Untitled
Abstract: No abstract text available
Text: Part Number 856063 140 MHz SAW Filter Preliminary Data Sheet Features • • • • • • • • • For IF applications Typical 3 dB bandwidth of 1.5 MHz High attenuation Single-ended operation Ceramic Surface Mount Package SMP Replaces Sawtek P/N 851904 (BW 3dB = 1.5MHz)
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2002/95/EC)
15ication
12-Oct-2005
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Sawtek
Abstract: Sawtek 140 mhz 1.5 mhz
Text: Part Number 856063 140 MHz SAW Filter Preliminary Data Sheet Features • • • • • • • For IF applications Typical 3 dB bandwidth of 1.5 MHz High attenuation Single-ended operation Ceramic Surface Mount Package SMP Replaces Sawtek P/N 851904 (BW 3dB = 1.5MHz)
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15mm/-0
16-Jul-2002
Sawtek
Sawtek 140 mhz 1.5 mhz
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Sawtek
Abstract: No abstract text available
Text: Part Number 856063 140 MHz SAW Filter Preliminary Data Sheet Features • • • • • • • • • For IF applications Typical 3 dB bandwidth of 1.5 MHz High attenuation Single-ended operation Ceramic Surface Mount Package SMP Replaces Sawtek P/N 851904 (BW 3dB = 1.5MHz)
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2002/95/EC)
12-Oct-2005
Sawtek
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ansi-y14.5m-1982
Abstract: No abstract text available
Text: 1CY2310NZCY2310 NZCY2313BNZ CY2313BNZ 13 Output, 3.3V SDRAM Buffer for Desktop PCs with 3 DIMMs Features Functional Description • One input to 13 output buffer/driver • Supports up to three SDRAM DIMMs • One additional outputs for feedback • SMBus interface for output control
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1CY2310NZCY2310
NZCY2313BNZ
CY2313BNZ
28-pin
300-mil)
CY2313BNZ
10uctor
ansi-y14.5m-1982
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Lucent Technologies fiber optics cable
Abstract: Polish MTP SC Female to SC Female Duplex Fiber Optic Adapter flat ribbon cable connector 64 PIN FLAT RIBBON CONNECTOR KATR
Text: Fiber Optic MT and MTP / MPO Cable Assemblies Features & Benefits • Provides connectorized • • • • • • Applications • High density interconnects for: interface for ribbon or ribbonized fiber Connector alignment is made with precision alignment pins
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MXBRB-MMM-MFM-F003-A000-A000
USA/30MFO/2000
Lucent Technologies fiber optics cable
Polish MTP
SC Female to SC Female Duplex Fiber Optic Adapter
flat ribbon cable connector
64 PIN FLAT RIBBON CONNECTOR
KATR
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CERAMIC LEADLESS CHIP CARRIER
Abstract: 44-PIN ceramic pin grid array package
Text: Packaging Information 8-LEAD PLASTIC, 0.200” WIDE SMALL OUTLINE GULLWING PACKAGE TYP “A” EIAJ SOIC 0.020 (.508) 0.012 (.305) .213 (5.41) .205 (5.21) .330 (8.38) .300 (7.62) PIN 1 ID .050 (1.27) BSC .212 (5.38) .203 (5.16) .080 (2.03) .070 (1.78) .013 (.330)
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Untitled
Abstract: No abstract text available
Text: 857177 140 MHz SAW Filter Applications For Military applications Product Features Functional Block Diagram Top view Typical 3 dB bandwidth of 1.5 MHz Low loss High Attenuation Single-ended operation Ceramic Surface Mount Package SMP Small Size Dimensions: 19.00 x 6.50 x 1.75mm
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murata SAW
Abstract: No abstract text available
Text: 857177 140 MHz SAW Filter Applications For Military applications Product Features Functional Block Diagram Top view Typical 3 dB bandwidth of 1.5 MHz Low loss High Attenuation Single-ended operation Ceramic Surface Mount Package SMP Small Size Dimensions: 19.00 x 6.50 x 1.75mm
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N10015
Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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O-220,
OT-223,
SOL-20
292-AB
292-AB
N10015
218-40cte3
ebonol
outline of the heat sink for JEDEC
217-36CT6
MO-169
218-40CTE5
217-36CTTE6
unc screw
230-75ABE-01
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ebonol
Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
217-36CT6
218-40CT3
218-40CT5
MO-169
204sb
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Wakefield Thermal Solutions TYPE 120
Abstract: ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 TO38 Laser TO-44 204sb
Text: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION
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ebonol
Abstract: Wakefield Thermal Solutions Wakefield Thermal Solutions TYPE 120 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 207AB TO38 Laser
Text: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION
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12-035
Abstract: 10-411196-5 M55302-166 bendix M55302 10-285422 MIL-DTL-55302 bendix LRM connector DB2-100P Micro-D connectors commodore 128
Text: Amphenol Low Mating Force Rectangular Connectors 12-035-12 www.amphenol-aerospace.com Visit our website and see the very broad range of cylindrical and rectangular interconnection products from Amphenol Aerospace. MIL-DTL-55302 BRUSH CONTACT TECHNOLOGY Amphenol’s Broad Family
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MIL-DTL-55302
D38999
12-035
10-411196-5
M55302-166
bendix M55302
10-285422
MIL-DTL-55302
bendix LRM connector
DB2-100P
Micro-D connectors
commodore 128
