TF16SN3.15 Search Results

TF16AT0.50

Abstract: TF16AT0.5 TF16AT0 7A 100 16s TF16aT TF16AT3.15 TF16SN2.50 315A 08 TF10BN1.00 TF16SN
Contextual Info: 1733 Reader's Spreads pg1-203:document 1/27/09 4:17 PM Page 181 TF thin film chip fuse EU features dimensions and construction L c W t d Protective Coating Type c Dimensions inches mm W c d circuit protection • Small, lightweight design • Special manufacturing method stabilizing fusing

TF16AT1

Contextual Info: TF thin film chip fuse EU features • Small, lightweight design • Special manufacturing method stabilizing fusing characteristics and occupying less area • Low power consumption and less voltage drop due to low internal resistance • Suitable for overcurrent protection of circuit block

Contextual Info: TF thin film chip fuse EU features • Small, lightweight design • Special manufacturing method stabilizing fusing characteristics and occupying less area • Low power consumption and less voltage drop due to low internal resistance • Suitable for overcurrent protection of circuit block

Contextual Info: TENTATIVE All information in this technical data sheet is tentative and subject to change without notice. Preliminary 5.7”VGA TECHNICAL SPECIFICATION AA057VG02 MITSUBISHI ELECTRIC Corp. Date: Jun.4,’09 MITSUBISHI Confidential 1/22 AA057VG02_02_00 CONTENTS

RK73-RT

Abstract: RK73G-RT WK73-RT hr r 681k- 1kv A/SG73P1E WK73S2 SG73S2E sec 472m sf MOS2CT52 RK73H-RT
Contextual Info: KOA SPEER ELECTRONICS, INC. passive components 199 Bolivar Drive Bradford, PA 16701 Phone: 814-362-5536 Fax: 814-362-8883 www.koaspeer.com KOA SPEER ELECTRONICS, INC. AHA 12/14 2.5M KOA Speer Electronics, Inc. Printed in U.S.A. passive components KOA Speer’s

TF16SN2.50

Abstract: TF10AN1.60 TF16SN0.315 TF10AN TF16SN fuse MARKING CODE M
Contextual Info: TF thin film chip fuse features circuit protection • Small, lightweight design • Special manufacturing method stabilizing fusing characteristics and occupying less area • Low power consumption and less voltage drop due to low internal resistance • Suitable for overcurrent protection of circuit block

Contextual Info: CHIP FUSE TF16SN チップヒューズ Chip Current Fuses •構造図 Construction L c ② ① ③ c W ④ t ⑤ ⑥ Fuses ヒューズ d ① 保護膜 Protective coating ④ はんだめっき Solder plating ② ヒューズエレメント Fuse element

TF16AT0

Contextual Info: 1570 Reader's Spreads pg1-188 3/26/07 2:28 PM Page 176 TF thin film chip fuse features circuit protection • Small, lightweight design • Special manufacturing method stabilizing fusing characteristics and occupying less area • Low power consumption and less voltage drop

TF16SN3.15

Contextual Info: TF thin film chip fuse features circuit protection • Small, lightweight design • Special manufacturing method stabilizing fusing characteristics and occupying less area • Low power consumption and less voltage drop due to low internal resistance • Suitable for overcurrent protection of circuit block

bm-5a

Abstract: 153LHS05 NL12876BC26-28 THC63LVDF84B THC63LVDF84B msl CONNECTOR 20 PIN flat inverter wxga NL128 E170632 CN204 39cm
Contextual Info: TFT COLOR LCD MODULE NL12876BC26-28 39cm 15.3 Type WXGA LVDS interface (1port) DATA SHEET DOD-PP-0853 (3rd edition) This DATA SHEET is updated Document from DOD-PP-0825(2). All information is subject to change without notice. Please confirm the sales representative

NL10276BC30-18

Abstract: lcd 40 pin diagram lvds lcd screen LVDS connector 40 pins 7 inch lcd DIGITAL COLOR TV RECEIVER lcd cable inverter pin diagram PANEL e170632 150LHS29 XGA TFT display 15.0 15 inch NEC lcd backlight inverter
Contextual Info: TFT COLOR LCD MODULE NL10276BC30-18 38cm 15.0 Type XGA LVDS Interface (1port) DATA SHEET DOD-PP-0320 (3rd edition) This DATA SHEET is updated document from DOD-PP-0181(2). All information is subject to change without notice. Please confirm the sales representative before

