UIT70FH4
Abstract: HP 45 Black Inkjet Panduit physical infrastructure systems, Mini-Com UIT70FV2 EIA-606-A UICFPSE4 S100X160YAJ
Text: Labeling and Identification Solutions TIA/EIA-606-A Labeling Compliance Featuring the Ultimate ID Network Labeling System TIA/EIA-606-A Labeling Compliance TIA/EIA-606-A Standard For compliance with the TIA/EIA-606-A standard, Panduit has the solution.
|
Original
|
PDF
|
TIA/EIA-606-A
TIA/EIA-606-A
TIA/EIA-606-A.
WW-IDCB55
644-LS8E-ACS
UIT70FH4
HP 45 Black Inkjet
Panduit physical infrastructure systems, Mini-Com
UIT70FV2
EIA-606-A
UICFPSE4
S100X160YAJ
|
Untitled
Abstract: No abstract text available
Text: Labeling and Identification Solutions TIA/EIA-606-A Labeling Compliance Featuring the Ultimate ID Network Labeling System TIA/EIA-606-A Labeling Compliance TIA/EIA-606-A Standard For compliance with the TIA/EIA-606-A standard, Panduit has the solution.
|
Original
|
PDF
|
TIA/EIA-606-A
TIA/EIA-606-A
TIA/EIA-606-A.
WW-IDCB55
|
fiber optic
Abstract: FAP12WBLSC FAP12WBUSCZ FAP12WEISC 10GIGTM sleeves
Text: A. System Overview PHYSICAL INFRASTRUCTURE SYSTEMS B. Copper Systems SC Opticom Fiber Adapter Panels FAPs • Loaded with TIA/EIA-604 FOCIS-3 compliant adapters • Exceed TIA/EIA-568-C.3 requirements • Adapter housing colors follow TIA/EIA-568-C.3 suggested
|
Original
|
PDF
|
TIA/EIA-604
TIA/EIA-568-C
FAP12WAGSCZ
fiber optic
FAP12WBLSC
FAP12WBUSCZ
FAP12WEISC
10GIGTM
sleeves
|
fiber optic multimode
Abstract: fiber optic fassczag-l tia 568-C multimode
Text: A. System Overview PHYSICAL INFRASTRUCTURE SYSTEMS B. Copper Systems SC Fiber Optic Adapters C. Fiber Optic Systems D. Power over Ethernet E. Zone Cabling F. Wireless • TIA/EIA-604 FOCIS-3 compliant adapters • Exceed TIA/EIA-568-B.3 requirements • Adapter housing colors follow TIA/EIA-568-C.3 suggested
|
Original
|
PDF
|
TIA/EIA-604
TIA/EIA-568-B
TIA/EIA-568-C
50/125m
5/125m
9/125m
fiber optic multimode
fiber optic
fassczag-l
tia 568-C multimode
|
Fiber Optic Connectors
Abstract: Panduit physical infrastructure systems
Text: A. System Overview PHYSICAL INFRASTRUCTURE SYSTEMS B. Copper Systems ST Fiber Optic Connectors – Field Polish Termination • TIA/EIA-604 FOCIS-2 compatible connectors • Exceed TIA/EIA-568-B.3 requirements • Insertion loss: 0.15dB average multimode , 0.20dB
|
Original
|
PDF
|
TIA/EIA-604
TIA/EIA-568-B
F250BT-C
Fiber Optic Connectors
Panduit physical infrastructure systems
|
Untitled
Abstract: No abstract text available
Text: A. System Overview PHYSICAL INFRASTRUCTURE SYSTEMS B. Copper Systems LC OptiCam Fiber Optic Connectors – Pre-Polished Cam Termination • TIA/EIA-604 FOCIS-10 compatible connectors • Exceed TIA/EIA-568-B.3 requirements • Connector backbone and boot colors follow
|
Original
|
PDF
|
TIA/EIA-604
FOCIS-10
TIA/EIA-568-B
TIA/EIA-568-C
10Gig
|
fiber optic connectors
Abstract: "Fiber Optic Connectors"
Text: A. System Overview PHYSICAL INFRASTRUCTURE SYSTEMS B. Copper Systems ST OptiCam Fiber Optic Connectors – Pre-Polished Cam Termination • TIA/EIA-604 FOCIS-2 compliant connectors • Exceed TIA/EIA-568-B.3 requirements • Connector backbone and boot colors follow
|
Original
|
PDF
|
TIA/EIA-604
TIA/EIA-568-B
TIA/EIA-568-C
10Gig
fiber optic connectors
"Fiber Optic Connectors"
|
Untitled
Abstract: No abstract text available
Text: A. System Overview PHYSICAL INFRASTRUCTURE SYSTEMS B. Copper Systems Opticom MPO Fiber Optic Adapter Panels FAPs C. Fiber Optic Systems D. Power over Ethernet • • • • Loaded with TIA/EIA-604 FOCIS-5 compliant adapters Exceed TIA/EIA-568-C.3 requirements
|
Original
|
PDF
|
TIA/EIA-604
TIA/EIA-568-C
FAPH0412BLMPO
FAPH0412CGMPO.
