TO-252 AA FOOTPRINT Search Results

BC 1078

Abstract: MHT-18
Contextual Info: MSHT—252—037—325 METAL AirBorn Board (Narrow Footprint) to Cable MQHT-2 2 2 -0 3 7 -2 6 1 - 4 1 WS (METAL) .050" 9 thru 51 Contacts Low Profile Board Mount High Temperature Low Profile Cable High Temperature MSHT MQHT RECEPTACLE PLUG SIZE CONTACT ROWS

Contextual Info: A pplication N ote AVAILABLE im AN95 • AN103 • AN107 X84161/641/129 16K/64K/128K MPS EEPROM liPort Saver EEPROM FEATURES DESCRIPTION • Up to 10MHz data transfer rate • 25ns Read Access Time • Direct Interface to Microprocessors and Microcontrollers

marking ACCI

Contextual Info: A p p l ic a t io n N o te A V A I L A B L E AN95 • AN103 • AN107 im X84161/641/129 16K/64K/128K MPS EEPROM jiPort Saver EEPROM FEATURES DESCRIPTION • Up to 10MHz data transfer rate • 25ns Read Access Time • Direct Interface to Microprocessors and

Contextual Info: Part Number 856063 140 MHz SAW Filter Preliminary Data Sheet Features • • • • • • • • • For IF applications Typical 3 dB bandwidth of 1.5 MHz High attenuation Single-ended operation Ceramic Surface Mount Package SMP Replaces Sawtek P/N 851904 (BW 3dB = 1.5MHz)

Sawtek

Abstract: Sawtek 140 mhz 1.5 mhz
Contextual Info: Part Number 856063 140 MHz SAW Filter Preliminary Data Sheet Features • • • • • • • For IF applications Typical 3 dB bandwidth of 1.5 MHz High attenuation Single-ended operation Ceramic Surface Mount Package SMP Replaces Sawtek P/N 851904 (BW 3dB = 1.5MHz)

Sawtek

Contextual Info: Part Number 856063 140 MHz SAW Filter Preliminary Data Sheet Features • • • • • • • • • For IF applications Typical 3 dB bandwidth of 1.5 MHz High attenuation Single-ended operation Ceramic Surface Mount Package SMP Replaces Sawtek P/N 851904 (BW 3dB = 1.5MHz)

ansi-y14.5m-1982

Contextual Info: 1CY2310NZCY2310 NZCY2313BNZ CY2313BNZ 13 Output, 3.3V SDRAM Buffer for Desktop PCs with 3 DIMMs Features Functional Description • One input to 13 output buffer/driver • Supports up to three SDRAM DIMMs • One additional outputs for feedback • SMBus interface for output control

Lucent Technologies fiber optics cable

Abstract: Polish MTP SC Female to SC Female Duplex Fiber Optic Adapter flat ribbon cable connector 64 PIN FLAT RIBBON CONNECTOR KATR
Contextual Info: Fiber Optic MT and MTP / MPO Cable Assemblies Features & Benefits • Provides connectorized • • • • • • Applications • High density interconnects for: interface for ribbon or ribbonized fiber Connector alignment is made with precision alignment pins

CERAMIC LEADLESS CHIP CARRIER

Abstract: 44-PIN ceramic pin grid array package
Contextual Info: Packaging Information 8-LEAD PLASTIC, 0.200” WIDE SMALL OUTLINE GULLWING PACKAGE TYP “A” EIAJ SOIC 0.020 (.508) 0.012 (.305) .213 (5.41) .205 (5.21) .330 (8.38) .300 (7.62) PIN 1 ID .050 (1.27) BSC .212 (5.38) .203 (5.16) .080 (2.03) .070 (1.78) .013 (.330)

Contextual Info: 857177 140 MHz SAW Filter Applications For Military applications Product Features Functional Block Diagram Top view Typical 3 dB bandwidth of 1.5 MHz Low loss High Attenuation Single-ended operation Ceramic Surface Mount Package SMP Small Size Dimensions: 19.00 x 6.50 x 1.75mm

murata SAW

Contextual Info: 857177 140 MHz SAW Filter Applications For Military applications Product Features Functional Block Diagram Top view Typical 3 dB bandwidth of 1.5 MHz Low loss High Attenuation Single-ended operation Ceramic Surface Mount Package SMP Small Size Dimensions: 19.00 x 6.50 x 1.75mm

MS-012AB

Abstract: PCA82C252 PCA82C252T
Contextual Info: Philips Semiconductors Product specification Fault-tolerant CAN transceiver PCA82C252 FEATURES • Thermally protected Optimized for in-car low-speed communication • Bus lines protected against transients in an automotive environment • Baud rate up to 125 kBaud

N10015

Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

ebonol

Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

ebonol

Abstract: Wakefield Thermal Solutions Wakefield Thermal Solutions TYPE 120 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 207AB TO38 Laser
Contextual Info: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION

12-035

Abstract: 10-411196-5 M55302-166 bendix M55302 10-285422 MIL-DTL-55302 bendix LRM connector DB2-100P Micro-D connectors commodore 128
Contextual Info: Amphenol Low Mating Force Rectangular Connectors 12-035-12 www.amphenol-aerospace.com Visit our website and see the very broad range of cylindrical and rectangular interconnection products from Amphenol Aerospace. MIL-DTL-55302 BRUSH CONTACT TECHNOLOGY Amphenol’s Broad Family

231-75PAB-14V

Abstract: 251-62AB 216-40CTT wakefield engineering 67 c 945 p 239 c MO-184 REF-10 Wakefield Engineering EIA-481-3 MS-013
Contextual Info: BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS D 2PAK, TO-220, SOL-20 Surface Mount Heat Sinks 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Height Above PC Board .390 in. 9.9 .390 in. (9.9) .390 in. (9.9) Package Format Bulk Tube

Contextual Info: Preliminary SF2239E • Low-loss RF SAW Filter • Surface-mount 3.0 x 3.0 x 1.3 mm Package • Complies with Directive 2002/95/EC RoHS 2580 MHz SAW Filter Pb Absolute Maximum Ratings Rating Value Units 10 dBm Input Power Level DC Voltage on any Non-ground Terminal

Contextual Info: A p p l ic a t io n N o t e X A V A I L A B L E X I C OR AN95 • AN103 • AN107 X84161 /641/129 liPort Saver EEPROM 1 6 K /6 4 K /1 2 8 K M PS E E P R O M FEATURES DESCRIPTION • Up to 10MHz data transfer rate • 25ns Read Access Time • Direct Interface to Microprocessors and

Contextual Info: Specification: TS-S09D262A March, 2010 Preliminary SXP3102DA-Fxxx Rev. A February 10, 2010 Standard 1. INTRODUCTION This document is a preliminary specification for a single channel XFP MSA transceiver module. The transceiver shall be SDH STM DW100U-2A2C(F) compliant. The transceiver is a bi-directional device with a transmitter and receiver in a

Contextual Info: Specification: TS-S09D227A February, 2010 Preliminary SXP3102DA-M-Fxxx Rev. A February 3, 2010 Standard 1. INTRODUCTION This document is a preliminary specification for a single channel XFP MSA transceiver module. The transceiver shall be SDH STM DW100U-2A2C(F) compliant. The transceiver is a bi-directional device with a transmitter and receiver in a

ebonol

Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

ebonol

Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'