THETA-JC PLCC Search Results

Theta-JC

Abstract: theta JA Theta-JC plcc tqfp 44 thermal resistance datasheet 500LFM QL12X16B QL16X24B QL2003 QL2005 QL2007
Contextual Info: 9 The thermal performance of a pASIC in its package is determined by many factors, including packaging materials, die size, package design and construction, etc. Thermal resistance is the measure of the ability of the package to conduct heat from the chip through the package to the external

C18045

Abstract: CDA151 9918 9936
Contextual Info: 05/31/2005 RELIABILITY REPORT FOR DS80C390, Rev C3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

PS24-3

Abstract: MAX235 die
Contextual Info: MAX248 RELIABILITY REPORT FOR MAX248CQH+D PLASTIC ENCAPSULATED DEVICES April 15, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.

PD-1503

Abstract: pd1503 PD-2078 PD-2028 pd 2028 PD-2026 PD2028 pd2029 PD-2029 jedec MS-026 ABA
Contextual Info: Pericom offers a wide range of advanced packaging solutions to fit any application including SOTiny , DisplayPort™, ReDriver™, HDMI™, others. Additional information can be obtained from individual data sheets, or by contacting your Pericom representative.

tqfp 44 thermal resistance datasheet

Abstract: tqfp 44 thermal resistance plcc junction to ambient resistance 500LFM QL12X16B QL16X24B QL24X32B QL8X12B Thermal Resistance Calculation TO
Contextual Info: THERMAL MANAGEMENT The thermal performance of a pASIC in its package is determined by many factors, including packaging materials, die size, package design and construction, etc. Thermal resistance is the measure of the ability of the package to conduct heat from the chip through the package to the external environment. This is represented in

8500A

Abstract: CY2PP318 CY2PP318JI CY2PP318JIT
Contextual Info: FastEdge Series CY2PP318 1 of 2:8 Differential Clock/Data Fanout Buffer Features Functional Description The CY2PP318 is a low-skew, low propagation delay 1-to-8 differential fanout buffer targeted to meet the requirements of high-performance clock and data distribution applications. The

Contextual Info: FastEdge Series CY2PP318 1:8 Differential Clock/Data Fanout Buffer Features Functional Description The CY2PP318 is a low-skew, low propagation delay 1-to-8 differential fanout buffer targeted to meet the requirements of high-performance clock and data distribution applications. The

Contextual Info: FastEdge Series CY2PP318 1:8 Differential Clock/Data Fanout Buffer Features Functional Description The CY2PP318 is a low-skew, low propagation delay 1-to-8 differential fanout buffer targeted to meet the requirements of high-performance clock and data distribution applications. The

Contextual Info: ^ c te l -m Package Characteristics and Mechanical Drawings P a c k a g e T h e rm a l C h a ra c te ris tic s Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Plastic Quad Flatpack (PQFP)

ADSP-21060L

Abstract: ADSP-21062L EDI8L32128V EDI8L32256C EDI8L32512V EDI8L3265C MO-47AE
Contextual Info: EDI8L32128V T NO Features 128Kx32 CMOS High Speed Static RAM 128Kx32 bit CMOS Static Analog SHARCTM External Memory Solution • ADSP-21060L • ADSP-21062L Random Access Memory Array • Fast Access Times: 12,15 and 20ns • User Configurable Organization with Minimal Additional Logic

Contextual Info: EDI8L32128V White Electronic Designs T NO FEATURES 128KX32 CMOS HIGH SPEED STATIC RAM 128Kx32 bit CMOS Static Analog SHARCTM External Memory Solution • ADSP-21060L • ADSP-21062L Random Access Memory Array • Fast Access Times: 12,15 and 20ns • User Configurable Organization

ADSP-21060L

Abstract: ADSP-21062L EDI8L32128V EDI8L32512V MO-47AE
Contextual Info: White Electronic Designs EDI8L32128V 128KX32 CMOS HIGH SPEED STATIC RAM FEATURES 128Kx32 bit CMOS Static Analog SHARCTM External Memory Solution • ADSP-21060L • ADSP-21062L Random Access Memory Array • Fast Access Times: 12,15 and 20ns • User Configurable Organization

Contextual Info: EDI8LM32513V-RP 512Kx32 SRAM Ruggedized Plastic 512KX32 CMOS High Speed Static RAM Features 512Kx32 CMOS Static RAM The EDI8LM32513V is a high-speed 16-Megabit static • Fast Access Times: 1 2 ,1 5 and 20ns • Individual Byte Enables Commercial, Industrial and Military temperature range.