FAPV0612BLMPO
FAPV0812BLMPO
|
M02020-22
Abstract: photodiode die WAFER M02020 TIA AGC application note 0201X-PBD-002 photodiode esd sensitivity
Text: M02020 4 Gbps CMOS TIA with AGC The M02020 is a 4 Gbps TIA achieving a wide input dynamic range to support different transmission distance requirements. Input overload of 2 mAPP is provided to support short-haul fiber optic systems and input sensitivity of
|
Original
|
PDF
|
M02020
M02020
M02020.
02020-DSH-001-F
M02020-22
photodiode die WAFER
TIA AGC application note
0201X-PBD-002
photodiode esd sensitivity
|
Untitled
Abstract: No abstract text available
Text: A. System Overview PHYSICAL INFRASTRUCTURE SYSTEMS B. Copper Systems One Inch Bend Radius Fittings for TIA/EIA Compliance C. Fiber Optic Systems • One inch bend radius fittings are designed to maintain the TIA/EIA-568-B and 569-B required minimum bend radius for
|
Original
|
PDF
|
TIA/EIA-568-B
569-B
CFX10IW-X
LDPH10,
LD2P10
RFX53IW-X
RFX103IW-X
LDPH10
CFX10*
RFX105IW-X
|
FAP6WST
Abstract: FMP-6 Opticom FAP-B
Text: A. System Overview PHYSICAL INFRASTRUCTURE SOLUTIONS B. Copper Systems ST Opticom Fiber Adapter Panels FAPs • Loaded with TIA/EIA-604 FOCIS-2 compatible adapters • Exceed TIA/EIA-568-B.3 requirements • Snap quickly into the front of all Opticom ® components
|
Original
|
PDF
|
TIA/EIA-604
TIA/EIA-568-B
FAP6WST
FMP-6
Opticom
FAP-B
|
TAG2T5-100B
Abstract: transistor 13001 replacement tag86 transistor 13001 replacement guide thermal transfer printhead TAG2-100 TT210SM CT0753X2 tag27 tag9t3-100b
Text: IDENTIFICATION P R O D U C T S MEET ANSI/TIA/EIA-606-A REQUIREMENTS The ANSI/TIA/EIA-606-A standard was developed to specify the requirements for labeling the telecommunications foundation in buildings. To help fulfill these requirements, HellermannTyton offers a complete identification product
|
Original
|
PDF
|
ANSI/TIA/EIA-606-A
CMF04
CMF072
200oF
FOM-175
TAG2T5-100B
transistor 13001 replacement
tag86
transistor 13001 replacement guide
thermal transfer printhead
TAG2-100
TT210SM
CT0753X2
tag27
tag9t3-100b
|
Ultrasonic amplifier 50w
Abstract: 10GHz Bandwidth PIN Photodetector ATA7550 ATA7550D1 TIA bonding photodetector dwdm
Text: ATA7550 5.0V 2.5 Gb/s TIA PRELIMINARY DATA SHEET - Rev 0 FEATURES • · · · · 2.5 Gb/s Differential Output TIA Low Group Delay Single +5V Power Supply Small Size: 0.864mm x 1.014mm 300mW typ Power Dissipation GND VCC GND VOUT IIN APPLICATIONS · · ·
|
Original
|
PDF
|
ATA7550
864mm
014mm
300mW
OC-48/STM-16
ATA7550D1
Ultrasonic amplifier 50w
10GHz Bandwidth PIN Photodetector
ATA7550
TIA bonding
photodetector dwdm
|
TIA AGC application note
Abstract: MC20L10 MC2010 photodiode die WAFER 0201X-PBD-001
