TSOP PACKAGE TRAY Search Results

SIGNETICS

Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches

TSOP 48 thermal resistance

Abstract: TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 1 Signetics Thin Small Outline Package Type1 Cross Section View of TSOP Type 1 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type1 packages are available in 32 - 48 lead counts with 0.50mm lead

TSOP 48 thermal resistance

Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
Contextual Info: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate

TSOP package tray

Abstract: JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1
Contextual Info: TRAY CONTAINER 119.9 HEAT PROOF 7 135° CMAX PPE A' 8.15 10.90 8.00 A NEC TSOP 1 8x13.4 12×18=216 17.20 11.30 13.74 292.4 315.0 (322.6) SECTION A – A' 13.74 5.62 (6.35) 10.00 7.62 135.9 UNIT : mm Applied Package 28-pin Plastic TSOP (I) (8×13.4) 32-pin Plastic TSOP (I) (8×13.4)

TSOP package tray

Abstract: JEDEC TRAY DIMENSIONS 10936 TSOP TRAY
Contextual Info: HEAT PROOF 7 A' 12 13.67 135°C MAX. PPE 135.9 13.27 A NEC TSOP 2 400MIL21 9x13=117 109.36 UNIT : mm 21.1 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.1 5.62 (6.35) 7.62 18.0 Applied Package Quantity (pcs) 32-pin Plastic TSOP(II)(400mil) 50-pin Plastic TSOP(II)(400mil)

JEDEC tray standard

Abstract: JEDEC TRAY DIMENSIONS JEDEC tray standard tsop TRAY TSOP TSOP package tray H6115 TSOP TRAY TRAY DIMENSIONS SSD-A-H6115-2
Contextual Info: TRAY CONTAINER HEAT PROOF A' 12.00 7 135°C MAX. PPE 109.36 13.67 13.27 A NEC TSOP 2 400MIL21 9x13=117 21.10 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.10 5.62 (6.35) 18.00 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 32-pin Plastic TSOP (II)

TSOP package tray

Abstract: TRAY DIMENSIONS TSOP 62 Package TSOP TRAY tray tsop 1220 JEDEC tray standard tsop
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF 7 12.20 18.80 A' 20.42 14.56 285.88 315.0 322.6 SECTION A-A' 18.80 5.62 (6.35) 15.00 7.62 135.9 PPE NEC 135°C MAX 13.67 13.27 TSOP(2)400MIL18 109.36 9x15=135 A Applied Package Quantity (pcs) 28-pin Plastic TSOP (II)

TSOP 86 Package

Abstract: TSOP 54 tray TSOP package tray TSOP 54 Package TSOP 54 PIN TSOP 66 Package JEDEC tray standard tsop TSOP II 54 Package tsop 66 tsop package
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. A' 11.8 14.00 12.00 TSOP 2 400MIL22 135.9 9¥12=108 A 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 7.62 (6.35) 21.80 16.50 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)

TSOP package tray

Abstract: 300mil JEDEC TRAY DIMENSIONS tsop 1230
Contextual Info: UNIT : mm HEAT PROOF 111.3 7 PPE NEC 135°C MAX 11.13 12.30 TSOP 2 300MIL17 135.9 11x16=176 A A' 9.2 16.4 19.14 13.95 287.1 315.0 (322.6) SECTION A-A' 16.4 (6.35) 7.62 12.0 5.62 Applied Package Quantity (pcs) 26-pin Plastic TSOP(II)(300mil) MAX. 176 Tray

TSOP 48 package tray

Abstract: 48-pin TSOP package tray tsop 48 PIN tray TSOP package tray TSOP I JEDEC TRAY DIMENSIONS TRAY TSOP
Contextual Info: 150° MAX. 14.90 A 8x12=96 15.80 104.3 TSOP I 12.0×20.0mm A' 12.3 20.3 25.50 17.25 280.5 315.0 322.6 SECTION A – A' 5.62 (6.35) 20.3 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 48-pin Plastic TSOP (I) (12×20) MAX. 96 Tray Material Heat Proof Temp.

TSOP 48 package tray

Abstract: 48-pin TSOP package tray tsop 48 PIN tray JEDEC tray standard TSOP package tray tsop TRAY TSOP TRAY 40 PIN
Contextual Info: TRAY CONTAINER UNIT : mm 8x13=104 NEC 7 135°C MAX. 14.90 15.80 A' 23.50 12.10 104.3 TSOP 1 12×18 135.9 PPE A 18.40 282.0 315.0 (322.6) 16.50 SECTION A – A' 5.62 (6.35) 7.62 18.40 Applied Package Quantity (pcs) 48-pin Plastic TSOP (I) (12 × 18) MAX. 104

Contextual Info: 1C 197 SERIES TSOP 0.5rwn pitch •O u tlin e Dimensions CD FEATURES • SMT type sockets for TSOP Type-1 mounting. • Require no jigs for IC removal. • Mounting in IC identical foot patterns. • Low profile design with package height 2.45 to 2.50mm.