TF16SN0

Abstract: TF16SNI-T tf16sn0.40
Contextual Info: THIN FILM FUSE TF16SN 薄膜チップヒューズ Thin Film Chip Current Fuses •構造図 Construction L c ② ① ③ c W ④ t ⑤ ⑥ d ① 保護膜 Protective coating ④ はんだめっき Solder plating ② ヒューズエレメント Fuse element

Contextual Info: TENTATIVE All information in this technical data sheet is tentative and subject to change without notice. Preliminary 5.7”VGA TECHNICAL SPECIFICATION AA057VF12 MITSUBISHI ELECTRIC Corp. Date: Oct.18,’11 MITSUBISHI Confidential 1/22 AA057VF12_02_00 CONTENTS

Contextual Info: TENTATIVE All information in this technical data sheet is tentative and subject to change without notice. Preliminary 5.7”VGA TECHNICAL SPECIFICATION AA057VG12 MITSUBISHI ELECTRIC Corp. Date: Oct.18,’11 MITSUBISHI Confidential 1/22 AA057VG12_02_00 CONTENTS

TF16A

Contextual Info: TF thin film chip fuse EU features circuit protection • Small, lightweight design • Special manufacturing method stabilizing fusing characteristics and occupying less area • Low power consumption and less voltage drop due to low internal resistance • Suitable for overcurrent protection of circuit block

Contextual Info: TF thin film chip fuse EU features • Small, lightweight design • Special manufacturing method stabilizing fusing characteristics and occupying less area • Low power consumption and less voltage drop due to low internal resistance • Suitable for overcurrent protection of circuit block

TF16SN1.00

Abstract: marking 315A TF16SN0.315 TF16SN2.50 TF10AN TF16AT TF16SN TF16AT3 TF16AT0 25A-31
Contextual Info: TF thin film chip fuse • Small, lightweight design • Special manufacturing method stabilizing fusing characteristics and occupying less area • Low power consumption and less voltage drop due to low internal resistance • Suitable for overcurrent protection of circuit block

TF16SN0.25

Abstract: TF16SN0.315 Fuse 3.15A, 3mm TF16SN2.00 TF16SN TF20SN2 TF16SN1.00
Contextual Info: TF thin film chip fuse NEW features • Small, lightweight design • Special manufacturing method stabilizing fusing characteristics and occupying less area • Low power consumption and less voltage drop due to low internal resistance • Suitable for overcurrent protection of circuit block

Contextual Info: TF thin film chip fuse EU features • Small, lightweight design • Special manufacturing method stabilizing fusing characteristics and occupying less area • Low power consumption and less voltage drop due to low internal resistance • Suitable for overcurrent protection of circuit block

TF16AT1

Contextual Info: TF thin film chip fuse features circuit protection • Small, lightweight design • Special manufacturing method stabilizing fusing characteristics and occupying less area • Low power consumption and less voltage drop due to low internal resistance • Suitable for overcurrent protection of circuit block

NL12876bc26-25

Abstract: CN204 LVDS 30 pin hirose connector df14
Contextual Info: TFT COLOR LCD MODULE NL12876BC26-25 4 39cm 15.3 Type WXGA LVDS interface (1port) PRELIMINARY DATA SHEET DOD-PP-0167 (4th edition) This PRELIMINARY DATA SHEET is updated document from DOD-PP-0114(3). All information is subject to change without notice. Please confirm the sales representative before

08-6260-018-340-829

Abstract: elco pin AA057VF02 cs1000 FCC16162AB Elco 90 pin connector LCD 5.7inch 1480d
Contextual Info: TENTATIVE All information in this technical data sheet is tentative and subject to change without notice. 5.7”VGA TECHNICAL SPECIFICATION AA057VF02 MITSUBISHI ELECTRIC Corp. Date: Mar.21,’08 MITSUBISHI Confidential 1/22 AA057VF02_02_00 CONTENTS No. Item

Contextual Info: TF thin film chip fuse EU features • Small, lightweight design • Special manufacturing method stabilizing fusing characteristics and occupying less area • Low power consumption and less voltage drop due to low internal resistance • Suitable for overcurrent protection of circuit block

SI 1700 backlight inverter

Abstract: BHR-02VS-1 BHSR-02VS-1 SM02 THC63LVDF84B TF16SN3.15T
Contextual Info: LCD Module Technical Specification First Edition Jun 20, 2008 Final Revision T-55336D175J-FW-A-AAN Type NO Customer C ustom er's Product No OPTREX CORPORATION Approved : Checked : Prepared : APPROVED By _ Signature : Date : Please return this specification within two month with your signature.