MAX

SiSm672

Abstract: attansic f1 sis968 asus t12c J6001 Attansic l1 rlt8201bl Asus SiS307ELV INVERTER BOARD Asus A6
Contextual Info: 5 4 3 2 1 X51C Main BD. R1.0 BLOCK DIAGRAM CLOCK GEN. ICS9LPR363CGLF-T D Merom CPU D PAGE 29 FAN + Thermal sensor 478B uFCPGA PAGE 50 PAGE 3,4 FSB 800 MHz LVDS SiS307ELV PAGE 46 TV PAGE 45 167 BGA SiSM672 PAGE 25 DDR2 667MHz PAGE 7,8,9 CRT 847 TEBGA PAGE 10,11,12,13,14,15,16

cd 4553

Abstract: ic cd 4553 cmos 4553 ATM machine working circuit diagram GPON block diagram ic 4553 master 5087 mii to hdlc DS34S101 DS34S102
Contextual Info: ABRIDGED DATA SHEET Rev: 101708 DS34S101, DS34S102, DS34S104, DS34S108 Single/Dual/Quad/Octal TDM-over-Packet Chip General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial

te0509

Abstract: 7253X
Contextual Info: 7A ug us t, 20 05 09 :4 7: 19 PM PM7389 FREEDM 84A1024 Data Sheet Released ed ne sd ay ,1 FREEDM -84A1024 DATA SHEET Released Issue 4: March 2003 Do wn lo ad ed by Co nt e nt Te a m of Pa rtm in er In co n W Frame Engine and Datalink Manager 84A1024 Proprietary and Confidential to PMC-Sierra, Inc., and for its Customers’ Internal Use

32A1024

Contextual Info: PM7386 FREEDM 32A1024 Frame Engine and Datalink Manager FEATURES • Single-chip multi-channel packet processor supporting a maximum aggregate bandwidth of 64 Mbit/s for line rate throughput transfers of packet sizes from 40 to 9.6 Kbytes, for up to an aggregate of 32 T1s or 32 E1s.

EZR0

Abstract: SRAM SAMSUNG
Contextual Info: FREEDM -336A1024 PRELIMINARY DATA SHEET ISSUE 9 FRAME ENGINE AND DATA LINK MANAGER 336A1024 19 Ju ly, 20 02 11 :26 :56 AM PMC-1991476 ies Inc on Fr ida y, FREEDM™-336A1024 DATA SHEET PROPRIETARY AND CONFIDENTIAL PRELIMINARY ISSUE 9: MAY, 2002 Do wn loa

CS251

Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS601-00003-0v01-E Semicustom CMOS Standard Cell CS251 Series • DESCRIPTION The CS251 series of 55 nm standard cells is a line of CMOS ASICs that satisfy demands for lower power consumption, higher speed and higher integration.

Contextual Info: DS21448 3.3V E1/T1/J1 Quad Line Interface www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS21448 is a quad-port E1 or T1 line interface unit LIU for short-haul and long-haul applications. It incorporates four independent transmitters and four independent receivers in a single 144-pin PBGA or

TCXO A31 10MHZ

Abstract: MT48LC4M32B2TG-6 L1V16 Datum OCXO
Contextual Info: PRELIMINARY PRODUCT BRIEF: SUBJECT TO CHANGE Rev: 091407 DS34S108, DS34S104, DS34S102, DS34S101 Description Abridged General Description Features The IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC draft-compliant DS34S108 allows up to eight T1/E1 links or frame-based serial HDLC links to be

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC8314EEC Rev. 2, 11/2011 MPC8314E PowerQUICC II Pro Processor Hardware Specifications This document provides an overview of the MPC8314E PowerQUICC II Pro processor features, including a block

44L-84L

Abstract: 20L-28L LGA 16L SOT23 2A6
Contextual Info: SPECIFICATION NO. REV. 2000-0026 A DOCUMENT TITLE: SMD PACKAGE MOISTURE SENSITIVE TABLE OWNER: RELIABILITY MANAGER REQUIRED APPROVALS: RELIABILITY MANAGER QUALITY MANAGER AFFECTED PARTY NOTIFICATION: DO NOT INCLUDE REGULAR DISTRIBUTION PACKAGE ENGINEER DIRECTOR