Text: Preliminary Information This document contains information on a product under development. The parametric information contains target parameters that are subject to change. MC2010 TIA with AGC for 3.3V Applications to 1.25 Gbps The MC2010 is a transimpedance amplifier TIA with AGC manufactured in a sub-micron, CMOS process. The
|
Original
|
PDF
|
MC2010
MC2010
25Gbps
02010-DSH-001-C
M02017
TIA AGC application note
MC20L10
photodiode die WAFER
0201X-PBD-001
|
|
|
FHPX126LM
Abstract: tia 568-C multimode FX12D5-5M1Y ISO 11801 OM3 61cm HYDRA Panduit physical infrastructure systems FOCIS 5 "Power over Ethernet" WW-FBCB38
Text: A. System Overview PHYSICAL INFRASTRUCTURE SYSTEMS B. Copper Systems QuickNet Hydra Cable Assemblies • Connectivity meets or exceeds TIA/EIA-568-B.3 and ISO/IEC 11801 performance requirements • LC and SC connector housing and boot colors follow TIA/EIA-568-C.3 suggested color identification scheme
|
Original
|
PDF
|
TIA/EIA-568-B
TIA/EIA-568-C
12-fiber)
FX12D5-5M1Y)
FZ12D5-5M1Y)
FZ12D5-5M1)
FZ12D5-5M2
FHPX126LM
tia 568-C multimode
FX12D5-5M1Y
ISO 11801 OM3
61cm
HYDRA
Panduit physical infrastructure systems
FOCIS 5
"Power over Ethernet"
WW-FBCB38
|
shim
Abstract: No abstract text available
Text: Advance Information This document contains information on a product under development. The parametric information contains target parameters that are subject to change. MC2010 TIA with AGC for 3.3V Applications to 1.25 Gbps The MC2010 is a transimpedance amplifier TIA with AGC manufactured in a sub-micron, CMOS process. The
|
Original
|
PDF
|
MC2010
MC2010
25Gbps
02010-DSH-001-B
shim
|
a 2231 0601
Abstract: TIA 10GHZ TIA bonding ATA7601D1 ATA7601 photodetector 1550nm 245um
Text: ATA7601 5.0V 10 Gb/s TIA PRELIMINARY DATA SHEET - Rev 2 FEATURES • 10 Gb/s Differential Output TIA · +5V Power Supply · Low Group Delay · Small Size: 0.95mm x 1.014mm · 340mW typ power dissipation GND GND VCC VOUT IIN APPLICATIONS VOUT GND · SONET OC-192
|
Original
|
PDF
|
ATA7601
014mm
340mW
OC-192
ATA7601D1
a 2231 0601
TIA 10GHZ
TIA bonding
ATA7601
photodetector 1550nm
245um
|
TIA 10GHZ
Abstract: 10GHz Bandwidth PIN Photodetector 1550nm 10GHz Bandwidth PIN Photodetector photodetector 1550nm pin 10gb photodetector dwdm
Text: ATA7601D1 5.0V 10 Gb/s TIA Preliminary Data Sheet - Rev 0 FEATURES • 10 Gb/s Differential Output TIA · +5V Power Supply · Low Group Delay · Small Size: 0.85mm x 0.914mm · 325mW typ power dissipation GND GND VCC VOUT IIN VOUT GND APPLICATIONS · SONET OC-192
|
Original
|
PDF
|
ATA7601D1
914mm
325mW
OC-192
ATA7601D1
TIA 10GHZ
10GHz Bandwidth PIN Photodetector 1550nm
10GHz Bandwidth PIN Photodetector
photodetector 1550nm pin 10gb
photodetector dwdm
|
10GHz Bandwidth PIN Photodetector
