TQFP 14X20 LAND Search Results

fcBGA PACKAGE thermal resistance

Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
Contextual Info: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America

Contextual Info: A Advance information •■ Il AS7C3256K36P AS7C3256K32P 3.3V 256Kx32/36 pipeline burst synchronous SRAM Features • Organization: 262,144 words x 32 or 36 bits • Fast clock speeds to 166 MHz in LVTTL/LVCMOS • Fast clock to data access: 3 .5 /3 .8 /4 /5 ns

ADA17

Contextual Info: Advance information •■ I l AS7C3256K36Z AS7C3256K32Z A 3.3V 2 5 6 K x 32/36 synchronous burst SRAM with ZBT1 Features Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint Byte write enables Qock enable for operation hold

AS7C36432-7QC

Abstract: 2227S
Contextual Info: Features 1 A sy n c h ro n o u s o u tp u t e n a b le c o n tro l • O rg a n iz a tio n : 6 5 ,5 3 6 w o r d s x 32 b its ADSP, ADSC, ADV, M O DE b u rst c o n tro l p in s • Fully s y n c h ro n o u s p ip e lin e d o p e ra tio n • F lo w -th ro u g h o p tio n

strapack s-669

Abstract: strapack Sivaron S 669 MIL-I-8835A kbr 208 MIL-D-3464 strapack d-52 MIL-B-81705C EIA-625 MIL-D-3464 type 1
Contextual Info: 1999年 1 月 ver. 4 イントロダク ション Application Note 71 現在表面実装用のJリード・パッケージ、クワッド・フラット・パック （QFP）パッケージ、およびFineLine BGATMを含むボール・グリッド・ア

Contextual Info: H ig h P e rf o rm a n c e 32K x32 C M O S SRA M •■ A S7C 33232F II 3 2 K x 3 2 Synchronous bu rst SRAM Prelim inary information • O rganization: 32,768 w ords x 32 bits • Fully synchronous pipelined operation • F low -through o r pipelined • Fast clocking speed: 1 0 0 /7 5 /6 6 MHz

Contextual Info: H ig h P e r f o r m a n c e 64K X 32 C M O S SRA M n II A S7C 36432 6 4 K X 3 2 Synchronous burst SRAM Preliminary information • O r g a n iz a tio n : 6 5 , 5 3 6 w o r d s x 3 2 b its • A s y n c h r o n o u s o u t p u t e n a b le c o n tr o l • F u lly s y n c h r o n o u s p ip e lin e d o p e r a tio n

Contextual Info: H igh Perform ance 32KX32 CM O S SRAM AS7C33232F A 3 2 K X 3 2 Synchronous burst SRAM Preliminary information Features • • • • • • • • • • • • • • • • Organization: 3 2 ,7 6 8 w ords x 32 bits Fully synchronous pipelined operation

AM32L

Abstract: 10 35L W8 LODA 64KX32 as7c36432-6qc CYC10
Contextual Info: H ig h P e r fo r m a n c e 64K X 32 C M O S SR A M » II A S7C 36432 64 K X 3 2 Synchronous burst SRAM Preliminary information • O r g a n iz a tio n : 6 5 ,5 3 6 w o r d s x 3 2 b its • A sy n c h r o n o u s o u t p u t e n a b le c o n tr o l • F u lly s y n c h r o n o u s p ip e lin e d o p e r a tio n

Contextual Info: II High p e rfo rm an c e 6 4 K x 52 » A S7CÌ643 2 CM O S SRAM A 6 4 K x 3 2 Synchronous burst S R A M Features • F low -th rou gh op tion • Fast clo ckin g sp e ed : 1 0 0 / 8 3 / 6 6 M H z • Fast clock to d ata access: 5 / 6 / 7 ns • Self-tim ed w rite cycle