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231-75PAB-14V
Abstract: 251-62AB 216-40CTT wakefield engineering 67 c 945 p 239 c MO-184 REF-10 Wakefield Engineering EIA-481-3 MS-013
Text: BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS D 2PAK, TO-220, SOL-20 Surface Mount Heat Sinks 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Height Above PC Board .390 in. 9.9 .390 in. (9.9) .390 in. (9.9) Package Format Bulk Tube
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O-220,
SOL-20
216-40CT
216-40CTT
216-40CTR
LP-225
231-75PAB-14V
251-62AB
216-40CTT
wakefield engineering 67
c 945 p 239 c
MO-184
REF-10
Wakefield Engineering
EIA-481-3
MS-013
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Untitled
Abstract: No abstract text available
Text: Specification: TS-S09D262A March, 2010 Preliminary SXP3102DA-Fxxx Rev. A February 10, 2010 Standard 1. INTRODUCTION This document is a preliminary specification for a single channel XFP MSA transceiver module. The transceiver shall be SDH STM DW100U-2A2C(F) compliant. The transceiver is a bi-directional device with a transmitter and receiver in a
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TS-S09D262A
SXP3102DA-Fxxx
DW100U-2A2C
1550nm
IEC60825-1
SXP3102DA-M-Fxxx,
SXP3102
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Untitled
Abstract: No abstract text available
Text: Specification: TS-S09D227A February, 2010 Preliminary SXP3102DA-M-Fxxx Rev. A February 3, 2010 Standard 1. INTRODUCTION This document is a preliminary specification for a single channel XFP MSA transceiver module. The transceiver shall be SDH STM DW100U-2A2C(F) compliant. The transceiver is a bi-directional device with a transmitter and receiver in a
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TS-S09D227A
SXP3102DA-M-Fxxx
DW100U-2A2C
1550nm
SXP3102LV-M,
SXP3102
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ebonol
Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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WTS001
p1-25
O-220,
OT-223,
SOL-20
ebonol
637-10ABEP
MO-169
217-36CT6
634-20ABEP
637-15ABEP
236-150ABE-01
abe sot-223
sot-223 package dimensions
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Untitled
Abstract: No abstract text available
Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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Original
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PDF
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WTS001
p1-25
O-220,
OT-223,
SOL-20
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ebonol
Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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PDF
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O-220,
OT-223,
SOL-20
ebonol
abe sot-223
217-36CTRE6
217-36CT6
MO-169
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BC 1078
Abstract: MHT-18
Text: MSHT—252—037—325 METAL AirBorn Board (Narrow Footprint) to Cable MQHT-2 2 2 -0 3 7 -2 6 1 - 4 1 WS (METAL) .050" 9 thru 51 Contacts Low Profile Board Mount High Temperature Low Profile Cable High Temperature MSHT MQHT RECEPTACLE PLUG SIZE CONTACT ROWS
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PDF
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M83513,
CTMA003
BC 1078
MHT-18
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Untitled
Abstract: No abstract text available
Text: A pplication N ote AVAILABLE im AN95 • AN103 • AN107 X84161/641/129 16K/64K/128K MPS EEPROM liPort Saver EEPROM FEATURES DESCRIPTION • Up to 10MHz data transfer rate • 25ns Read Access Time • Direct Interface to Microprocessors and Microcontrollers
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AN103
AN107
16K/64K/128K
X84161/641/129
10MHz
32-Byte
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marking ACCI
Abstract: No abstract text available
Text: A p p l ic a t io n N o te A V A I L A B L E AN95 • AN103 • AN107 im X84161/641/129 16K/64K/128K MPS EEPROM jiPort Saver EEPROM FEATURES DESCRIPTION • Up to 10MHz data transfer rate • 25ns Read Access Time • Direct Interface to Microprocessors and
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PDF
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AN103
AN107
X84161/641/129
16K/64K/128K
10MHz
32-Byte
marking ACCI
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MS-012AB
Abstract: PCA82C252 PCA82C252T
Text: Philips Semiconductors Product specification Fault-tolerant CAN transceiver PCA82C252 FEATURES • Thermally protected Optimized for in-car low-speed communication • Bus lines protected against transients in an automotive environment • Baud rate up to 125 kBaud
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PDF
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PCA82C252
MS-012AB
PCA82C252
PCA82C252T
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Untitled
Abstract: No abstract text available
Text: A p p l ic a t io n N o t e X A V A I L A B L E X I C OR AN95 • AN103 • AN107 X84161 /641/129 liPort Saver EEPROM 1 6 K /6 4 K /1 2 8 K M PS E E P R O M FEATURES DESCRIPTION • Up to 10MHz data transfer rate • 25ns Read Access Time • Direct Interface to Microprocessors and
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OCR Scan
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PDF
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AN103
AN107
X84161
10MHz
32-Byte
X84129
14-Lead
28-Lead
8161XX
X84641Z
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