TQQ2117 Search Results
TQQ2117 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
---|---|---|---|
Contextual Info: — MT5C6401 883C 64K x 1 SRAM AUSTIN SEMICONDUCTOR, INC. SRAM 64K x 1 SRAM AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • SMD 5962-86015 • M IL-STD-883, Class B • Radiation tolerant (consult factory) 22-Pin DIP FEATURES • High speed: 12, 15, 20, 25 and 35ns |
OCR Scan |
MT5C6401 IL-STD-883, 22-Pin IL-STD-883 TQQ2117 | |
Contextual Info: / \ ¿ -A SRAM 64K x 4 SRAM AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • SMD 5962-88545, SMD 5962-88681 • MIL-STD-883, Class B • R adiation tolerant (consult factory) 24-Pin DIP FEATURES A0t A11 A2t A3t A 4t A 5t A6[ A7Ì A8Ì A9t |
OCR Scan |
MT5C2564 MIL-STD-883, 24-Pin MIL-STD-883 T00H117 | |
Contextual Info: ASD MT4C1004J 883C 4 MEG X 1 DRAM AUSTIN SEMICONDUCTOR, INC. DRAM 4 MEG X 1 DRAM FAST PAGE MODE AVAILABLE AS MILITARY SPECIFICATONS PIN ASSIGNMENT Top View • SMD 5962-90622 • MIL-STD-883 18-Pin DIP FEATURES • Industry standard x l pinout, timing, functions and |
OCR Scan |
MT4C1004J MIL-STD-883 18-Pin 024-cycle CBR378 T002117 T0D2117 | |
Mil-Std-883 Wire Bond Pull Method 2011
Abstract: Single side polished Si
|
OCR Scan |
MT5C2516 Mil-Std-883 Wire Bond Pull Method 2011 Single side polished Si |