EDI8L32128V

Abstract: EDI8L32512V MO-47AE TMS320LC31
Contextual Info: EDI8L32256V 256Kx32 SRAM 256Kx32 , 3.3V, Static RAM Features The EDI8L32256V is a high speed, 3.3 volt, 8 megabit SRAM. The device is available with access times of 12, 15, 17 and 20ns, allowing the creation of a no wait state DSP memory solution. The device can be configured as a 256Kx32 and used to

MO-47AE

Abstract: DSP96002 EDI8L24128C EDI8L32128C EDI8L32256C EDI8L32512C EDI8L3265C 512Kx48
Contextual Info: EDI8L32256C 256Kx32 SRAM Module 256Kx32, 5V Static Ram Features 256Kx32 bit CMOS Static DSP Memory Solution • Texas Instruments TMS320C3x, TMS320C4x • Analog SHARCTM DSP • Motorola DSP96002 Random Access Memory Array • Fast Access Times: 15, 17, 20 and 25ns

ADSP-21060L

Abstract: ADSP-21062L EDI8L32128V EDI8L32512V MO-47AE
Contextual Info: EDI8L32128V 128Kx32 SRAM 3.3 Volt 128Kx32 CMOS High Speed Static RAM Features 128Kx32 bit CMOS Static Analog SHARCTM External Memory Solution • ADSP-21060L • ADSP-21062L Random Access Memory Array • Fast Access Times: 12,15 and 20ns • User Configurable Organization

ADSP-21060L

Abstract: ADSP-21062L EDI8L32128V EDI8L32512V MO-47AE
Contextual Info: EDI8L32128V 128Kx32 SRAM 3.3 Volt 128Kx32 CMOS High Speed Static RAM Features 128Kx32 bit CMOS Static Analog SHARCTM External Memory Solution • ADSP-21060L • ADSP-21062L Random Access Memory Array • Fast Access Times: 12,15 and 20ns • User Configurable Organization

Contextual Info: EDI8LM32257C-RP m 256Kx32 SRAM Ruggedized Plastic x ELECTRONIC DESIGNS INC ADVANCED 256Kx32 CMOS High Speed Static RAM Features The EDI8LM32257C is a high-speed 8-Megabit static RAM device with access times of 15 and 20ns over the Commer­ 256Kx32 bit CMOS Static

Contextual Info: EDI8LM32257V-RP ^EDI 256Kx32 SRAM Ruggedized Plastic ELECTRONIC DESIGNS, INC ADVANCED 256Kx32 CMOS High Speed Static RAM Features 256Kx32 bit CMOS Static The EDI8LM32257V is a high-speed 8-Megabit static RAM Random Access Memory Array • Fast Access Times: 1 2 ,1 5 and 20ns

Contextual Info: m x EDI8LM32257C-RP 256Kx32SRAM Ruggedized Plastic ELECTRONIC DESIGNS INC ADVANCED 256Kx32 CMOS High Speed Static RAM Features The EDI8LM32257C is a high-speed 8-Megabit static RAM device with access times of 15 and 20ns over the Comm er­ 256Kx32 bit CMOS Static

cd 5151

Abstract: 512kx4 EDI8L32128V EDI8L32512V MO-47AE TMS320LC31 EDI8L32256V ADSP2106XL
Contextual Info: EDI8L32256V T NO 256Kx32 SRAM FEATURES n 256Kx32 bit CMOS Static The EDI8L32256V is a high speed, 3.3 volt, 8 megabit SRAM. The device is available with access times of 12, 15, 17 and 20ns, allowing the creation of a no wait state DSP memory solution. n DSP Memory Solution

Contextual Info: EDI8LM32513V-RP 512Kx32 SRAM Ruggedized Plastic 512Kx32 CMOS High Speed Static RAM Features 512Kx32 CMOS Static RAM The EDI8LM32513V is a high-speed 16-Megabit static • Fast Access Times: 1 2 ,1 5 and 20ns • Individual Byte Enables Commercial, Industrial and Military temperature range.

Contextual Info: EDI8LM32257V-RP ^EDI 256Kx32 SRAM Ruggedized Plastic ELECTRONIC DESIGNS, INC 256Kx32 CMOS High Speed Static RAM Features ADVANCED 256Kx32 bit CMOS Static The EDI8LM32257V is a high-speed 8-Megabit static RAM Random Access Memory Array • Fast Access Times: 1 2 ,1 5 and 20ns

smd code marking 56 sot23-6

Abstract: marking code 604 SOT23-6 PD-1503 smd zG sot 23 smd marking sot23 W16 ic SMD MARKING CODE ad 5.9 ic ap 2068 PD2029 SMD MARKING ed sot23-5 MARKING CODE SMD IC sot23-5
Contextual Info: PACKAGING Package Information Packaging & Ordering Packaging Solutions for Modern Electronic Design In addition to standard legacy packaging, Pericom leads the industry in smaller, more advanced packaging profiles and footprints for today’s designers. Our offerings include very small packages,