TS0300 Search Results

TS0300W3

Abstract: MARKING CODE KIT 10DB DC-18GHZ MIL-R-55342 08-E0412
Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: DESCRIPTION: ASSEMBLY DWG: 1.0 TS0300W3 KIT CHIP ATTENUATOR KIT 0 THRU 10DB IN 1DB INCREMENTS, 5 PIECES EACH. N/A SPECIFICATIONS 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ

D2E2

Abstract: Signal Integrity TS03001D007
Contextual Info: Metral 4000 Technical Sheet No. TS03001D007 V1.1 Metral 4000 Signal integrity performance Metral 4000 Technical sheet TS03001D007 V1.1 Document History Version 1.0 1.1 Date 15-07-02 07-05-03 Modifications Original Document Correction labels crosstalk tables

MIL-STD-454 requirement 9

Abstract: TS0300 DC-18GHZ
Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: TS0300 KIT DESCRIPTION: CHIP ATTENUATOR KIT ASSEMBLY DWG: N/A 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ 1.1.3 ATTENUATION VALUES AVAILABLE: 0-10DB IN 1DB INCREMENTS.

TS0300W3

Contextual Info: TS0300W3 VSWR 2.5 2.4 2.3 2.2 2.1 2 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1 0.05 VSWR 1 25C 2.05 4.05 Frequency (GHz) 6.05 8 Attenuation 5 DB(|S(2,1)|) 25C 4 3 2 1 -1 -2 -3 -4 -5 0.05 2.05 4.05 Frequency (GHz) 6.05 8 S(1,1) 25C Swp Max 8GHz 2. 6 0. 0.8 1.0

Ablestik 84-1LMI

Abstract: gold melting furnace 84-1LMI epoxy adhesive
Contextual Info: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with

Contextual Info: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold w rap­ around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and

4160P

Abstract: 4161p
Contextual Info: NEW PRODUCTS HIGH POWER LOADS The performance of many of our standard, high power loads has been significantly improved. The 5307 and 5657 are now specified for operation through 2 GHz with 1.25:1 VSWR. The 5309 is now specified for operation through 4 GHz with 1.35:1 VSWR. The power

Contextual Info: THIN FILM CHIP ATTENUATORS GENERAL INFORMATION GENERAL SPECIFICATIONS: The TS03XX and TS05XX chip attenuators consist of a thin film element on an alumina ceramic substrate with solderable terminals in two sizes. The larger TS03XX Series operates to 12.4 GHz and the

Contextual Info: .100" x .075" Com pact Header 502XX Series Right Angle • • • • • • • Low profile Consumes less vertical space Economy in system layouts Uses standard . 1" x . 1" pc board hole pattern No change in current design Retro-fit with no print changes

Contextual Info: .100" x .075" Compact Header Right Angle 502XX Series • • • • • • • Low profile Consumes less vertical space Economy in system layouts Uses standard . 1" x . 1" pc board hole pattern No change in current design Retro-fit with no print changes

Contextual Info: A pplication N ote 004 Wrapped Chip D evice M ounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back m etallization and platinum gold input / output terminations.

tva0300n07

Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
Contextual Info: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,

d8693

Abstract: RYT Circulators amf-3d-008019.1 miteq amf-3f x-band waveguide isolators ps223 TS0303W3 JSD00114 H-BEND
Contextual Info: AST Lagerliste 2010 solange r u n f u a Verk icht! Vorrat re Hohlleiter- und Koaxialbauteile, vom Diplexer bis zu Leistungsverstärker, passive Bauteile wie z.B. Leistungswiderständen oder Dämpfungsglieder, und Kabel bis zu 65 GHz werden mit weit über 50% Preisnachlass angeboten.

TS0300

Abstract: H20E TS0500 84-1LMI MIL-F-14256 TS050
Contextual Info: Application Note 005 Chip Device Mounting Instructions Page 1 of 4 Application Note #005 Chip Device Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used

TS-2203

Contextual Info: 3M Compact Header .100″ x .075″ Right Angle 502 Series Low profile Consumes less vertical space Economy in system layouts Uses standard 2.54 [.1 ] × 2.54 [.1 ] pc board hole pattern • Retro-fit without print changes • Mates with 501 Series wiremount socket

84-1LMI epoxy adhesive

Abstract: TS0300W3 TS0500W3
Contextual Info: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap­ around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and

Contextual Info: .100" X .075" Compact Header Right Angle 502 Series • • • • Low profile Consumes less vertical space Economy in system layouts Uses standard .1" x .1" pc board hole pattern • No change in current design • Retro-fit with no print changes • Mates with wiremont socket on page 108

ECF564A

Contextual Info: Technology A pplication Notes Chip Device Mounting Instructions A pplication N o te 003 Chip D evice Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations - either platinum gold, gold, or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used

ina 124

Abstract: CT2525ALN "beryllium oxide" HR0500 ct2335 SMT3725ALN SC0066M
Contextual Info: SES 1 Index Tedmolo^ii L Product Index EM C P art Num ber Description Pow er Level W Substrate M aterial M ax VSWR M ax Frequency (G Hz) Page N um ber TVA Series Thermopads 2 Alum ina 1.30:1 6 GHz 12 M TVAXXXXN XX Thermopads 0.2 A lum ina 1.30:1 18 GHz

TS05XXW3

Abstract: TS0500 marking code wb1 TS05XX ts0506 TS0507 EMC TS-050
Contextual Info: ATTENUATORS THIN FILM CHIP ATTENUATORS GENERAL INFORMATION GENERAL SPECIFICATIONS: The TS03XX and TS05XX chip attenuators consist of a thin film Impedance: 50 Q element on an alumina ceramic substrate with solderable terminals Operating Temperature: -55°C to +150°C

Contextual Info: APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with

Contextual Info: .100" X .075" Compact Header Right Angle 502 Series IMPORTANT NOTICE TO PURCHASER ALL STATEMENTS, TECHNICAL INFORMATION AND RECOMMENDATIONS CONTAINED HEREIN ARE BASED ON TESTS WE BELIEVE TO BE RELIABLE, BUT THE ACCURACY OR COMPLETENESS THEREOF IS NOT GUARANTEED, AND

TS-2203

Contextual Info: 3M Compact Header .100″ x .075″ Right Angle 502 Series • • • • Low profile Consumes less vertical space Economy in system layouts Uses standard 2.54 [.1 ] × 2.54 [.1 ] pc board hole pattern • Retro-fit without print changes • Mates with 501 Series wiremount socket

84-1LM

Abstract: ECF564A
Contextual Info: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are com m only used in RF and microwave applications. Some of these chips are offered with