TRAYS Search Results

Contextual Info: PS20251 Dual COFDM demodulator with PID filters and MRC diversity Data Sheet 1 System Data Sheet 292114 issue 1 1.1 Features • • • • • • • • • • • • • • • • • • • • Ordering Information PS20251C1L1A5 80 Pin LQFP* Trays

Contextual Info: PS20250 Dual COFDM demodulator with PID filters Data Sheet 1 Data Sheet 292108 issue 1 System Ordering Information 1.1 Features • • • • • • • • • • • • PS20250C1L1A5 80 Pin LQFP* Trays *Pb Free Matte Tin Dual Channel DVB-T Demodulator optimised for:

SAS 251

Abstract: S6305 14f1 FS1-S01-14C1 SAS Connector pcb layout 19220 port
Contextual Info: 8 7 6 5 3 4 1 2 REVISIONS REV. DESCRIPTION DATE APPROVED ELASTOMERIC GASKET OPTION ADDED SEP 15/09 ZLJ DETAIL J ADDED JAN 14/10 ZLJ ECN V Z F F FS1-S01-1XXX MOUNTING SCREW OPTION 1 = 8 mm MOUNTING SCREW SHIPPED BULK IN SAME TRAYS WITH CAGE ASSEMBLIES 2 = NO MOUNTING SCREW SUPPLIED

Wickmann

Contextual Info: MAGNETICS - XDSL WICKMANN ADSL-Transformer WSL-A12.322 Specifications Application Packaging Generic 100 pcs./tray 7 trays/carton EP Core Design EP 13 shown For smaller sizes down to EP 7, contact WICKMANN Mounting Surface Mount For Through-Hole version, contact WICKMANN

662 marking

Abstract: WSL-A32
Contextual Info: MAGNETICS - XDSL WICKMANN ADSL-Transformer WSL-A32.346 Specifications Application Packaging CPE, Texas Instruments TNETD 3000C/P, THS 6002, THS 6012, THS 6022 100 pcs./tray 7 trays/carton EP Core Design Mounting EP 13 shown For smaller sizes down to EP 7,

WSL-A32

Contextual Info: MAGNETICS - XDSL WICKMANN ADSL-Transformer WSL-A32.326 Specifications Application Packaging Generic 100 pcs./tray 7 trays/carton EP Core Design EP 13 shown For smaller sizes down to EP 7, contact WICKMANN Mounting Through-Hole For Surface Mount version, contact WICKMANN

Contextual Info: 3M Fiber Optics • Crimplok and Hot-melt connectors • A broad choice of single- and multimode connectors, couplings and attenuators • A wide choice of terminating kits, modules and splicing systems • Tool and preparation kits, organizer trays and fusion inserts

Contextual Info: I I 71736 NOTES: 1. CARD SLOT ACCEPTS .050±.004/ l.27±0.10 MODULE THICKNESS. (MEASURED OVER P.C. PADS). 2. RECOMMENDED PCB THICKNESS: .062±.007/( l.57±0.18) 3. REFER TO PRODUCT SPEC PS-71243-9999 FOR PERFORMANCE SPECIFICATIONS. 4. PRODUCT IS PACKAGED IN TRAYS.

662 marking

Abstract: WSL-A32
Contextual Info: MAGNETICS - XDSL WICKMANN ADSL-Transformer WSL-A32.330 Specifications Application Packaging ALCATEL MTK 20140 Chipset 100 pcs./tray 7 trays/carton EP Core Design EP 13 shown For smaller sizes down to EP 7, contact WICKMANN Mounting Surface Mount For Through-Hole version,

Contextual Info: ZL40216 Precision 1:6 LVDS Fanout Buffer Data Sheet April 2014 Ordering Information Features ZL40216LDG1 ZL40216LDF1 Inputs/Outputs • Six precision LVDS outputs • Operating frequency up to 750 MHz Trays Tape and Reel Matte Tin Accepts differential or single-ended input

8964300400000000

Contextual Info: Product Number: 896-43-004-00-000000 Description: USB Socket Type A Single Row Surface Mount Plating Code: 43 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel Inner Contact Plating: 30 µ" Gold over 50 µ" Nickel Packaging: Packaged in Trays #

"Humidity Sensor"

Abstract: W378 humidity sensor h227 carton box types of sensor D208 HSI humidity sensor
Contextual Info: Impedance Type Humidity Sensor HSI Series Packaging HSI-XX-XXF Series 100 pcs of sensor to be packed in a bag, 50 bags were packed in a shipping carton box W378*D208*H227 . Carton Dimension unit:mm HSI-XX-XXN Series 140 pcs of sensor were lay in a tray, 5 trays packed in a bag, and 10 bags were

MIL-DTL-83513/28 Thru /33 Micro-D CBS

Contextual Info: Micro-D MIL-DTL-83513 MIL-DTL-83513/28 Thru /33 Micro-D CBS Condensed Straight PCB Terminated Connectors A Space-Saving — These connectors take up less room on the PC board. PC tail spacing is .075 inch 1.9mm between rows. B Threaded Inserts — Stainless steel inserts are insert molded into plastic trays.

