BT8032
Abstract: transistor k 790 CMOS LSI two sound generator ENV1 melody generator TST1 15 block diagram of melody generator BT803
Text: MELODY GENERATOR WITH ACCOMPANEMENT BT8032 FEATURES • Two Sound Sources with Envelope CR Envelope • 3.0V to 5.0V Operating Voltage • DC or AC Triggered Performance Start Mode (Mask Selected) • Can Drive an 8 Ohm Dynamic Loudspeaker if Provided Externally with a Transistor
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BT8032
16-pin
BT8032
transistor k 790
CMOS LSI two sound generator
ENV1
melody generator
TST1 15
block diagram of melody generator
BT803
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TRIAC BCR 16 km
Abstract: PJ 1199 diode TRIAC BCR 12 km catalog transistor TO-220-AR RENESAS marking code package triac sot 89 TRIAC BCR 10 AM pj 999 diode TO-92-AB 110N04
Text: Part Numbers Part Numbers 1 to 2 Part No. Destination Thyristor and triac Part No. designation CR 8 K M -12 A BCR 8 C M -12 L A Power Transistor Product No. Designation Renesas Uniform Product Number Current ratings (Ex.) Version Commutation characteristics (Triac only)
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R07CS0003EJ0200
TRIAC BCR 16 km
PJ 1199 diode
TRIAC BCR 12 km
catalog transistor
TO-220-AR
RENESAS marking code package triac sot 89
TRIAC BCR 10 AM
pj 999 diode
TO-92-AB
110N04
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BT8040N
Abstract: Melody Generator BT8032 BT8040 MO chip Transistor
Text: TECHNICAL DATA BT8040N Melody Generator with Accompaniment FEATURES • Two Sound Sources with Envelope CR Envelope • 3.0V to 5.0V Operating Voltage • DC or AC Triggered Performance Start Mode (Mask Selected) • Can Drive an 8 Ohm Dynamic Loudspeaker if Provided Externally with a Transistor
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BT8040N
16-pin
BT8040
BT8032
BT8040
001BB)
BT8040N
Melody Generator
BT8032
MO chip Transistor
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transistor
Abstract: MJE15031 CHIP TRANSISTOR CP645 ny transistor transistor cr
Text: PROCESS CP645 Central Power Transistor TM Semiconductor Corp. PNP, 8.0A Power Transistor Chip PROCESS DETAILS Process MULTIEPITAXIAL MESA Die Size 120 x 145 MILS Die Thickness 13 MILS Base Bonding Pad Area 20 x 45 MILS Emitter Bonding Pad Area 14 x 70 MILS
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CP645
MJE15031
transistor
MJE15031
CHIP TRANSISTOR
CP645
ny transistor
transistor cr
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transistor CR pnp
Abstract: CJD42C Transistor switch CP611 TIP42C chip die transistor
Text: PROCESS CP611 Power Transistor PNP - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL BASE Die Size 80 X 99 MILS Die Thickness 12.5 ± 1 MILS Base Bonding Pad Area 12 X 32 MILS Emitter Bonding Pad Area 13 X 46 MILS Top Side Metalization Al - 50,000Å
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CP611
CJD42C
TIP42C
21-August
transistor CR pnp
CJD42C
Transistor switch
CP611
TIP42C
chip die transistor
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CP608
Abstract: TIP32C CJD32C
Text: PROCESS CP608 Power Transistor PNP - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL BASE Die Size 66 X 66 MILS Die Thickness 12.5 ± 1.0 MILS Base Bonding Pad Area 12 X 24 MILS Emitter Bonding Pad Area 11 X 14 MILS Top Side Metalization Al - 50,000Å
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CP608
CJD32C
TIP32C
21-August
CP608
TIP32C
CJD32C
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Untitled
Abstract: No abstract text available
Text: PROCESS CP608 Power Transistor PNP - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 66 x 66 MILS Die Thickness 12.5 ± 1.0 MILS Base Bonding Pad Area 12 x 24 MILS Emitter Bonding Pad Area 11 x 14 MILS Top Side Metalization Al - 50,000Å
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CP608
CJD32C
TIP32C
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supersot 6 TE
Abstract: Supersot 6
Text: D is cr e te Power S iq n a l T e c h n o lo q ie s MICDNDUCTDRm ^ ^ FMB1020 4p Package: SuperSOT-6 Device Marking: .004 Note: The " . " dot signifies Pin 1 Transistor 1 is NPN device, transistor 2 is PNP device. NPN & PNP Com plem entary Dual Transistor
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FMB1020
300mA.