AS7C33232-15QC

Abstract: datasheet CI 556 ats 2300 intel 8282 AS7C33232-15TQC nt 407 f AS7C33232 MO-108 NT 407 F transistor
Contextual Info: High Performance 32Kx32 CMOS SRAM AS7C33232 AS7C33232F 32K×32 Synchronous burst SRAM Features • Organization: 32,768 words × 32 bits • Fully synchronous pipelined operation • Flow-through option F version • Fast clocking speed: 100/75/66/60 MHz

PCB footprint cqfp 132

Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

AA 12025

Abstract: Z0 607 MN 64K32 J-Squared Technologies
Contextual Info: High Performance 64Kx32 CMOS SRAM AS7C36432 64K×32 Synchronous burst SRAM Preliminary information Features • Organization: 65,536 words × 32 bits • Fully synchronous pipelined operation • Flow-through option • Fast clocking speed: 100/75/66 MHz

Contextual Info: H ig h P e rfo rm a n ce •■ 32K X 32 ü AS7C33232 A S7C 33232F CMOS SRAM 3 2 K x j ¿ S y n c h ro n o u s burst SRAM Features • Organization: 3 2 ,7 6 8 w o rd s x 32 bits • A synchronou s ou tp u t enable control • Fully syn ch ron ou s p ip e lin ed op eration

MO-83-AF

Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
Contextual Info: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

PGA68

Abstract: clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
Contextual Info: CHEMICAL CONTENT OF SEMICONDUCTOR PACKAGING SEPTEMBER 1998 Corp. Environment Strategies Corp. Package Development USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE

SMD IC 2025 bl

Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
Contextual Info: J2T0011-38-60 ま え が き 平素は「沖半導体製品」を御愛用いただき厚く御礼 申し上げます。 エレクトロニクス分野におきましては 半導体製品 の応用はますます広がりをみせており、その性能 機

M9627

Abstract: uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire
Contextual Info: SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL 1989 Document No. C10535EJ8V0IF00 8th edition Date Published February 1997 N Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in

marking code SMD Transistor 2ak

Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
Contextual Info: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written

GE4F

Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
Contextual Info: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written

apple ipad 2 circuit schematic

Abstract: SMD TRANSISTOR MARKING P28 fnd 503 7-segment apple ipad schematic drawing smd code marking NEC tantalum capacitor marking w25 SMD 32 pin eprom to eprom copier circuit pin DIAGRAM OF IC 7400 smd TRANSISTOR code marking bu TRANSISTOR SMD MARKING CODE W25
Contextual Info: Data Book The Programmable Logic Data Book Success made simple Click anywhere on this page to continue 1996 On behalf of the employees of Xilinx, our sales representatives, our distributors, and our manufacturing partners, welcome to our 1996 Data Book, and thank you for your interest in

A7 SMD TRANSISTOR

Abstract: fnd 503 7-segment 4013 FLIP FLOP APPLICATION DIAGRAMS SMD fuse P110 HP 1003 WA transistor SMD making code GC 1736DPC verilog code for 32 BIT ALU implementation xilinx xc95108 jtag cable Schematic RCL TOKO data
Contextual Info: Data Book The Programmable Logic Data Book Success made simple Click anywhere on this page to continue 9/96 On behalf of the employees of Xilinx, our sales representatives, our distributors, and our manufacturing partners, welcome to our 1996 Data Book, and thank you for your interest in

8 pin ic sdc 3733

Abstract: SIEMENS BST h45 100 Prestigio MAP17 XTAL 14.7456MHZ 20ppm 18pF 1210 Hannstar c550 30-pin connector for LVDS hannstar atx 400 pnf R580
Contextual Info: PRESTIGIO SIGNORE 154 TECHNICAL SERVICE MANUAL Prestigio Signore 154 TECHNICAL SERVICE MANUAL Contents 1. Hardware Engineering Specification -1.1 Introduction -1.2 System Overview -1.3 System Hardware -1.4 Electrical Characteristic -2. System View & Disassembly -2.1 System View -2.2 System Disassembly -