Untitled
Abstract: No abstract text available
Text: Toshiba TLxE1002A SMT LEDs Features 2.0 X 1.25 X 1.1 mm L X W X H InGaAlP Technology Reflow soldering is possible Standard embossing taping 4 mm pitch : T02 (3000 pcs/reel) Applications Backlight Low−power electronic equipment Personal equipment Series Line−Up
|
Original
|
PDF
|
TLxE1002A
TLGE1002A
TLOE1002A
TLPGE1002A
TLRE1002A
TLSE1002A
TLYE1002A
TLSE1002A
|
Untitled
Abstract: No abstract text available
Text: Toshiba TLxE1002A SMT LEDs Features 2.0 X 1.25 X 1.1 mm L X W X H InGaAlP Technology Reflow soldering is possible Standard embossing taping 4 mm pitch : T02 (3000 pcs/reel) Applications Backlight Low−power electronic equipment Personal equipment Series Line−Up
|
Original
|
PDF
|
TLxE1002A
TLGE1002A
TLOE1002A
TLPGE1002A
TLRE1002A
TLSE1002A
TLYE1002A
TLSE1002A
|
Untitled
Abstract: No abstract text available
Text: Toshiba TLxE1002A SMT LEDs Features 2.0 X 1.25 X 1.1 mm L X W X H InGaAlP Technology Reflow soldering is possible Standard embossing taping 4 mm pitch : T02 (3000 pcs/reel) Applications Backlight Low−power electronic equipment Personal equipment Series Line−Up
|
Original
|
PDF
|
TLxE1002A
TLGE1002A
TLOE1002A
TLPGE1002A
TLRE1002A
TLSE1002A
TLYE1002A
TLSE1002A
|
Untitled
Abstract: No abstract text available
Text: Toshiba TLxE1002A SMT LEDs Features 2.0 X 1.25 X 1.1 mm L X W X H InGaAlP Technology Reflow soldering is possible Standard embossing taping 4 mm pitch : T02 (3000 pcs/reel) Applications Backlight Low−power electronic equipment Personal equipment Series Line−Up
|
Original
|
PDF
|
TLxE1002A
TLGE1002A
TLOE1002A
TLPGE1002A
TLRE1002A
TLSE1002A
TLYE1002A
TLSE1002A
|