BSP29 transistor

Abstract: C14R RSL2 RELAY 6 PORT LIU AISi12 LASCS rsl2 24 DS26324 DS26334 DS26334G
Contextual Info: DS26334 3.3V, 16-Channel, E1/T1/J1 Shortand Long-Haul Line Interface Unit www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS26334 is a 16-channel short/long-haul line interface unit LIU that supports E1/T1/J1 from a single 3.3V power supply. A single bill of material can

LA-4611P

Abstract: KB926QFA1 south bridge SIS 968 la4611 sis m672 307ELV SiS307ELV ICS9LPR600 JP36B kb926qf
Contextual Info: A B PJP1 PJP1 14W_DCIN 15W_DCIN 14W_45@ 15W_45@ C D E 1 1 Compal Confidential KSW01/91 Schematics Document 2 2 Intel Merom Processor with SiSM672/FX + DDRII + SiS968 + SiS307ELV 2008-08-01 ZZZ9 3 REV: 0.2 PCB ZZZ1 ZZZ3 ZZZ4 ZZZ5 ZZZ6 PCB LA-4611P LS-4243P

AL491

Abstract: KB926QFA1 LA-3961P south bridge SIS 968 kb926 ISL6251 LA-3541P apa2057a apa2056 kb926qf
Contextual Info: A B PJP1 PJP1 14W_DCIN 15W_DCIN 14W_45@ C D E 15W_45@ 1 1 ZZZ1 PCB <BOM Structure> Compal Confidential JFWXX Schematics Document 2 2 Intel Merom Processor with SiSM672MX + DDRII + SiS968 + SiS307LV 2007-09-06 REV: 0.3 3 4 4 B C Title Cover Page D Size B Date:

ic cd 4553

Abstract: cd 4553 Y1453 cts ocxo 10MHz TEBGA-484 RFC-5087 DS34S101 ic 4553 DS34S104GN DS34S108GN
Contextual Info: ABRIDGED DATA SHEET Rev: 032609 DS34S101, DS34S102, DS34S104, DS34S108 Single/Dual/Quad/Octal TDM-over-Packet Chip General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial

marking code G qfn 12

Abstract: uLGA MARKING CODE analog marking code 14 Analog Marking Information 3 mobile Camera Module package marking WF 5 marking 5 qfn marking z linear marking code
Contextual Info: Telephone Code Information • MOS • Linear-IC -1- Part Number Decoder MOS Code Information 1/2 S5XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 1. System LSI (S) 9~10. Mask Option 2. Large Classification : MOS (5) 11. " - " 3. Small Classification

RISC-Processor s3c2410

Abstract: MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B
Contextual Info: A Section MEMORY Table of Contents SECTION A PAGE DRAM SDRAM 3a – 4a DDR SDRAM 5a – 6a DDR2 SDRAM 7a RDRAM 8a NETWORK DRAM 8a MOBILE SDRAM 9a GRAPHICS DDR SDRAM 10a DRAM ORDERING INFORMATION 11a –13a NAND FLASH COMPONENTS, SMART MEDIA, COMPACT FLASH

fBGA package tray 12 x 19

Abstract: FCCSP HT80C51 a44e SecuCalm cortex my uLGA ARM10 I18N 64 pin IC microcontroller LCD
Contextual Info: Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte 6 : 6K byte 8 : 8K byte A : 48K byte C : 96K byte E : 176K byte G : 384K byte I : 768K byte (S-SIM)

iMX536

Abstract: sahara lcd monitor circuit diagram free us10 sd diode samsung lpddr2 Mobile RAM Automotive Telematics On-board unit Platform emmc jedec mechanical standard Samsung board Board design guide eMMC emmc 4.5 spec samsung sony bullet camera sd 3.0 emmc 4.4
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53AEC Rev. 5, 12/2012 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1

Contextual Info: FREEDM -336A1024 PRELIMINARY DATASHEET ISSUE 11 FRAME ENGINE AND DATA LINK MANAGER 336A1024 ce m be r, 20 02 01 :5 5: 39 PM PMC-1991476 Tu es da y, 03 De FREEDM™-336A1024 DATASHEET PROPRIETARY AND CONFIDENTIAL PRELIMINARY ISSUE 11: NOVEMBER 2002 Do wn