100uA
100mA
150mA
100MHz
100uA,
200mA,
supersot 6 TE
Supersot 6
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transistor Y4
Abstract: complementary npn-pnp power transistors marking A1 TRANSISTOR FMB1020 marking 004
Text: D is cr ete Power S iq n a l T e ch n o lo g ie s MICDNDUCTDRtm ^ ^ FMB1020 Package: SuperSOT-6 Device Marking: .004 Note: The " . " dot signifies Pin 1 Transistor 1 is NPN device, transistor 2 is PNP device. NPN & PNP Complem entary Dual Transistor SuperSOT-6 Surface Mount Package
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FMB1020
300mA.
100uA
100mA
150mA
200mA,
100MHz
100uA,
fmb1020
transistor Y4
complementary npn-pnp power transistors
marking A1 TRANSISTOR
marking 004
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supersot 6 TE
Abstract: No abstract text available
Text: D is cr e te Power S iq n a l T e c h n o lo q ie s MICDNDUCTDRm ^ ^ FMB3946 C2 E1 C1 <• Package: SuperSOT-6 Device Marking: .002 g2 Note: The " . " dot signifies Pin 1 E2 Transistor 1 is NPN device, transistor 2 is PNP device. B1 NPN & PNP Com plem entary Dual Transistor
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FMB3946
100mA
100MHz
100uA,
supersot 6 TE
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Untitled
Abstract: No abstract text available
Text: Q 0 E S 3 C1S TOM • APX ^53^31 Philips Semiconductors N AUER PHILIPS / D I S CR E T E b?E Product specification J> PNP 5 GHz wideband transistor DESCRIPTION £ BFT93 PINNING PNP transistor in a plastic SOT23 envelope. PIN It is primarily intended for use in RF
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BFT93
BFR93
BFR93A.
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Untitled
Abstract: No abstract text available
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA PNP General Purpose A m plifier Transistor Surface Mount MSB709-RT1 Motorola Preferred Device COLLECTOR n □ cr 2 1 BASE EMITTER MAXIMUM RATINGS TA = 25°C Rating Collector-Base Voltage Symbol Value v (BR)CBO -6 0 Vdc
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MSB709-RT1
318D-03,
SC-59
3b72S5
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Q62702-D1070
Abstract: TRANSISTOR D 1785 BD430
Text: asc D • â23SbOS OüOMBS'i 5 m Z I Z G ■ BD 430 PNP Silicon Planar Transistor ',cr. 0 4 3 5 9 SIEMENS AKTI EN 6E SE LL SCH AF D T -3 3 -/ 7 BD 4 3 0 is an epitaxial PNP silicon planar transistor in a plastic package similar to TO 202. Together with its complementary transistor BD 4 2 9 it is particularly suitable for use in
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T-33-/7
Q62702-D1070
fl23Sb05
Q0043b2
BD430
Q62702-D1070
TRANSISTOR D 1785
BD430
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Untitled
Abstract: No abstract text available
Text: PLESSEY S E N I CO ND /D IS CR ET E 7220533 PLESSEY "t S dT | 7 5 H Q S 3 B G005GÛ5 1 95D 05085 SEM ICO ND/DI SCRETE 7 PNP silicon planar high voltage transistor ~ D 31-21 BF493SP FEATURES • 3 5 0 V V CE0 • Low leakage currents DESCRIPTION This transistor is designed specifically for use
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G005G
BF493SP
300/j
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process 65
Abstract: MMBT3640 PN3640 PN4258
Text: ss ss M-cr: c ì i m u i . - r r r o r? PN3640 MMBT3640 PNP Switching Transistor This device is designed for very high speed saturate switching at collector currents to 100 mA. Sourced from Process 65. See PN4258 for characteristics. Absolute Maximum RdtlflQ S
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PN3640
MMBT3640
OT-23
PN4258
process 65
MMBT3640
PN3640
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2SA1042
Abstract: FUJITSU 2SC2431 2SC2431 2SA1041 2SC243 2SC2432
Text: FUJITSU MI CR OEL ECT RONICS 31E » E3 3 7 4 ^ 2 GOlbSOQ b E3FMI T- 3 3 -Ì3 _ _ January 1990 ^ _ , „ - — PRODUCT PRO FILE - ' FUJITSU 2SA1041, 2SA1042, 2SC2431, 2SC2432 Silicon High Speed Power Transistor DESCRIPTION This series are silicon PNP/NPN planer general purpose, high power switching
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T-33-Z3
2SA1041,
2SA1042,
2SC2431,
2SC2432
2SA1042
FUJITSU 2SC2431
2SC2431
2SA1041
2SC243
2SC2432
