TQFP 144 PACKAGE DIMENSION Search Results

TQFP 144 PACKAGE DIMENSION

Contextual Info: 4 Mechanical Specifications The 21142 is contained in either a 144-pin PQFP package type or a 144-pin TQFP package type. Figure 23 shows the mechanical layout of the PQFP and Table 37 lists PQFP package dimensions in millimeters. Figure 24 shows the mechanical layout of the TQFP and Table 38 lists TQFP

14.5M 1982

Contextual Info: 4 Mechanical Specifications The 21143 is contained in either a 144-pin PQFP package type or a 144-pin TQFP package type. Figure 24 shows the mechanical layout of the PQFP, and Table 38 lists the PQFP package dimensions in millimeters. Figure 25 shows the mechanical layout of the TQFP, and Table 39 lists the TQFP

9811

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC FPT-144P-M10 EIAJ code :∗P-TQFP-0144-2020-0.50 144-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 20.0 × 20.0 mm Lead shape Gullwing Sealing method Plastic mold

Contextual Info: PPE HEAT PROOF 23 A 17.55 25.20 A' TQFP 20x20 1.4mm 135.9 100.8 UNIT : mm 23 25.40 279.4 17.80 315.0 322.6 SECTION A – A' 23 6.02 6.35 7.62 19.85 Applied Package 144-pin • Plastic TQFP (1.4mm thick) 176-pin • Plastic TQFP (1.4mm thick) Quantity (pcs)

MOTOROLA TOP MARK

Abstract: TQFP 144 PACKAGE DIMENSION DSP56005
Contextual Info: Pin-out and Package 144-pin TQFP Top View Pin-out and Package Information 109 Orientation Mark Top View 1 37 MODC/NMI MODB/IRQB MODA/IRQA GNDCK CKOUT VCCCK RESET PINIT VCCP PCAP GNDP XTAL EXTAL HA2/PB10 GNDH VCCQ GNDQ HA1/PB9 HA0/PB8 HACK/PB14 VCCH HEN/PB12

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing Q144.20x20C 144 LEAD THIN QUAD FLATPACK PACKAGE TQFP Rev 0, 2/12 MILLIMETERS D SYMBOL D1 D2 A A2 A1 - 0.05 S -D- MIN -B- -A- e b L1 E E1 E2 4X aaa C A-B D bbb H A-B D 0.05 0.10 0.95 1.00 1.05 0.037 0.039 0.041

SOP48

Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Contextual Info: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7

TQFP144 DIMENSION

Abstract: TQFP144-P-1616-0 TQFP 144 PACKAGE DIMENSION 1616M
Contextual Info: 144PFB-A Plastic 144pin 16✕16mm body TQFP Weight g JEDEC Code – Lead Material Cu Alloy MD e EIAJ Package Code TQFP144-P-1616-0.40 Under Development ME HD b2 D 144 114 1 l2 113 36 Symbol HE E Recommended Mount Pad 78 37 A 77 L1 F b y A1 c A2 e L Detail F

TQFP 144 PACKAGE DIMENSION

Abstract: TQFP144 DIMENSION TQFP144
Contextual Info: 144P6M-A Plastic 144pin 12✕12mm body TQFP EIAJ Package Code TQFP144-P-1212-0.30 Weight g JEDEC Code – Lead Material Alloy 42 HD D 144 109 E HE 108 1 Symbol 36 73 37 72 A L1 F b y A1 c A2 e L Detail F A A1 A2 b c D E e HD HE L L1 y Dimension in Millimeters

TQFP144

Abstract: 144PFB
Contextual Info: MMP 144PFB-A Plastic 144pin 16✕16mm body TQFP Weight g 0.62 JEDEC Code – Lead Material Cu Alloy MD ME e EIAJ Package Code TQFP144-P-1616-0.40 b2 HD D 144 109 I2 Recommended Mount Pad 1 108 36 A A1 A2 b c D E e HD HE L L1 Lp HE E Symbol 73 37 A 72 L1 F

A2 diode

Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
Contextual Info: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5

MACH4A

Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
Contextual Info: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size

EQFP 144 PACKAGE

Abstract: BGA and eQFP Package TQFP 144 PACKAGE altera micro fineline BGA eQFP EPC16
Contextual Info: Package dimensions selector guide FineLine BGA FBGA ; Hybrid FineLine BGA (HFBGA) as noted 1,932 1,760 45.00 x 45.00 1.00 1,517 43.00 x 43.00 1.00 1,020 40.00 x 40.00 1.00 896 33.00 x 33.00 1.00 1,508 780 31.00 x 31.00 1.00 40.00 x 40.00 1.00 35.00 x 35.00

LC4064V

Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
Contextual Info: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch

ep600i

Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)

bd248

Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)

LFXP2-8E

Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
Contextual Info: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.

PQFP 176

Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●

ep600i

Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
Contextual Info: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

IDT package marking

Abstract: IDT marking IDT marking TQFP IDT TOP SIDE package marking A-0410-02 IDT CODE DATE marking MQUAD pbga 144 TQFP 132 PACKAGE PDIP-48
Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A-0410-02 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: 10/5/2004 DATE: All IDT Products (see attached list)

3014-100-X-08

Abstract: 3228-208-X-08 3042-100 3014-120-X-X8 28X28 3014-100 equivalent M 393 QFP 128 lead .5mm 3342-100-X-07 3042-128-X-08
Contextual Info: Burn-In Test Sockets 3000 Series OTQFP & TQFP Sockets • • • • Open Top Quad Flatpack & Thin Quad Flatpack Reduced actuation force contact design Zero Insertion Force for auto load For 0.5mm pitch and higher, corner post alignment feature accommodates JEDEC package dimensions.

TQFP 144 PACKAGE DIMENSION

Abstract: ANSI Y14.5-1982
Contextual Info: TDP VIEW . / \ BDTTDM VIEW □DP LEAD SIDES b DETAIL EVEN LEAD 'A' SIDES e/2 y v\ si x iyv\ PROPRIETARY INFORMATION TITLE« PKG. OUTLINE, 144L TQFP, 20x20x1.0 MM DOCUMENT CONTROL NO. 21-0087 REV A NDTES: 1, A LL DIMENSIONING AND TOLERANCING CONFORM TD ANSI Y14,5-1982,

Contextual Info: ASIC # Standard Cells Package List Numerical value in the list means pin count. QFP, QFH, TQFP, LQFP Type Dimension (unit) Package \ Pin pitch (mm) (mm Xm m ) 7d 40,44 1.51,2.0t 0.8 Q FP'2 10D 0.65 12° 14a 14X20 18° QFH*2 64 2.0t 84 2.5t 64 2.0t 80 2.0t

208 pin rqfp drawing

Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.