TSOP package tray

Contextual Info: TRAY CONTAINER Unit : mm 335±1.0 15.5±0.5 304±0.5 PP A' A 14 137.5±0.5 11.2 NEC LA-2542B-1 HEAT PROOF SECTION A − A' 11.2 8.2 5.8 6.2 8.8 180±1.0 21.25±0.5 27.5±0.1 16±0.1 Applied Package 28-pin plastic TSOP I (8x13.4) 32-pin plastic TSOP (I) (8×13.4)

TSOP package tray

Abstract: 50-pin TRAY TSOP JEDEC TRAY DIMENSIONS DSAE00696 913117
Contextual Info: 7 PPE NEC 135°C MAX. A A' 20.65 22.96 19.74 11.8 109.36 13.67 13.27 TSOP 2 400MIL21 135.9 9x13=117 HEAT PROOF UNIT : mm 275.52 315.0 (322.6) SECTION A – A' 20.65 5.62 7.62 (6.35) 17 Applied Package Quantity (pcs) 50-pin Plastic TSOP(II)(400mil) MAX. 117

TSOP 86 Package

Abstract: TSOP 54 tray TSOP 54 Package TSOP 66 Package TSOP II 54 Package TSOP 62 Package JEDEC tray standard tsop TSOP package tray
Contextual Info: UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. 14.00 12.00 TSOP 2 400MIL22 135.9 9x12=108 A A' 11.8 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 (6.35) 7.62 21.8 16.5 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)(400mil)

TSOP 62 Package

Abstract: TSOP-II 44 TSOP package tray
Contextual Info: UNIT : mm 335±1.0 23.5±0.5 288±0.5 27.5±0.1 PP 137.5±0.5 A A' 13.1 180±1.0 21.25±0.5 32±0.1 NEC LA–2541B–1 HEAT PROOF 24.3 SECTION A – A' 24.3 6.2 5.8 8.8 21.3 Applied Package 28-pin Plastic TSOP II (400mil) 44-pin Plastic TSOP (II)(400mil)

Contextual Info: Unit : mm 335±1.0 15.5±0.5 304±0.5 PP A' A 14 137.5±0.5 11.2 NEC LA-2542B-1 HEAT PROOF SECTION A − A' 11.2 8.2 5.8 6.2 8.8 180±1.0 21.25±0.5 27.5±0.1 16±0.1 Applied Package 28-pin plastic TSOP I (8x13.4) 32-pin plastic TSOP (I) (8×13.4) Quantity (pcs)

Contextual Info:  LY62L12916 128K X 16 BIT LOW POWER CMOS SRAM Rev. 0.5 REVISION HISTORY Revision Rev. 0.1 Rev. 0.2 Rev. 0.3 Rev. 0.4 Rev. 0.5 Description Initial Issue Revised Package Outline Dimension TSOP-II Revised FEATURES & ORDERING INFORMATION Lead free and green package available to Green package

Contextual Info: LY62L12916 128K X 16 BIT LOW POWER CMOS SRAM Rev. 1.0 REVISION HISTORY Revision Rev. 0.1 Rev. 0.2 Rev. 0.3 Rev. 0.4 Rev. 0.5 Rev. 0.6 Rev. 1.0 Description Initial Issue Revised Package Outline Dimension TSOP-II Revised FEATURES & ORDERING INFORMATION Lead free and green package available to Green package

intel standard marking

Contextual Info: OFF-BOARD PROGRAMMING EQUIPMENT AUTOMATED DATA I/O ProMaster 970 • ■ ■ ■ Programs, sorts, and marks up to 110 devices per hour Supports memory, microcontroller, and logic devices Package support: µBGA*, SOP, SSOP, TSOP and others Media supported: tube, tray, and

JEDEC TRAY DIMENSIONS

Abstract: JEDEC tray standard tsop Shipping Trays tsop-ii tray RAMTRON T944
Contextual Info: TRAY SPECIFICATIONS 44-pin TSOP-II Package Tray Critical Dimensions A B NOTES: 1. Surface electric resistivity of tray ranges from: 1E+5 to 1E+12 Ohm/sq. 2. The molded tray’s material shall be rigid enough to avoid damage to the components during handling, loading,

tsop Shipping Trays

Contextual Info: Section 4 Thin Sm all O utline P a c k a g e T H IN SMALL O U TLIN E PACKAGE TSO P DES C R IP TIO N AMD presents the Thin Small Outline Package. The TSOP is the industry’s leading edge plastic, surface mountable memory package today. System requirements for higher den­

JEDEC TRAY DIMENSIONS

Abstract: JEDEC tray standard JEDEC tray standard 13 tsop Shipping Trays 32 jedec tray Shipping Trays jedec tray 32 0925D
Contextual Info: TRAY SPECIFICATIONS 32-pin TSOP-I Package Tray Critical Dimensions TEMP. RATING A B NOTES: 1. Surface electric resistivity of tray ranges from: < 1E+7 Ohm/sq. 2. The molded tray’s material shall be rigid enough to avoid damage to the components during handling, loading,

Unmanned Solutions

Contextual Info: OFF-BOARD PROGRAMMING EQUIPMENT AUTOMATED UNMANNED SOLUTIONS AH 500 • ■ ■ ■ ■ No more bent leads Program Intel Flash memory and other programmable devices in 3256 TSOP and other package standards User-friendly interface Programmer options: System