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transistor tt 2206
Abstract: TT 2206 transistor LT1817 transistor LT5817
Text: MOTOROLA SC XSTRS/R F MbE D b3b?ES4 00=14220 1 «flO Tt, MOTOROLA • SEMICONDUCTOR TECHNICAL. DATA I n LT5817 The RF Line PNP S ilicon High Frequency Transistor Iq = —400 m A HIGH FREQUENCY HIGH VOLTAGE TRANSISTOR PNP SILICON . . . s p e cific a lly d esig ned fo r CR T d riv e r a p p lic a tio n s req u irin g h ig h v o lta g e and high
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LT5817
LT1817
transistor tt 2206
TT 2206 transistor
LT1817 transistor
LT5817
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transistor E 13009
Abstract: transistor d 13009 E 13009 13007 m 13007 2 transistor 13009 PNP Transistor jE 13007 transistor E 13007 p 13009 transistor j 13009
Text: TOSHIBA {D IS CR ETE/O P TO } ' ÌO d | ^ 7550 0 0 1 b 4 ì3 T~ * 1 - Z 3 £ | «Transistors Small Signal Transistor T ype No. V e» SOT-23MOD V le (mA) hn V ce (V) Ic(mÀ) 2N3903 YTS3903 40 200 5 0 -1 5 0 1.0 10 2N3904 YTS3904 40 200 1 0 0 -3 0 0 1.0 10
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2N3903
2N3904
2N3905
2N3906
2N4123
2N4124
2N4125
2N4I26
2N4400
2N4401
transistor E 13009
transistor d 13009
E 13009
13007 m
13007 2 transistor
13009 PNP Transistor
jE 13007
transistor E 13007
p 13009
transistor j 13009
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transistor h 1061
Abstract: No abstract text available
Text: ROHM CO 4ÜE LTD T Ä S B 'm D QOQbBST h 7 > y 7 $ / T ransistors 7 FM Y3 y z 2 7 - 2 ,7 • 1 *1 ■ W -f K v ri/ty ln v e rte r Driver Epitaxial Planar Dual Mini-Mold PNP/NPN Silicon Transistor • [S/Dimensions Unit: mm 2 D HUH • F e atu re 1) A su p e r-m in im o id p a c k a g e h ouses 2
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BB313
Abstract: WO2 transistor MSA035 BCP69 WO-2
Text: • bbS3T31 QGEMS30 flee * A P X N AMER PH ILI PS/ DI SC RE TE B CP69 b?E ]> A_ SILICON PLANAR EPITAXIAL TRANSISTOR PNP transistor in a plastic microminiature envelope, intended for low-voltage, high-current LF applications. QUICK REFERENCE DATA Collector-emitter voltage VgE = 0
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bbS3T31
QGEMS30
BCP69
OT-223
BB313
WO2 transistor
MSA035
BCP69
WO-2
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2N5685
Abstract: 2N5685 MOTOROLA 2n5684 MOTOROLA 2N5686 2N5686 amplifier 2N5686
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA PNP 2N 5684 High-Current Com plem entary Silicon Power TVansistors NPN 2N5685 . . . designed for use In high-power amplifier and switching circuit applications. • • • 2N 5686* High Current Capability — lc Continuous = 50 Amperes.
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2N5685
2N5684
2N5686
2N5685 MOTOROLA
MOTOROLA 2N5686
2N5686
amplifier 2N5686
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Untitled
Abstract: No abstract text available
Text: Power Transistor Arrays PU4312 PU4312 Silicon NPN/PNP Epitaxial Planar Type Package Dimensions Power Amplifier, Switching • Features • L ow c o lle c to r-e m itte r sa tu ra tio n v o lta g e VcEisatj • G ood lin earity o f DC cu rre n t gain (Iife )
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PU4312
DQ17G4b
P114312
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2N5583
Abstract: MRF558
Text: I MOT OROL A SC XSTRS/R F 4bE D b3b?254 OO^ MOf l e T •MOTb MOTOROLA SEM ICONDUCTOR TECHNICAL DATA The RF Line Ip = -5 0 0 m A HIGH FREQUENCY TRANSISTOR PNP SILICON HIGH FREQUENCY TRANSISTOR PNP SILICON . . . designed for applications in high frequency amplifiers and
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MIL-S-19500
MRFS583HX,
MRF5583HXV
2N5583
b3b72S4
MRF558
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TP5000
Abstract: No abstract text available
Text: DTA143TSA Digital transistor, PNP, with 1 resistor Features Dimensions Units : mm available in SPT (SC-72) package DTA143TSA (SPT) a built-in bias resistor allows inverter circuit configuration without external input resistors bias resistor consists of a thin-film
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DTA143TSA
SC-72)
DTA143TSA
TP5000
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