Abstract: TIA 10GHZ ATA7601 ATA7601D1 10GHz Bandwidth PIN Photodetector 1550nm photodetector 1550nm pin 10gb photodetector 1550nm photodetector pin 1550nm 10gb AC ameter diagram
Text: ATA7601 5.0V 10 Gb/s TIA Preliminary Data Sheet - Rev 1 FEATURES • 10 Gb/s Differential Output TIA · +5V Power Supply · Low Group Delay · Small Size: 0.85mm x 0.914mm · 325mW typ power dissipation GND GND VCC VOUT IIN VOUT GND APPLICATIONS · SONET OC-192
|
Original
|
PDF
|
ATA7601
914mm
325mW
OC-192
ATA7601D1
10GHz Bandwidth PIN Photodetector
TIA 10GHZ
ATA7601
10GHz Bandwidth PIN Photodetector 1550nm
photodetector 1550nm pin 10gb
photodetector 1550nm
photodetector pin 1550nm 10gb
AC ameter diagram
|
ROSA
Abstract: transistor w7 electronic circuit for rosa TIA bonding integrated ROSA PIN-TIA
Text: Application Note: HFAN-3.2.0 Rev.1; 04/08 Improving Noise Rejection of a PIN-TIA ROSA Maxim Integrated Products Improving Noise Rejection of a PIN-TIA ROSA VCC CFILT PD W1 W5 W3A W5 W2 IN OUT- FILT 1 Example of ROSA Assembly W4 CVCC CASE VCC For successful optical transceiver design, it is
|
Original
|
PDF
|
|
M1514
Abstract: EX 470 ML0CP17 rpd10a preamplifier at 15 GHz ULTRASONIC wide band ic
Text: ’03-11-11 Preliminary MITSUBISHI SEMICONDUCTOR <Optical IC> Notice: This is not a final specification. Some parametric limits are subject to change. ML0CP17 10Gb/s Transimpedance Preamplifier IC FEATURES The transimpedance Preamplifier TIA IC ML0CP17 is available in
|
Original
|
PDF
|
ML0CP17
10Gb/s
ML0CP17
19dBm
10Gb/s,
100kHz
100nF
500mW
M1514
EX 470
rpd10a
preamplifier at 15 GHz
ULTRASONIC wide band ic
|
OC74
Abstract: No abstract text available
Text: Advance Product Information September 27, 2004 10Gb/s Wide Dynamic Range Differential TIA TGA4817-EPU Key Features and Performance • • • • • • • • Preliminary Measured Performance Bias Conditions: V+=3.3V I+=70mA 76 Differential Zt dB-Ohm
|
Original
|
PDF
|
10Gb/s
TGA4817-EPU
0007-inch
OC74
|
tia 568-C multimode
Abstract: 10GIG FLCDM900BLY "Power over Ethernet"
Text: A. System Overview PHYSICAL INFRASTRUCTURE SYSTEMS B. Copper Systems LC Fiber Optic Connectors – Field Polish Termination C. Fiber Optic Systems D. Power over Ethernet E. Zone Cabling F. Wireless G. Outlets • TIA/EIA-604 FOCIS-10 compatible connectors
|
Original
|
PDF
|
TIA/EIA-604
FOCIS-10
TIA/EIA-568-B
TIA/EIA-568-C
10Gig
FLCBT900AQ-X
tia 568-C multimode
FLCDM900BLY
"Power over Ethernet"
|
RGRB19U
Abstract: TIA94 TIA bonding
Text: S TRUCTURED G ROUND Grounding Kits for N ET-A CCESS ™ Cabinets and 4 Post Racks SPECIFICATION SHEET specifications Structured grounding kits shall be TIA-942 compliant, listed for their purpose with a nationally recognized testing laboratory, and
|
Original
|
PDF
|
TIA-942
GRSP03
WW-GRSP03
RGRB19U
TIA94
TIA bonding
|