GR-253-CORE

Abstract: ZL30119 ZL30119GGG ZL30119GGG2 "network interface cards"
Contextual Info: ZL30119 SONET/SDH Low Jitter Line Card Synchronizer Data Sheet December 2005 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30119GGG 100 Pin CABGA Trays ZL30119GGG2 100 Pin CABGA*

DS1250P

Abstract: DS1386P DS1486P DS1643P DS1644P
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: February 8, 1999 Subject: PRODUCT CHANGE NOTICE - B91001 Description: New Trays for Powercap Base Modules

ZL30123

Abstract: GR-253-CORE STM-16 ZL30123GGG ZL30123GGG2 "network interface cards"
Contextual Info: ZL30123 SONET/SDH Low Jitter Line Card Synchronizer Data Sheet May 2006 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30123GGG 100 Pin CABGA Trays ZL30123GGG2 100 Pin CABGA*

Kostat tray

Abstract: Kostat PEAK TRAY QFP Shipping Trays KS-8201 Shipping Trays KS-8205 KS-8202 ks 870163 8201
Contextual Info: CUSTOMER ADVISORY ALTERNATE QFP SHIPPING TRAYS Altera is adding KOSTAT as an alternate supplier for existing PEAK QFP shipping trays. The new KOSTAT tray dimensions are comparable to the existing PEAK trays. Altera has evaluated and approved the new KOSTAT trays for mechanical integrity by

Contextual Info: Product Number: 896-46-009-90-300000 Description: USB Socket Type A USB 3.0 Single Row Through Hole Plating Code: 46 Shell Plating: Tin Plated Inner Contact Plating: Gold Flash over Pd-Ni Packaging: Packaged in Trays # Of Pins Qty. per Tray Mill-Max

Contextual Info: Product Number: 897-46-009-90-300000 Description: USB Socket Type B USB 3.0 Single Row Through Hole Plating Code: 46 Shell Plating: Tin Plated Inner Contact Plating: Gold Flash over Pd-Ni Packaging: Packaged in Trays # Of Pins Qty. per Tray Mill-Max

Contextual Info: REVISION HISTORY Ky NOTES! U N LESS OTHERWISE SPECIFIED 1. TRAYS MUST MEET ALL REQUIREMENTS OF AMKOR/ANAM § 01 -04-31 - 2 2 B 3 PROCUREMENT SPE C FOR SHIPPING TRAY. 2. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY 3. TOTAL USABLE CELL COUNT IS 490. 4. TRAY VACUUM PICKUP METHOD REQUIRES A 28XZ8m m

Contextual Info: ASP-135029-01 REVISION NOTES: 1.35 POSITIONS NOT AVAILABLE AS STANDARD. 2. REPRESENTS A CRITICAL DIMENSION. 3. MAXIMUM BURR ALLOWANCE: .038 [.0015]. 4. MINIMUM PUSHOUT FORCE: 2.22N [.5LB]. 5. PARTS TO BE PACKAGED IN TRAYS. 35.50 [1.398] REF 35 POS x .800 [.0315] + 7.50 [.300])

Contextual Info: ASP-134604-01 REVISION | gp 11/7/2007 rskeesT ECN-82844 RELEASE FOR PRODUCTION. NOTES: 1. VITA 57 CONNECTOR. 2. FILL ROWS 03, 04, 07 & -08 ONLY. 3. REPRESENTS A CRITICAL DIMENSION. 4. MINIMUM PUSHOUT FORCE: .75 LB. 5. PARTS TO BE PACKAGED IN TRAYS. B | EM I

12B-0608-F19

Abstract: DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A
Contextual Info: ‹ Chapter 5 Trays Very Very Thin Small Outline No Lead Package: WNF 008 322.6 2.54 R. 4 PLACES * 315.0 VACCUM PICKUP CELLS 14 PLACES Y (12 CENTER CELLS, 2 SIDE CELLS) CLOSED CELLS 2 PLACES 6.35 SEE DETAIL "D" X BUMPS 12 PLACES * 7.62 Z SEE DETAIL "E" X

transistors handbook

Contextual Info: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: LAC 064, LSC 080 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 15 Aug 2007 5-57 ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: LAC 064, LSC 080